{"id":2364,"date":"2025-09-02T08:30:07","date_gmt":"2025-09-02T08:30:07","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=2364"},"modified":"2025-09-25T06:49:30","modified_gmt":"2025-09-25T06:49:30","slug":"ceramic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/cs\/pcb-manufacturer\/ceramic-pcb\/","title":{"rendered":"Keramick\u00e9 PCB: materi\u00e1ly, tepeln\u00fd n\u00e1vrh a aplikace"},"content":{"rendered":"
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Keramick\u00fd substr\u00e1t je speci\u00e1ln\u00ed typ desky vyroben\u00fd p\u0159\u00edm\u00fdm lepen\u00edm m\u011bd\u011bn\u00e9 f\u00f3lie na povrch oxidu nebo keramick\u00e9ho plechu p\u0159i vysok\u00e9 teplot\u011b. M\u011b\u010f je spojena s keramikou procesem p\u0159i vysok\u00e9 teplot\u011b, tak\u017ee kov a keramika tvo\u0159\u00ed stabiln\u00ed z\u00e1kladnu pro obvody.<\/div>\n
 <\/div>\n
\"ceramic<\/div>\n
 <\/div>\n

Vlastnosti keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f<\/h2>\n

Mechanick\u00e9 vlastnosti (jak jsou tvo\u0159eny stopy obvodu)<\/h3>\n
a. Maj\u00ed vysokou mechanickou pevnost. Mohou dr\u017eet d\u00edly a slou\u017eit tak\u00e9 jako podp\u016frn\u00e9 konstrukce.
b. Snadno se obr\u00e1b\u011bj\u00ed. Zachov\u00e1vaj\u00ed p\u0159esn\u00e9 rozm\u011bry. Lze je vyrobit v mnoha vrstv\u00e1ch.
c. Jejich povrch je hladk\u00fd. Nedeformuj\u00ed se, neproh\u00fdbaj\u00ed a nevykazuj\u00ed drobn\u00e9 praskliny.<\/div>\n

Elektrick\u00e9 vlastnosti<\/h3>\n
a. Maj\u00ed vysok\u00fd izola\u010dn\u00ed odpor a vysok\u00e9 pr\u016frazn\u00e9 nap\u011bt\u00ed. D\u00edky tomu jsou obvody bezpe\u010dn\u00e9 p\u0159ed zkratem a p\u0159ed po\u0161kozen\u00edm vysok\u00fdm nap\u011bt\u00edm.
b. Maj\u00ed n\u00edzkou dielektrickou konstantu a n\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty. To pom\u00e1h\u00e1 sign\u00e1l\u016fm proch\u00e1zet s men\u0161\u00edmi ztr\u00e1tami.
c. Jejich v\u00fdkon z\u016fst\u00e1v\u00e1 stabiln\u00ed p\u0159i vysok\u00e9 teplot\u011b a vlhkosti. To pom\u00e1h\u00e1 zajistit spolehlivost v n\u00e1ro\u010dn\u00fdch podm\u00ednk\u00e1ch pou\u017e\u00edv\u00e1n\u00ed.<\/div>\n

Tepeln\u00e9 vlastnosti<\/h3>\n
a. Maj\u00ed vysokou tepelnou vodivost. To pom\u00e1h\u00e1 odv\u00e1d\u011bt teplo od hork\u00fdch \u010d\u00e1st\u00ed.
b. Jejich koeficient tepeln\u00e9 rozta\u017enosti m\u016f\u017ee odpov\u00eddat p\u0159\u00edbuzn\u00fdm materi\u00e1l\u016fm, zejm\u00e9na k\u0159em\u00edku. Tato shoda sni\u017euje nap\u011bt\u00ed p\u0159i zah\u0159\u00edv\u00e1n\u00ed a ochlazov\u00e1n\u00ed sou\u010d\u00e1st\u00ed.
c. Maj\u00ed dobrou tepelnou odolnost. Z\u016fst\u00e1vaj\u00ed stabiln\u00ed p\u0159i vysok\u00fdch teplot\u00e1ch.<\/div>\n

Ostatn\u00ed vlastnosti<\/h3>\n
a. Jsou chemicky stabiln\u00ed. Snadno se metalizuj\u00ed. Obvodov\u00e9 vzory na nich dob\u0159e dr\u017e\u00ed.
b. Nepohlcuj\u00ed vlhkost. Odol\u00e1vaj\u00ed olej\u016fm a chemick\u00fdm l\u00e1tk\u00e1m. Uvol\u0148uj\u00ed m\u00e1lo z\u00e1\u0159en\u00ed.
c. Pou\u017eit\u00e9 materi\u00e1ly jsou ne\u0161kodn\u00e9 a nejsou toxick\u00e9. Jejich krystalov\u00e1 struktura se v rozsahu pracovn\u00edch teplot nem\u011bn\u00ed.
d. Surovin je dostatek. Technologie je vysp\u011bl\u00e1. Snadno se vyr\u00e1b\u011bj\u00ed a jejich cena je n\u00edzk\u00e1.<\/div>\n

Metody v\u00fdroby keramick\u00fdch substr\u00e1t\u016f<\/h2>\n
P\u0159ed vyp\u00e1len\u00edm keramiky existuj\u00ed \u010dty\u0159i b\u011b\u017en\u00e9 metody tvarov\u00e1n\u00ed. Jedn\u00e1 se o lisov\u00e1n\u00ed pr\u00e1\u0161ku (m\u016f\u017ee se jednat o lisov\u00e1n\u00ed do formy nebo izostatick\u00e9 lisov\u00e1n\u00ed), vytla\u010dov\u00e1n\u00ed, lit\u00ed do p\u00e1sky a vst\u0159ikov\u00e1n\u00ed. Z t\u011bchto zp\u016fsob\u016f se v posledn\u00edch letech \u010dast\u011bji pou\u017e\u00edv\u00e1 odl\u00e9v\u00e1n\u00ed p\u00e1sky pro obaly LSI a substr\u00e1ty hybridn\u00edch obvod\u016f, proto\u017ee je snaz\u0161\u00ed vyrobit mnoho vrstev a m\u00e1 vy\u0161\u0161\u00ed efektivitu v\u00fdroby.<\/div>\n
B\u011b\u017en\u00e9 procesn\u00ed cesty jsou tyto t\u0159i:<\/div>\n
    \n
  1. Skl\u00e1d\u00e1n\u00ed vrstev - lisov\u00e1n\u00ed za tepla - odstran\u011bn\u00ed pojiva - vyp\u00e1len\u00ed z\u00e1kladn\u00ed desky - vytvo\u0159en\u00ed vzor\u016f obvod\u016f - vyp\u00e1len\u00ed obvodu.<\/li>\n
  2. Skl\u00e1d\u00e1n\u00ed vrstev - tisk vzoru obvodu na povrch - lisov\u00e1n\u00ed za tepla - odstran\u011bn\u00ed pojiva - spoluspalov\u00e1n\u00ed.<\/li>\n
  3. Tisk obvodov\u00e9ho vzoru - stohov\u00e1n\u00ed - lisov\u00e1n\u00ed za tepla - odstran\u011bn\u00ed pojiva - spoluspalov\u00e1n\u00ed.<\/li>\n<\/ol>\n

