{"id":5797,"date":"2026-11-03T08:30:44","date_gmt":"2026-11-03T08:30:44","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=5797"},"modified":"2026-11-03T08:30:44","modified_gmt":"2026-11-03T08:30:44","slug":"taconic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/ar\/pcb-manufacturer\/taconic-pcb\/","title":{"rendered":"Taconic PCB"},"content":{"rendered":"
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\u0627\u0644\u0635\u0641\u062d\u0629 \u0627\u0644\u0631\u0626\u064a\u0633\u064a\u0629<\/a> \/ PCB Manufacturing<\/a> \/ Taconic PCB<\/div>

RF LAMINATES. MANUFACTURED CIRCUITS.<\/p>

Taconic PCB\u0627\u0644\u062a\u0635\u0646\u064a\u0639<\/h1><\/div>

Low-loss materials, shaped into working RF boards.<\/p>

FLJ manufactures Taconic PCBs for antenna networks, microwave circuits and RF modules. Double-sided boards, multilayer builds and compatible hybrid constructions bring the selected laminate, copper geometry and plated connections into one finished circuit board.<\/p>

Get a Taconic PCB Quote<\/a>Compare material options<\/a><\/div><\/div><\/div>

Double-sided RF boards<\/h2>

Etched RF circuits, reference copper and plated connections on the selected laminate core.<\/p><\/article>

Multilayer Taconic boards<\/h2>

RF layers joined with compatible bonding materials for integrated circuits and interconnects.<\/p><\/article>

RF \/ FR-4 hybrid boards<\/h2>

Specialty laminate on RF-critical layers, combined with supporting control or power circuitry.<\/p><\/article><\/div><\/div><\/section>\n

MATERIAL FAMILIES & GRADE OPTIONS<\/p>

Choose the constructionbehind the circuit<\/h2><\/div>

The Taconic material line is part of AGC Multi Material. Its woven-glass PTFE and filled, reinforced laminates offer different dielectric and mechanical constructions. The grade, thickness and copper cladding define the starting material for fabrication.<\/p><\/div>

Selected material directions for Taconic PCB fabrication<\/caption>
Material direction<\/th>Examples<\/th>What it brings to the board<\/th><\/tr><\/thead>
Light woven-glass PTFE<\/th>TLY-5<\/a><\/td>A low-Dk construction with light glass reinforcement for antenna and microwave circuits.<\/td><\/tr>
Woven-glass PTFE<\/th>TLX family \/ TLX-8<\/a><\/td>Another reinforced PTFE option for RF circuits, with its own dielectric and thickness choices.<\/td><\/tr>
Filled, reinforced RF laminate<\/th>TSM-DS3b<\/a><\/td>Dimensional and thermal characteristics suited to complex multilayer RF constructions.<\/td><\/tr>
Thermally conductive RF material<\/th>RF-35HTC<\/a><\/td>A material option when heat transfer through the dielectric is part of the RF board requirement.<\/td><\/tr><\/tbody><\/table><\/div>

Links lead to current AGC product information. Available dielectric thickness, foil and bonding combinations are confirmed for the quoted construction.<\/p>

TLY-5 \u00b7 WOVEN-GLASS PTFE<\/span>

Low dielectric constant,with a reinforced structure<\/h3>

Light glass reinforcement supports the PTFE dielectric during fabrication. For the circuit, the selected construction provides the electrical properties; for production, its handling and dimensional response remain part of the manufacturing route.<\/p>

2.20 \u00b1 0.02<\/b>Dk at 10 GHz<\/span>0.0009<\/b>Df at 10 GHz<\/span><\/div>TLY-5 official datasheet \u00b7 PDF<\/a><\/article>
TSM-DS3b \u00b7 FILLED, REINFORCED<\/span>

A core for integratedmultilayer RF circuits<\/h3>

A ceramic-filled construction with low glass content provides another balance of dielectric behavior and dimensional stability. Compatible bonding materials join these cores into a multilayer board, including constructions that use fastRise prepregs.<\/p>

3.00 \u00b1 0.04<\/b>Dk at 10 GHz<\/span>0.0014<\/b>Df at 10 GHz<\/span><\/div>TSM-DS3b official datasheet \u00b7 PDF<\/a><\/article><\/div>

Published typical material properties, not finished-board insertion loss. TLY-5 lists IPC-650 2.5.5.5; TSM-DS3b lists modified 2.5.5.5.1. The measurements share a frequency, but not an identical test method.<\/p><\/div><\/section>\n

TACONIC PCB FABRICATION<\/p>

Preserve the material.Build the circuit.<\/h2>

PTFE-based laminates combine useful electrical properties with a different mechanical and surface response from conventional epoxy\/glass. FLJ carries those differences through patterning, drilling, bonding and board completion.<\/p><\/div>

01 \/ CIRCUIT PATTERN<\/span>

Keep the geometry through processing<\/h3><\/div>

Panels are supported and handled to limit bending, stretching and surface damage. Copper preparation uses a route suited to the laminate rather than aggressive brushing of a soft dielectric. Imaging and etching form the traces, pads and reference copper.<\/p>

The laminate can move as copper is removed. Manufacturing artwork is scaled to allow for that dimensional response. The adjustment is established for the core construction and copper pattern so that pads and clearances reach their intended positions after processing, ready to align with later layers and drilled holes. Inner-layer optical inspection checks the circuits before they are enclosed. On an etched PTFE surface, the remaining copper-foil imprint also contributes to bonding; preserving that texture avoids turning a cleaning step into an adhesion problem.<\/p><\/div><\/div>

\"PCB
Drilling equipment reference \u00b7 FLJ media library.<\/figcaption><\/figure>
02 \/ DRILLED & PLATED CONNECTIONS<\/span>

The hole wall becomesan electrical interface<\/h3>

Tool condition, entry and backing support, cutting heat and chip removal affect the bore. Reinforcing fibers must be cut cleanly while the PTFE resin is kept from smearing across the copper surfaces that later form internal connections.<\/p>

Hole preparation acts on the materials exposed in the bore. In an applicable TSM-DS3-family \/ fastRise build, thermoset-resin desmear comes before the PTFE activation step. Removing bonding-resin residue and preparing PTFE for adhesion are different jobs; one treatment is not assumed to accomplish both. A conductive starting layer then supports electroplating of the wall and its contacts with internal copper.<\/p><\/div><\/div>

03 \/ BONDED MULTILAYER CONSTRUCTION<\/span>

Join the RF layerswith the right bonding system<\/h3>

Patterned Taconic cores, selected bonding plies and outer copper are registered in the lay-up. Bonding material fills around the copper pattern and joins the stack through its specified thermal cycle.<\/p>

Pressure, resin flow and cure work together. Copper distribution and the space around conductors affect the amount of resin needed; simply adding pressure does not resolve every filling or adhesion problem.<\/p>

A hybrid board combines the RF laminate with a compatible supporting material. Its bonding layer and finished dielectric spacing are part of the complete construction, alongside the RF core and the plated connections through it.<\/p><\/div>