    Metalizace keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f<\/h2>\n

    a. Metoda tlust\u00e9 vrstvy:<\/h3>\n
    P\u0159i tlustovrstv\u00e9 metod\u011b se vodi\u010de (obvodov\u00e9 stopy) a rezistory vytv\u00e1\u0159ej\u00ed na keramice s\u00edtotiskem. Po tisku se d\u00edly slinuj\u00ed, aby se vytvo\u0159il obvod a kontaktn\u00ed plo\u0161ky. K fixaci ti\u0161t\u011bn\u00e9ho kovu se pou\u017e\u00edvaj\u00ed pojiva typu sklo, oxid a sm\u00ed\u0161en\u00e9 sklo-oxid.<\/div>\n

    b. Metoda tenk\u00e9 vrstvy:<\/h3>\n
    Tenk\u00e9 vrstvy pou\u017e\u00edvaj\u00ed k nan\u00e1\u0161en\u00ed kovu vakuov\u00e9 metody, jako je odpa\u0159ov\u00e1n\u00ed, iontov\u00e9 pokovov\u00e1n\u00ed nebo napra\u0161ov\u00e1n\u00ed. Proto\u017ee tenk\u00e9 vrstvy nan\u00e1\u0161ej\u00ed kov z plynn\u00e9 f\u00e1ze, lze v z\u00e1sad\u011b nan\u00e1\u0161et jak\u00fdkoli kov. T\u00edmto zp\u016fsobem lze v z\u00e1sad\u011b pokovit jak\u00fdkoli substr\u00e1t. Tepeln\u00e1 rozta\u017enost kovov\u00e9 vrstvy a keramick\u00e9ho substr\u00e1tu by se v\u0161ak m\u011bla co nejv\u00edce shodovat. D\u016fle\u017eit\u00e9 je tak\u00e9 zv\u00fd\u0161it p\u0159ilnavost kovov\u00e9 vrstvy ke keramice.<\/div>\n

    c. Metoda spoluspalov\u00e1n\u00ed:<\/h3>\n
    P\u0159ed vyp\u00e1len\u00edm se na nevyp\u00e1len\u00e9 keramick\u00e9 desky s\u00edtotiskem nanesou \u017e\u00e1ruvzdorn\u00e9 kovov\u00e9 pasty z Mo, W a podobn\u00fdch kov\u016f. Pot\u00e9 se hromada odbarv\u00ed a vyp\u00e1l\u00ed, tak\u017ee keramika a kov tvo\u0159\u00ed jednu celistvou strukturu. Tato metoda m\u00e1 tyto vlastnosti:
    \u25a0 Lze na n\u011bm vytv\u00e1\u0159et velmi jemn\u00e9 obvodov\u00e9 \u010d\u00e1ry a je snadn\u00e9 vytv\u00e1\u0159et mnoho vrstev, tak\u017ee je mo\u017en\u00e1 vysok\u00e1 hustota zapojen\u00ed.
    \u25a0 Vzhledem k tomu, \u017ee izol\u00e1tor a vodi\u010d jsou vytvo\u0159eny spole\u010dn\u011b, je mo\u017en\u00e9 hermetick\u00e9 ut\u011bsn\u011bn\u00ed obal\u016f.
    \u25a0 Volbou spr\u00e1vn\u00e9ho slo\u017een\u00ed, tv\u00e1\u0159ec\u00edho tlaku a teploty sp\u00e9k\u00e1n\u00ed lze kontrolovat smr\u0161t\u011bn\u00ed p\u0159i sp\u00e9k\u00e1n\u00ed. Zejm\u00e9na pokud je vyroben substr\u00e1t s nulov\u00fdm smr\u0161t\u011bn\u00edm v rovin\u011b, otev\u00edr\u00e1 se t\u00edm mo\u017enost pou\u017eit\u00ed v BGA, CSP a balen\u00edch s hol\u00fdmi \u010dipy s vysokou hustotou.<\/div>\n

    Typy keramick\u00fdch substr\u00e1t\u016f<\/h2>\n

    Substr\u00e1t z oxidu hlinit\u00e9ho (Al\u2082O\u2083)<\/h3>\n
    a. Suroviny: Al\u2082O\u2083 se \u010dasto vyr\u00e1b\u00ed pomoc\u00ed Postup spole\u010dnosti Bayer<\/a>. P\u0159i t\u00e9to metod\u011b je surovinou bauxit, kter\u00fd obsahuje hydratovan\u00e9 oxidy hlin\u00edku a p\u0159\u00edbuzn\u00e9 slou\u010deniny.
    b. V\u00fdroba: Al\u2082O\u2083 keramika se obvykle vyr\u00e1b\u00ed skl\u00e1d\u00e1n\u00edm nevyp\u00e1len\u00fdch plech\u016f. \u010casto se pou\u017e\u00edv\u00e1 pojivo, nap\u0159\u00edklad polyvinylbutyral (PVB). Teplota v\u00fdpalu se li\u0161\u00ed podle p\u0159idan\u00fdch sp\u00e9kac\u00edch prost\u0159edk\u016f a obvykle \u010din\u00ed 1550-1600 \u00b0C. Metody metalizace Al\u2082O\u2083 jsou p\u0159edev\u0161\u00edm metody tlust\u00e9 vrstvy a soub\u011b\u017en\u00e9ho vypalov\u00e1n\u00ed. Pasty a technologie procesu jsou vysp\u011bl\u00e9. V sou\u010dasn\u00e9 dob\u011b spl\u0148uj\u00ed mnoho aplika\u010dn\u00edch pot\u0159eb.
    c. Aplikace: Substr\u00e1ty pro hybridn\u00ed integrovan\u00e9 obvody, substr\u00e1ty pro bal\u00ed\u010dky LSI a substr\u00e1ty pro v\u00edcevrstv\u00e9 obvody.<\/div>\n
     <\/div>\n
    \"Alumina<\/div>\n
     <\/div>\n

    Mullitov\u00fd substr\u00e1t (3Al\u2082O\u2083-2SiO\u2082)<\/h3>\n
    Mullit je jednou z nejstabiln\u011bj\u0161\u00edch krystalick\u00fdch f\u00e1z\u00ed v syst\u00e9mu Al\u2082O\u2083-SiO\u2082. Ve srovn\u00e1n\u00ed s Al\u2082O\u2083 m\u00e1 mullit o n\u011bco ni\u017e\u0161\u00ed mechanickou pevnost a ni\u017e\u0161\u00ed tepelnou vodivost, ale jeho dielektrick\u00e1 konstanta je ni\u017e\u0161\u00ed. Tato ni\u017e\u0161\u00ed dielektrick\u00e1 konstanta m\u016f\u017ee pomoci zlep\u0161it rychlost sign\u00e1lu. Jeho koeficient tepeln\u00e9 rozta\u017enosti je tak\u00e9 n\u00edzk\u00fd, co\u017e sni\u017euje tepeln\u00e9 nam\u00e1h\u00e1n\u00ed namontovan\u00e9ho LSI. Tak\u00e9 rozd\u00edl v rozta\u017enosti s vodiv\u00fdmi kovy, jako jsou Mo a W, je men\u0161\u00ed, tak\u017ee spoluspalov\u00e1n\u00ed zp\u016fsobuje men\u0161\u00ed nap\u011bt\u00ed mezi kovem a keramikou.<\/div>\n

    Substr\u00e1t z nitridu hlin\u00edku (AlN)<\/h3>\n
    a. Suroviny: AlN nen\u00ed p\u0159\u00edrodn\u00ed miner\u00e1l. Je to um\u011ble vyroben\u00fd materi\u00e1l, kter\u00fd byl poprv\u00e9 syntetizov\u00e1n v 19. stolet\u00ed. Typick\u00e9 pr\u00e1\u0161ky AlN se vyr\u00e1b\u011bj\u00ed reduk\u010dn\u00ed nitridac\u00ed nebo p\u0159\u00edmou nitridac\u00ed. Metoda reduk\u010dn\u00ed nitridace vych\u00e1z\u00ed z Al\u2082O\u2083 a k jeho redukci se pou\u017e\u00edv\u00e1 vysoce \u010dist\u00fd uhl\u00edk, kter\u00fd pak reaguje s dus\u00edkem za vzniku AlN. Metoda p\u0159\u00edm\u00e9 nitridace reaguje pr\u00e1\u0161kov\u00fd Al s N\u2082 za p\u0159\u00edm\u00e9 tvorby AlN.
    b. V\u00fdroba: Pro AlN lze pou\u017e\u00edt stejn\u00e9 metody tv\u00e1\u0159en\u00ed jako pro substr\u00e1ty Al\u2082O\u2083. Nejpou\u017e\u00edvan\u011bj\u0161\u00edm zp\u016fsobem je stohov\u00e1n\u00ed nevyp\u00e1len\u00fdch plech\u016f. K tomu se sm\u00edch\u00e1 pr\u00e1\u0161kov\u00fd AlN, organick\u00e1 pojiva, rozpou\u0161t\u011bdlo a povrchov\u011b aktivn\u00ed l\u00e1tka a vytvo\u0159\u00ed se keramick\u00e1 ka\u0161e. Suspenze se odl\u00e9v\u00e1 do p\u00e1sky, skl\u00e1d\u00e1 se na sebe, lisuje se za tepla, odbed\u0148uje se a pot\u00e9 se vypaluje, \u010d\u00edm\u017e se vytvo\u0159\u00ed substr\u00e1t AlN.
    c. Vlastnosti substr\u00e1tu AlN: AlN m\u00e1 tepelnou vodivost v\u00edce ne\u017e desetkr\u00e1t vy\u0161\u0161\u00ed ne\u017e Al\u2082O\u2083. Jeho koeficient tepeln\u00e9 rozta\u017enosti (CTE) odpov\u00edd\u00e1 k\u0159em\u00edku. Ve srovn\u00e1n\u00ed s Al\u2082O\u2083 m\u00e1 AlN vy\u0161\u0161\u00ed izola\u010dn\u00ed odpor a vy\u0161\u0161\u00ed pr\u016frazn\u00e9 nap\u011bt\u00ed. Jeho dielektrick\u00e1 konstanta je ni\u017e\u0161\u00ed. D\u00edky t\u011bmto vlastnostem je AlN velmi cenn\u00fd pro substr\u00e1ty obal\u016f.
    d. Aplikace: Pou\u017e\u00edv\u00e1 se pro moduly v\u00fdkonov\u00fdch zesilova\u010d\u016f v p\u00e1smu VKV, vysoce v\u00fdkonn\u00e1 za\u0159\u00edzen\u00ed a substr\u00e1ty laserov\u00fdch diod.<\/div>\n
     <\/div>\n
    \"Aluminum<\/div>\n
     <\/div>\n

    substr\u00e1t z karbidu k\u0159em\u00edku (SiC)<\/h3>\n
    a. Suroviny: SiC nen\u00ed p\u0159\u00edrodn\u00ed miner\u00e1l. Vyr\u00e1b\u00ed se sm\u00edch\u00e1n\u00edm oxidu k\u0159emi\u010dit\u00e9ho, koksu a trochy soli ve form\u011b pr\u00e1\u0161ku. Sm\u011bs se zah\u0159\u00edv\u00e1 v grafitov\u00e9 peci p\u0159i teplot\u011b nad 2000 \u00b0C, kde reaguje a vytv\u00e1\u0159\u00ed \u03b1-SiC. Pot\u00e9 lze SiC vy\u010distit sublimac\u00ed a z\u00edskat tmav\u011b zelen\u00fd blok polykrystalick\u00e9ho materi\u00e1lu.
    b. V\u00fdroba: SiC m\u00e1 velmi vysokou chemickou a tepelnou stabilitu, tak\u017ee b\u011b\u017en\u00e9 metody vypalov\u00e1n\u00ed zt\u011b\u017euj\u00ed jeho zhutn\u011bn\u00ed. Jsou zapot\u0159eb\u00ed sp\u00e9kac\u00ed pom\u016fcky a speci\u00e1ln\u00ed metody vypalov\u00e1n\u00ed. B\u011b\u017en\u011b se pou\u017e\u00edv\u00e1 vakuov\u00e9 lisov\u00e1n\u00ed za tepla.
    c. Vlastnosti SiC: Kl\u00ed\u010dovou vlastnost\u00ed je velmi vysok\u00fd koeficient tepeln\u00e9 dif\u00faze. M\u016f\u017ee b\u00fdt dokonce v\u011bt\u0161\u00ed ne\u017e u m\u011bdi. Jeho tepeln\u00e1 rozta\u017enost se bl\u00ed\u017e\u00ed k\u0159em\u00edku. SiC m\u00e1 v\u0161ak i n\u011bkter\u00e9 nev\u00fdhody. Jeho dielektrick\u00e1 konstanta je pom\u011brn\u011b vysok\u00e1 a jeho pr\u016frazn\u00e9 nap\u011bt\u00ed nen\u00ed tak dobr\u00e9 jako u n\u011bkter\u00fdch jin\u00fdch keramik.
    d. Aplikace: SiC substr\u00e1ty se pou\u017e\u00edvaj\u00ed tam, kde je pot\u0159eba vysok\u00e9 \u0161\u00ed\u0159en\u00ed tepla a kde nen\u00ed vysok\u00e9 nap\u011bt\u00ed. Pou\u017e\u00edvaj\u00ed se pro bal\u00ed\u010dky VLSI s chladi\u010dem, vysokorychlostn\u00ed a vysoce integra\u010dn\u00ed logick\u00e9 LSI s chladi\u010di, velk\u00e9 po\u010d\u00edta\u010de a substr\u00e1ty laserov\u00fdch diod pro optickou komunikaci.<\/div>\n

    Beryllia substr\u00e1t (BeO)<\/h3>\n
    Tepeln\u00e1 vodivost BeO je mnohon\u00e1sobn\u011b vy\u0161\u0161\u00ed ne\u017e u Al\u2082O\u2083. Dob\u0159e se hod\u00ed pro obvody s vysok\u00fdm v\u00fdkonem. Jeho dielektrick\u00e1 konstanta je n\u00edzk\u00e1, tak\u017ee je vhodn\u00fd pro vysokofrekven\u010dn\u00ed obvody. Substr\u00e1ty z BeO se obvykle vyr\u00e1b\u011bj\u00ed such\u00fdm lisov\u00e1n\u00edm. Lze je tak\u00e9 vyrobit cestou nep\u00e1len\u00fdch plech\u016f s mal\u00fdmi p\u0159\u00eddavky MgO nebo Al\u2082O\u2083. Vzhledem k tomu, \u017ee pr\u00e1\u0161ek BeO je toxick\u00fd, vyvol\u00e1vaj\u00ed v\u00fdrobky z BeO obavy o \u017eivotn\u00ed prost\u0159ed\u00ed a zdrav\u00ed. V Japonsku nen\u00ed v\u00fdroba substr\u00e1tu BeO povolena a BeO se mus\u00ed dov\u00e1\u017eet nap\u0159\u00edklad ze Spojen\u00fdch st\u00e1t\u016f.<\/div>\n

    Srovn\u00e1n\u00ed n\u011bkter\u00fdch keramick\u00fdch materi\u00e1l\u016f a typ\u016f substr\u00e1t\u016f<\/h2>\n
    Podle struktury a zp\u016fsobu v\u00fdroby lze keramick\u00e9 substr\u00e1ty rozd\u011blit na HTCC, LTCC, TFC, DBC, DPC atd. Keramick\u00e9 substr\u00e1ty se st\u00e1le v\u00edce pou\u017e\u00edvaj\u00ed v elektronick\u00fdch obalech a ve v\u00fdkonov\u00e9 elektronice, jako jsou IGBT (bipol\u00e1rn\u00ed tranzistor s izolovan\u00fdm hradlem), LD (laserov\u00e1 dioda), v\u00fdkonn\u00e9 LED a CPV (fotovoltaick\u00fd koncentr\u00e1tor), proto\u017ee maj\u00ed dobrou tepelnou vodivost, tepelnou odolnost, izolaci, n\u00edzkou tepelnou rozta\u017enost a klesaj\u00edc\u00ed n\u00e1klady.<\/div>\n
    Mezi b\u011b\u017en\u00e9 keramick\u00e9 z\u00e1kladn\u00ed materi\u00e1ly pat\u0159\u00ed BeO, Al\u2082O\u2083, AlN a Si\u2083N\u2084. Z nich m\u00e1 Si\u2083N\u2084 velmi vysokou elektrickou izolaci a chemickou stabilitu. M\u00e1 tak\u00e9 dobrou tepelnou stabilitu a vysokou mechanickou pevnost. Lze jej pou\u017e\u00edt pro desky s plo\u0161n\u00fdmi spoji s vysokou hustotou a integrac\u00ed.<\/div>\n

    Vysokoteplotn\u00ed spoluvypalovan\u00e1 keramick\u00e1 v\u00edcevrstv\u00e1 vrstva (HTCC)<\/h3>\n
    HTCC je vysokoteplotn\u00ed spoluvypalovan\u00fd keramick\u00fd substr\u00e1t. P\u0159i v\u00fdrob\u011b HTCC se nejprve sm\u00edch\u00e1 keramick\u00fd pr\u00e1\u0161ek, jako je Al\u2082O\u2083 nebo AlN, s organick\u00fdm pojivem. Ze sm\u011bsi se vytvo\u0159\u00ed pasta a pot\u00e9 se pomoc\u00ed doktorsk\u00e9ho no\u017ee nebo podobn\u00fdch metod formuje do desek. Z vysu\u0161en\u00fdch pl\u00e1t\u016f se stanou zelen\u00e1 t\u011blesa. Vyvrtaj\u00ed se otvory pro pr\u016fchodky a s\u00edtotiskem se vytisknou vodiv\u00e9 pasty pro zapojen\u00ed a vypln\u011bn\u00ed pr\u016fchodek. Pot\u00e9 se zelen\u00e9 plechy naskl\u00e1daj\u00ed na sebe a vlo\u017e\u00ed do vysokoteplotn\u00ed pece o teplot\u011b kolem 1600 \u00b0C ke sp\u00e9k\u00e1n\u00ed. Vzhledem k vysok\u00e9 teplot\u011b sp\u00e9k\u00e1n\u00ed je v\u00fdb\u011br kov\u016f pro vodi\u010de omezen\u00fd. Pou\u017e\u00edvaj\u00ed se kovy s vysokou teplotou t\u00e1n\u00ed, ale ni\u017e\u0161\u00ed vodivost\u00ed, jako je wolfram, molybden a mangan. N\u00e1klady jsou vysok\u00e9 a tepeln\u00e1 vodivost se pohybuje zhruba v rozmez\u00ed 20-200 W\/(m-\u00b0C).<\/div>\n

    N\u00edzkoteplotn\u00ed spoluvypalovan\u00e9 keramick\u00e9 PCB (LTCC)<\/h3>\n
    LTCC je n\u00edzkoteplotn\u00ed spoluvypalovan\u00e1 keramika. Jej\u00ed v\u00fdroba prob\u00edh\u00e1 podobn\u011b jako u HTCC. Rozd\u00edl je v tom, \u017ee pr\u00e1\u0161ek Al\u2082O\u2083 obsahuje 30-50% hmotnostn\u00edch skel s n\u00edzkou teplotou t\u00e1n\u00ed. To sni\u017euje teplotu v\u00fdpalu na p\u0159ibli\u017en\u011b 850-900 \u00b0C. Vzhledem k n\u00edzk\u00e9 teplot\u011b v\u00fdpalu lze pro elektrody a stopy pou\u017e\u00edt vodiv\u00e9 kovy s dobrou vodivost\u00ed, jako je zlato a st\u0159\u00edbro. LTCC pou\u017e\u00edv\u00e1 pro kovov\u00e9 linie s\u00edtotisk. P\u0159i t\u00e9to metod\u011b m\u016f\u017ee doch\u00e1zet k chyb\u00e1m v zarovn\u00e1n\u00ed kv\u016fli rozta\u017een\u00ed ok. Tak\u00e9 p\u0159i vrstven\u00ed v\u00edce vrstev na sebe a jejich spole\u010dn\u00e9m vypalov\u00e1n\u00ed m\u016f\u017ee doch\u00e1zet k r\u016fzn\u00e9mu smr\u0161\u0165ov\u00e1n\u00ed, co\u017e zhor\u0161uje v\u00fdt\u011b\u017enost. Pro zv\u00fd\u0161en\u00ed tepeln\u00e9 vodivosti LTCC lze v oblastech sou\u010d\u00e1stek p\u0159idat tepeln\u00e9 pr\u016fchodky nebo vodiv\u00e9 pr\u016fchodky, co\u017e v\u0161ak zvy\u0161uje n\u00e1klady.<\/div>\n

    Tlustovrstv\u00fd keramick\u00fd substr\u00e1t (TFC)<\/h3>\n
    V porovn\u00e1n\u00ed s LTCC a HTCC je TFC dodate\u010dn\u011b vyp\u00e1len\u00fd keramick\u00fd substr\u00e1t. K nan\u00e1\u0161en\u00ed kovov\u00fdch past na z\u00e1kladn\u00ed keramick\u00fd povrch se pou\u017e\u00edv\u00e1 s\u00edtotisk. Po zaschnut\u00ed se d\u00edl vyp\u00e1l\u00ed p\u0159i vysok\u00e9 teplot\u011b (700-800 \u00b0C). Kovov\u00e9 pasty jsou vyrobeny z kovov\u00e9ho pr\u00e1\u0161ku, organick\u00e9 prysky\u0159ice a skla. Po vyp\u00e1len\u00ed se prysky\u0159ice vyp\u00e1l\u00ed a na keramick\u00e9m povrchu z\u016fstane vrstva p\u0159ev\u00e1\u017en\u011b kovu spojen\u00e1 sklovit\u00fdm lepidlem. Tlou\u0161\u0165ka vyp\u00e1len\u00e9 kovov\u00e9 vrstvy je obvykle 10-20 \u03bcm a minim\u00e1ln\u00ed \u0161\u00ed\u0159ka linie je asi 0,3 mm. Vzhledem k tomu, \u017ee technologie je vysp\u011bl\u00e1, proces je jednoduch\u00fd a n\u00e1klady n\u00edzk\u00e9, pou\u017e\u00edv\u00e1 se TFC tam, kde nen\u00ed pot\u0159eba vysok\u00e1 p\u0159esnost vzoru.<\/div>\n

    P\u0159\u00edmo lepen\u00e9 m\u011bd\u011bn\u00e9 keramick\u00e9 PCB(DBC)<\/h3>\n
    DBC se vyr\u00e1b\u00ed spolusp\u00e9k\u00e1n\u00edm nebo eutektick\u00fdm spojov\u00e1n\u00edm m\u011bd\u011bn\u00e9 f\u00f3lie s keramick\u00fdm plechem p\u0159i vysok\u00e9 teplot\u011b (p\u0159ibli\u017en\u011b 1065 \u00b0C). Po slepen\u00ed se lept\u00e1n\u00edm vytvo\u0159\u00ed vzory obvod\u016f. Proto\u017ee m\u011bd\u011bn\u00e1 f\u00f3lie m\u00e1 dobrou elektrickou a tepelnou vodivost a Al\u2082O\u2083 m\u016f\u017ee kontrolovat rozta\u017enost kompozitu Cu-Al\u2082O\u2083-Cu, m\u00e1 DBC tepelnou rozta\u017enost bl\u00edzkou rozta\u017enosti oxidu hlinit\u00e9ho. DBC m\u00e1 dobrou tepelnou vodivost, silnou izolaci a vysokou spolehlivost. Je \u0161iroce pou\u017e\u00edv\u00e1n v obalech IGBT, laserov\u00fdch diod a CPV. DBC m\u00e1 nev\u00fdhody. Vysokoteplotn\u00ed eutektick\u00e1 reakce mezi Cu a Al\u2082O\u2083 vy\u017eaduje p\u0159\u00edsnou kontrolu za\u0159\u00edzen\u00ed a procesu, tak\u017ee n\u00e1klady jsou vy\u0161\u0161\u00ed. Mezi Al\u2082O\u2083 a Cu mohou vznikat mikrop\u00f3ry, kter\u00e9 sni\u017euj\u00ed odolnost proti tepeln\u00fdm \u0161ok\u016fm. M\u011bd\u011bn\u00e1 f\u00f3lie se m\u016f\u017ee p\u0159i vysok\u00e9 teplot\u011b deformovat, proto je tlou\u0161\u0165ka m\u011bdi na DBC obvykle v\u011bt\u0161\u00ed ne\u017e 100 \u03bcm. K vytvo\u0159en\u00ed vzor\u016f se pou\u017e\u00edv\u00e1 tak\u00e9 lept\u00e1n\u00ed, tak\u017ee minim\u00e1ln\u00ed \u0161\u00ed\u0159ka \u010d\u00e1ry je obvykle v\u011bt\u0161\u00ed ne\u017e 100 \u03bcm.<\/div>\n
     <\/div>\n
    \"DBC\"<\/div>\n
     <\/div>\n

    P\u0159\u00edmo pokoven\u00e9 m\u011bd\u011bn\u00e9 keramick\u00e9 PCB(DPC)<\/h3>\n
    DPC za\u010d\u00edn\u00e1 \u010di\u0161t\u011bn\u00edm a p\u0159edb\u011b\u017enou \u00fapravou keramick\u00e9ho plechu. Pot\u00e9 je na povrch substr\u00e1tu nanesena Ti\/Cu z\u00e1rode\u010dn\u00e1 vrstva pomoc\u00ed vakuov\u00e9ho napra\u0161ov\u00e1n\u00ed. K vytvo\u0159en\u00ed obvodov\u00e9ho vzoru se pou\u017eije fotolitografie, vyvol\u00e1v\u00e1n\u00ed a lept\u00e1n\u00ed. Pot\u00e9 se k n\u00e1r\u016fstu tlou\u0161\u0165ky obvodu pou\u017eije galvanick\u00e9 nebo chemick\u00e9 pokovov\u00e1n\u00ed. Po odstran\u011bn\u00ed fotorezistu je substr\u00e1t kompletn\u00ed. DPC m\u00e1 tyto v\u00fdhody: n\u00edzkoteplotn\u00ed proces (pod 300 \u00b0C), tak\u017ee se vyh\u00fdb\u00e1 nev\u00fdhod\u00e1m vysok\u00e9 teploty pro materi\u00e1ly a obvody a sni\u017euje v\u00fdrobn\u00ed n\u00e1klady. D\u00edky pou\u017eit\u00ed tenk\u00e9 vrstvy a fotolitografie jsou kovov\u00e9 linie na substr\u00e1tu jemn\u011bj\u0161\u00ed. DPC je tedy vhodn\u00e1 pro obaly, kter\u00e9 vy\u017eaduj\u00ed vysokou p\u0159esnost zarovn\u00e1n\u00ed. DPC m\u00e1 v\u0161ak i nev\u00fdhody. Tlou\u0161\u0165ka galvanicky pokoven\u00e9 m\u011bdi je omezen\u00e1 a odpadn\u00ed kapalina z galvanick\u00e9ho pokovov\u00e1n\u00ed m\u016f\u017ee zp\u016fsobit zne\u010di\u0161t\u011bn\u00ed. P\u0159ilnavost mezi kovovou vrstvou a keramikou je ni\u017e\u0161\u00ed, tak\u017ee spolehlivost v\u00fdrobku m\u016f\u017ee b\u00fdt ni\u017e\u0161\u00ed.<\/div>\n

    Pozn\u00e1mky k pou\u017eit\u00ed a v\u00fdb\u011bru<\/h2>\n
    P\u0159i v\u00fdb\u011bru keramick\u00e9ho substr\u00e1tu p\u0159izp\u016fsobte materi\u00e1l pot\u0159eb\u00e1m aplikace. Pokud pot\u0159ebujete vysokou tepelnou vodivost a tepelnou rozta\u017enost bl\u00edzkou k\u0159em\u00edku, m\u016f\u017ee b\u00fdt nejvhodn\u011bj\u0161\u00ed AlN nebo SiC. Pokud z\u00e1le\u017e\u00ed na cen\u011b a vysp\u011blosti zpracov\u00e1n\u00ed, je solidn\u00ed volbou Al\u2082O\u2083. Pokud pot\u0159ebujete jemn\u00e9 linie a zpracov\u00e1n\u00ed p\u0159i n\u00edzk\u00fdch teplot\u00e1ch, mohou fungovat DPC a LTCC. Pokud pot\u0159ebujete v\u00edcevrstv\u00e9 veden\u00ed s vysokou hustotou a hermetick\u00e9 ut\u011bsn\u011bn\u00ed, mohou b\u00fdt spr\u00e1vn\u00e9 soub\u011b\u017en\u011b p\u00e1len\u00e9 cesty jako LTCC nebo HTCC se soub\u011b\u017en\u00fdm sp\u00e9k\u00e1n\u00edm kov\u016f.<\/div>\n
    Mezi nej\u010dast\u011bj\u0161\u00ed oblasti pou\u017eit\u00ed pat\u0159\u00ed v\u00fdkonov\u00e9 moduly, v\u00fdkonov\u00e9 zesilova\u010de RF, moduly laserov\u00fdch diod, vysoce v\u00fdkonn\u00e9 LED a balen\u00ed LSI s vysokou hustotou. Keramick\u00e9 substr\u00e1ty jsou pro v\u00fdkonovou elektroniku v\u00fdhodn\u00e9, proto\u017ee dob\u0159e odv\u00e1d\u011bj\u00ed teplo a zachov\u00e1vaj\u00ed izolaci a mechanickou pevnost p\u0159i tepeln\u00e9m nam\u00e1h\u00e1n\u00ed. VF za\u0159\u00edzen\u00ed z\u00edsk\u00e1vaj\u00ed d\u00edky n\u00edzk\u00fdm dielektrick\u00fdm ztr\u00e1t\u00e1m a stabiln\u00edm dielektrick\u00fdm vlastnostem. Obaly s vysokou hustotou z\u00edsk\u00e1vaj\u00ed d\u00edky mo\u017enosti vytv\u00e1\u0159et jemn\u00e9 linie a skl\u00e1dat mnoho vrstev s dobrou kontrolou zarovn\u00e1n\u00ed, pokud je proces vhodn\u00fd.<\/div>\n

    V\u00fdrobn\u00ed kompromisy a praktick\u00e9 body<\/h2>\n
    Ka\u017ed\u00fd typ keramiky a ka\u017ed\u00fd proces m\u00e1 sv\u00e9 kompromisy. HTCC pou\u017e\u00edv\u00e1 vysokou teplotu v\u00fdpalu, a proto pou\u017e\u00edv\u00e1 \u017e\u00e1ruvzdorn\u00e9 kovy jako vodi\u010de. To omezuje vodivost a zvy\u0161uje n\u00e1klady, ale HTCC m\u016f\u017ee b\u00fdt p\u0159i vysok\u00e9 teplot\u011b velmi odoln\u00fd. LTCC sni\u017euje teplotu v\u00fdpalu p\u0159id\u00e1n\u00edm skla, tak\u017ee lze pou\u017e\u00edt lep\u0161\u00ed vodi\u010de, ale LTCC m\u016f\u017ee m\u00edt probl\u00e9my se smr\u0161\u0165ov\u00e1n\u00edm a vyrovn\u00e1v\u00e1n\u00edm ve v\u00edcevrstv\u00fdch materi\u00e1lech. TFC je levn\u00fd a jednoduch\u00fd, ale nelze z n\u011bj z\u00edskat velmi jemn\u00e9 vzory. DBC poskytuje vynikaj\u00edc\u00ed \u0161\u00ed\u0159en\u00ed tepla s tlustou m\u011bd\u00ed, ale jeho omezen\u00ed vzorov\u00e1n\u00ed a v\u00fdrobn\u00ed n\u00e1klady mohou b\u00fdt probl\u00e9mem. DPC umo\u017e\u0148uje jemn\u00e9 vzorov\u00e1n\u00ed a zpracov\u00e1n\u00ed p\u0159i n\u00edzk\u00fdch teplot\u00e1ch, ale je t\u0159eba db\u00e1t na p\u0159ilnavost a kontrolu odpadu.<\/div>\n

    Spole\u010dn\u00e9 vypalov\u00e1n\u00ed vs. metalizace po vyp\u00e1len\u00ed<\/h3>\n
    Spole\u010dn\u00e9 vypalov\u00e1n\u00ed znamen\u00e1 tisk kovov\u00fdch past na zelenou keramiku a vypalov\u00e1n\u00ed v\u0161eho dohromady. T\u00edm lze vytvo\u0159it velmi mal\u00e9 prvky a skute\u010dn\u00e9 v\u00edcevrstv\u00e9 zapojen\u00ed. Keramika a kov se d\u00edky tomu st\u00e1vaj\u00ed jedn\u00edm integrovan\u00fdm t\u011blesem, co\u017e napom\u00e1h\u00e1 hermetick\u00e9mu ut\u011bsn\u011bn\u00ed. Spole\u010dn\u00e9 vypalov\u00e1n\u00ed v\u0161ak vy\u017eaduje pe\u010dlivou kontrolu materi\u00e1l\u016f, aby odpov\u00eddaly smr\u0161\u0165ov\u00e1n\u00ed a sp\u00e9k\u00e1n\u00ed. Metalizace po vyp\u00e1len\u00ed, jako je tlust\u00e1 nebo tenk\u00e1 vrstva na vyp\u00e1len\u00e9 keramice, zabra\u0148uje probl\u00e9m\u016fm se smr\u0161\u0165ov\u00e1n\u00edm p\u0159i spolusp\u00e9k\u00e1n\u00ed. M\u016f\u017ee b\u00fdt jednodu\u0161\u0161\u00ed pro pot\u0159eby jednovrstv\u00e9ho nebo jednoduch\u00e9ho dvouvrstv\u00e9ho pokoven\u00ed. Metody po vyp\u00e1len\u00ed v\u0161ak nemus\u00ed dos\u00e1hnout stejn\u00e9 hustoty veden\u00ed a mohou m\u00edt odli\u0161n\u00e9 adhezivn\u00ed nebo tepeln\u00e9 vlastnosti.<\/div>\n

    P\u0159\u00edklady typick\u00fdch proces\u016f (stru\u010dn\u00e9 shrnut\u00ed)<\/h2>\n
      \n
    1. Pro spoluvypalovan\u00fd v\u00edcevrstv\u00fd substr\u00e1t: vyrobte keramickou ka\u0161i, odlijte p\u00e1sku, vyvrtejte pr\u016fchodky do zelen\u00e9 p\u00e1sky, vytiskn\u011bte vodiv\u00e9 pasty pomoc\u00ed s\u00edta, naskl\u00e1dejte p\u00e1sky, zalisujte a odlepte a pot\u00e9 vypalte. Po vyp\u00e1len\u00ed prove\u010fte kone\u010dn\u00e9 zpracov\u00e1n\u00ed, jako je metalizace podlo\u017eky a lept\u00e1n\u00ed obvod\u016f, je-li to nutn\u00e9.<\/li>\n
    2. Pro tlustou vrstvu na keramice: pou\u017eijte vyp\u00e1len\u00fd keramick\u00fd substr\u00e1t, s\u00edtotisk vodi\u010de a rezistorov\u00e9 pasty, vypalte p\u0159i 700-800 \u00b0C, pot\u00e9 o\u0159\u00edzn\u011bte rezistory a p\u0159idejte kone\u010dn\u00e9 kovov\u00e9 podlo\u017eky.<\/li>\n
    3. Pro DPC: vy\u010di\u0161t\u011bn\u00ed keramiky, nanesen\u00ed Ti\/Cu osiva napra\u0161ov\u00e1n\u00edm, vytvo\u0159en\u00ed fotorezistu, lept\u00e1n\u00ed osiva pro vytvo\u0159en\u00ed vzoru, elektrolytick\u00e9 nanesen\u00ed m\u011bdi, odstran\u011bn\u00ed rezistu a kone\u010dn\u00e9 vy\u010di\u0161t\u011bn\u00ed.<\/li>\n<\/ol>\n

      Souhrn<\/strong><\/h2>\n
      Keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f jsou t\u0159\u00eddou substr\u00e1tov\u00fdch materi\u00e1l\u016f, kter\u00e9 poskytuj\u00ed jedine\u010dn\u00e9 p\u0159ednosti pro elektronick\u00e9 obaly. Nab\u00edzej\u00ed dobr\u00e9 tepeln\u00e9 cesty, stabiln\u00ed elektrick\u00e9 chov\u00e1n\u00ed p\u0159i teplot\u011b a dobrou mechanickou pevnost. R\u016fzn\u00e9 volby keramiky a r\u016fzn\u00e9 zp\u016fsoby metalizace umo\u017e\u0148uj\u00ed konstrukt\u00e9r\u016fm vyv\u00e1\u017eit n\u00e1klady, tepeln\u00fd v\u00fdkon, elektrick\u00fd v\u00fdkon a pot\u0159eby jemn\u00e9ho vzoru. Z tohoto d\u016fvodu se keramick\u00e9 substr\u00e1ty \u0161iroce pou\u017e\u00edvaj\u00ed ve v\u00fdkonov\u00e9 elektronice, VF modulech, laserov\u00fdch a diodov\u00fdch obalech, v\u00fdkonn\u00fdch LED diod\u00e1ch a v mnoha oblastech obal\u016f s vysokou hustotou.<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t\t\t\t
      <\/div>\n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t
      \n\t\t\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t

      \u010casto kladen\u00e9 ot\u00e1zky<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tJak\u00e9 typy keramick\u00fdch materi\u00e1l\u016f se b\u011b\u017en\u011b pou\u017e\u00edvaj\u00ed?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Nejb\u011b\u017en\u011bj\u0161\u00ed jsou oxid hlinit\u00fd (Al\u2082O\u2083) pro v\u0161eobecn\u00e9 pou\u017eit\u00ed a nitrid hlin\u00edku (AlN) pro vy\u0161\u0161\u00ed tepelnou vodivost; dal\u0161\u00ed specializovan\u00e9 keramiky (nap\u0159. karbid k\u0159em\u00edku) se pou\u017e\u00edvaj\u00ed pro specifick\u00e9 pot\u0159eby vysok\u00e9ho v\u00fdkonu nebo vysok\u00fdch teplot.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tJak\u00e9 v\u00fdrobn\u00ed postupy se pou\u017e\u00edvaj\u00ed pro keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f se vyr\u00e1b\u011bj\u00ed postupy, jako je tisk na tlustou vrstvu, nan\u00e1\u0161en\u00ed na tenkou vrstvu, laserov\u00e9 obr\u00e1b\u011bn\u00ed a metalizace (m\u011b\u010f nebo st\u0159\u00edbro), po nich\u017e n\u00e1sleduje vypalov\u00e1n\u00ed a kone\u010dn\u00e1 \u00faprava.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tJak\u00e9 jsou hlavn\u00ed v\u00fdhody keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f oproti desk\u00e1m FR-4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Hlavn\u00ed v\u00fdhody: mnohem lep\u0161\u00ed tepeln\u00e1 vodivost (odvod tepla), ni\u017e\u0161\u00ed koeficient tepeln\u00e9 rozta\u017enosti (CTE), tolerance v\u016f\u010di vysok\u00fdm teplot\u00e1m a vynikaj\u00edc\u00ed elektrick\u00e1 izolace, co\u017e je ide\u00e1ln\u00ed pro LED, v\u00fdkonovou elektroniku a vysokofrekven\u010dn\u00ed aplikace.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tJsou keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f dra\u017e\u0161\u00ed?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ano - n\u00e1klady na materi\u00e1l a specializovan\u00e9 procesy (vypalov\u00e1n\u00ed, laserov\u00e9 obr\u00e1b\u011bn\u00ed, metalizace) obvykle prodra\u017euj\u00ed keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f oproti standardn\u00edmu materi\u00e1lu FR-4. U vysoce v\u00fdkonn\u00fdch nebo vysoce spolehliv\u00fdch konstrukc\u00ed v\u0161ak mohou sn\u00ed\u017eit n\u00e1klady na syst\u00e9m d\u00edky lep\u0161\u00edmu v\u00fdkonu a \u017eivotnosti.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tMohou b\u00fdt keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f pou\u017eity pro vysokofrekven\u010dn\u00ed\/RF aplikace?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ano. Keramick\u00e9 substr\u00e1ty maj\u00ed stabiln\u00ed dielektrick\u00e9 vlastnosti a n\u00edzk\u00e9 ztr\u00e1ty p\u0159i vysok\u00fdch frekvenc\u00edch, co\u017e z nich \u010din\u00ed vhodnou volbu pro sou\u010d\u00e1stky VF a mikrovlnn\u00fdch obvod\u016f.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tJak si m\u00e1m vybrat mezi oxidem hlinit\u00fdm (Al\u2082O\u2083) a nitridem hlin\u00edku (AlN)?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Zvolte oxid hlinit\u00fd pro cenovou v\u00fdhodnost a obecn\u00e9 pou\u017eit\u00ed; AlN zvolte, pokud pot\u0159ebujete vy\u0161\u0161\u00ed tepelnou vodivost a lep\u0161\u00ed tepeln\u00fd management pro vysoce v\u00fdkonn\u00e9 aplikace. V\u00e1\u0161 v\u00fdb\u011br by m\u011bl odr\u00e1\u017eet tepeln\u00e9, mechanick\u00e9 a rozpo\u010dtov\u00e9 po\u017eadavky.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an 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      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\\\/div>\\n
       <\\\/div>\\n
      \\\"ceramic<\\\/div>\\n
       <\\\/div>\\n

      Properties of ceramic PCB<\\\/h2>\\n

      Mechanical properties (how circuit traces are formed)<\\\/h3>\\n
      a. They have high mechanical strength. They can hold parts and also act as support structures.
      b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.
      c. Their surface is smooth. They do not warp, bend, or show small cracks.<\\\/div>\\n

      Electrical properties<\\\/h3>\\n
      a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.
      b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.
      c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\\\/div>\\n

      Thermal properties<\\\/h3>\\n
      a. They have high thermal conductivity. This helps move heat away from hot parts.
      b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.
      c. They have good heat resistance. They stay stable at high temperature.<\\\/div>\\n

      Other properties<\\\/h3>\\n
      a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.
      b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.
      c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.
      d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\\\/div>\\n

      Methods to make ceramic substrates<\\\/h2>\\n
      Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\\\/div>\\n
      Common process routes are these three:<\\\/div>\\n
        \\n
      1. Stack layers \\u2013 hot press \\u2013 remove binder \\u2013 fire the base sheet \\u2013 form circuit patterns \\u2013 fire the circuit.<\\\/li>\\n
      2. Stack layers \\u2013 print the circuit pattern on the surface \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n
      3. Print circuit pattern \\u2013 stack \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n<\\\/ol>\\n

        Metallization of ceramic PCB<\\\/h2>\\n

        a. Thick film method:<\\\/h3>\\n
        In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\\u2013oxide types.<\\\/div>\\n

        b. Thin film method:<\\\/h3>\\n
        Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\\\/div>\\n

        c. Co-firing method:<\\\/h3>\\n
        Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:
        \\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.
        \\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.
        \\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\\\/div>\\n

        Types of ceramic substrates<\\\/h2>\\n

        Alumina substrate (Al\\u2082O\\u2083)<\\\/h3>\\n
        a. Raw material: Al\\u2082O\\u2083 is often made by the Bayer process<\\\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.
        b. Making: Al\\u2082O\\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\\u20131600\\u00b0C. Metalization methods for Al\\u2082O\\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.
        c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Alumina<\\\/div>\\n
         <\\\/div>\\n

        Mullite substrate (3Al\\u2082O\\u2083\\u00b72SiO\\u2082)<\\\/h3>\\n
        Mullite is one of the most stable crystalline phases in the Al\\u2082O\\u2083\\u2013SiO\\u2082 system. Compared to Al\\u2082O\\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\\\/div>\\n

        Aluminum nitride substrate (AlN)<\\\/h3>\\n
        a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\\u2082O\\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\\u2082 to form AlN directly.
        b. Making: The same forming methods used for Al\\u2082O\\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.
        c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\\u2082O\\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\\u2082O\\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.
        d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Aluminum<\\\/div>\\n
         <\\\/div>\\n

        Silicon carbide substrate (SiC)<\\\/h3>\\n
        a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\\u00b0C to react and form \\u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.
        b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.
        c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.
        d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\\\/div>\\n

        Beryllia substrate (BeO)<\\\/h3>\\n
        BeO has thermal conductivity many times that of Al\\u2082O\\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\\u2082O\\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\\\/div>\\n

        Comparison of some ceramic materials and substrate types<\\\/h2>\\n
        From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\\\/div>\\n
        Common ceramic base materials are BeO, Al\\u2082O\\u2083, AlN, and Si\\u2083N\\u2084. Among these, Si\\u2083N\\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\\\/div>\\n

        High temperature co-fired ceramic multilayer (HTCC)<\\\/h3>\\n
        HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\\u2082O\\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\\u2013200 W\\\/(m\\u00b7\\u00b0C).<\\\/div>\\n

        Low temperature co-fired ceramic PCB(LTCC)<\\\/h3>\\n
        LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\\u2082O\\u2083 powder includes 30\\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\\u2013900\\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\\\/div>\\n

        Thick film ceramic substrate (TFC)<\\\/h3>\\n
        Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\\u2013800\\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\\u201320 \\u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\\\/div>\\n

        Direct bonded copper ceramic PCB(DBC)<\\\/h3>\\n
        DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\\u2082O\\u2083 can control the expansion of the Cu\\u2013Al\\u2082O\\u2083\\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\\u2082O\\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\\u2082O\\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \\u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \\u03bcm.<\\\/div>\\n
         <\\\/div>\\n
        \\\"DBC\\\"<\\\/div>\\n
         <\\\/div>\\n

        Direct plated copper ceramic PCB(DPC)<\\\/h3>\\n
        DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\\\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\\\/div>\\n

        Notes on use and selection<\\\/h2>\\n
        When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\\u2082O\\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\\\/div>\\n
        Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\\\/div>\\n

        Manufacturing tradeoffs and practical points<\\\/h2>\\n
        Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\\\/div>\\n

        Co-firing vs post-firing metallization<\\\/h3>\\n
        Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\\\/div>\\n

        Typical process flow examples (short summary)<\\\/h2>\\n
          \\n
        1. For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\\\/li>\\n
        2. For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\\u2013800\\u00b0C, then trim resistors and add final metal pads.<\\\/li>\\n
        3. For DPC: clean ceramic, deposit Ti\\\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\\\/li>\\n<\\\/ol>\\n

          Summary<\\\/strong><\\\/h2>\\n
          Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\\\/div>\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"c857395\"}]},\"elements\":[],\"widgetType\":\"text-editor\"}],\"isInner\":false},{\"id\":\"jcauneg\",\"elType\":\"section\",\"settings\":{\"gap\":\"no\",\"content_position\":\"top\",\"background_background\":\"classic\",\"background_color\":\"#FFFFFF00\",\"background_position\":\"bottom center\",\"background_attachment\":\"scroll\",\"background_repeat\":\"no-repeat\",\"background_size\":\"cover\",\"background_size_mobile\":\"cover\",\"background_overlay_background\":\"classic\",\"background_overlay_color_b\":\"rgba(255,255,255,0)\",\"background_overlay_opacity\":{\"unit\":\"px\",\"size\":\"\",\"sizes\":[]},\"padding\":{\"unit\":\"px\",\"top\":\"120\",\"right\":\"0\",\"bottom\":\"120\",\"left\":\"0\",\"isLinked\":false},\"padding_tablet\":{\"unit\":\"px\",\"top\":\"80\",\"right\":\"40\",\"bottom\":\"80\",\"left\":\"40\",\"isLinked\":false},\"padding_mobile\":{\"unit\":\"px\",\"top\":\"50\",\"right\":\"25\",\"bottom\":\"50\",\"left\":\"25\",\"isLinked\":false},\"content_width\":{\"unit\":\"px\",\"size\":800,\"sizes\":[]},\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"4cb1949\"}]},\"elements\":[{\"id\":\"7882748\",\"elType\":\"column\",\"settings\":{\"_column_size\":100,\"_inline_size\":null,\"padding\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"space_between_widgets\":40,\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"bcc1c8f\"}]},\"elements\":[{\"id\":\"9fc6712\",\"elType\":\"widget\",\"settings\":{\"title\":\"Frequently Asked Questions\",\"align\":\"center\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"79a2a25\"}]},\"elements\":[],\"widgetType\":\"heading\"},{\"id\":\"631b990\",\"elType\":\"widget\",\"settings\":{\"tabs\":[{\"tab_title\":\"What types of ceramic materials are commonly used?\",\"tab_content\":\"

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p>\",\"_id\":\"9c164e4\"},{\"_id\":\"70a3236\",\"tab_title\":\"What manufacturing processes are used for ceramic PCBs?\",\"tab_content\":\"

          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p>\"},{\"_id\":\"eded620\",\"tab_title\":\"What are the main advantages of ceramic PCBs over FR-4?\",\"tab_content\":\"

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p>\"},{\"_id\":\"4798292\",\"tab_title\":\"Are ceramic PCBs more expensive?\",\"tab_content\":\"

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p>\"},{\"_id\":\"379846e\",\"tab_title\":\"Can ceramic PCBs be used for high-frequency\\\/RF applications?\",\"tab_content\":\"

          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p>\"},{\"_id\":\"662a19b\",\"tab_title\":\"How should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?\",\"tab_content\":\"

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p>\"}],\"border_width\":{\"unit\":\"px\",\"size\":1,\"sizes\":[]},\"border_color\":\"#F5F5F5\",\"selected_icon\":{\"value\":\"fas fa-plus-circle\",\"library\":\"fa-solid\"},\"selected_active_icon\":{\"value\":\"fas fa-minus-circle\",\"library\":\"fa-solid\"},\"tab_active_color\":\"rgba(0, 124, 186, 0.97)\",\"_border_radius\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"_box_shadow_box_shadow\":{\"horizontal\":0,\"vertical\":3,\"blur\":12,\"spread\":4,\"color\":\"rgba(0, 0, 0, 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          \\n\\t\\t[elementor-element k=\\\"0e46bd9387093ca73b9000e38f18cce4\\\" data=\\\"{"id":"612671e","elType":"widget","settings":{"editor":"<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"alignnone size-full wp-image-2693\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/ceramic-pcb.webp\" alt=\"ceramic pcb\" width=\"356\" height=\"289\"><\/div>\n<div>&nbsp;<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Properties of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mechanical properties (how circuit traces are formed)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high mechanical strength. They can hold parts and also act as support structures.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their surface is smooth. They do not warp, bend, or show small cracks.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Electrical properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thermal properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high thermal conductivity. This helps move heat away from hot parts.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. They have good heat resistance. They stay stable at high temperature.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Other properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Methods to make ceramic substrates<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common process routes are these three:<\/div>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>Stack layers \u2013 hot press \u2013 remove binder \u2013 fire the base sheet \u2013 form circuit patterns \u2013 fire the circuit.<\/li>\n<li>Stack layers \u2013 print the circuit pattern on the surface \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<li>Print circuit pattern \u2013 stack \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Metallization of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">a. Thick film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\u2013oxide types.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">b. Thin film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">c. Co-firing method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Types of ceramic substrates<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Alumina substrate (Al\u2082O\u2083)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: Al\u2082O\u2083 is often made by the <a href=\"https:\/\/en.wikipedia.org\/wiki\/Bayer_process\">Bayer process<\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: Al\u2082O\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\u20131600\u00b0C. Metalization methods for Al\u2082O\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2691 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Alumina-substrate.webp\" alt=\"Alumina substrate\" width=\"600\" height=\"476\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mullite substrate (3Al\u2082O\u2083\u00b72SiO\u2082)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Mullite is one of the most stable crystalline phases in the Al\u2082O\u2083\u2013SiO\u2082 system. Compared to Al\u2082O\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Aluminum nitride substrate (AlN)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\u2082O\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\u2082 to form AlN directly.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: The same forming methods used for Al\u2082O\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\u2082O\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\u2082O\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2692 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Aluminum-nitride-substrate.webp\" alt=\"Aluminum nitride substrate\" width=\"600\" height=\"383\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Silicon carbide substrate (SiC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\u00b0C to react and form \u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Beryllia substrate (BeO)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">BeO has thermal conductivity many times that of Al\u2082O\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\u2082O\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Comparison of some ceramic materials and substrate types<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common ceramic base materials are BeO, Al\u2082O\u2083, AlN, and Si\u2083N\u2084. Among these, Si\u2083N\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">High temperature co-fired ceramic multilayer (HTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\u2082O\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\u2013200 W\/(m\u00b7\u00b0C).<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Low temperature co-fired ceramic PCB(LTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\u2082O\u2083 powder includes 30\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\u2013900\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thick film ceramic substrate (TFC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\u2013800\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\u201320 \u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct bonded copper ceramic PCB(DBC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\u2082O\u2083 can control the expansion of the Cu\u2013Al\u2082O\u2083\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\u2082O\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\u2082O\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \u03bcm.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2694 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/DBC.webp\" alt=\"DBC\" width=\"600\" height=\"450\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct plated copper ceramic PCB(DPC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Notes on use and selection<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\u2082O\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Manufacturing tradeoffs and practical points<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Co-firing vs post-firing metallization<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Typical process flow examples (short summary)<\/h2>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\/li>\n<li>For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\u2013800\u00b0C, then trim resistors and add final metal pads.<\/li>\n<li>For DPC: clean ceramic, deposit Ti\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\"><strong data-start=\"32\" data-end=\"43\">Summary<\/strong><\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\/div>","display_condition_list":[{"display_condition_login_status":"subscriber","_id":"c857395"}]},"elements":[],"widgetType":"text-editor"}\\\"]\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          Frequently Asked Questions<\\\/h2>\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat types of ceramic materials are commonly used?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat are the main advantages of ceramic PCBs over FR-4?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tAre ceramic PCBs more expensive?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

          \\n\\t\\t\\t\\t\\t
          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tHow should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/section>\\n\\t\\t\",\"scripts\":[],\"styles\":[]}}"],"_uag_css_file_name":["uag-css-2364.css"],"_uag_js_file_name":["uag-js-2364.js"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"Philifast","author_link":"https:\/\/flj-pcb.com\/cs\/author\/2475017442jygmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an […]","_links":{"self":[{"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/pages\/2364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/comments?post=2364"}],"version-history":[{"count":26,"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/pages\/2364\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/pages\/2364\/revisions\/3323"}],"up":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/pages\/1898"}],"wp:attachment":[{"href":"https:\/\/flj-pcb.com\/cs\/wp-json\/wp\/v2\/media?parent=2364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}