{"id":4981,"date":"2026-05-28T09:29:38","date_gmt":"2026-05-28T09:29:38","guid":{"rendered":"https:\/\/flj-pcb.com\/?p=4981"},"modified":"2026-05-28T09:29:40","modified_gmt":"2026-05-28T09:29:40","slug":"ceramic-pcb-design-manufacturing-guide","status":"publish","type":"post","link":"https:\/\/flj-pcb.com\/cs\/ceramic-pcb-design-manufacturing-guide\/","title":{"rendered":"Keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f: kompletn\u00ed pr\u016fvodce n\u00e1vrhem a v\u00fdrobou"},"content":{"rendered":"

Co je keramick\u00e1 deska plo\u0161n\u00fdch spoj\u016f?<\/h2>\n\n\n\n

Keramick\u00e1 deska plo\u0161n\u00fdch spoj\u016f pou\u017e\u00edv\u00e1 anorganick\u00fd keramick\u00fd substr\u00e1t nam\u00edsto tradi\u010dn\u00edho. FR-4<\/a> sklolamin\u00e1t. B\u011b\u017en\u00fdmi substr\u00e1tov\u00fdmi materi\u00e1ly jsou oxid hlinit\u00fd (Al\u2082O\u2083), nitrid hlin\u00edku (AlN) a oxid berylia (BeO). Tyto desky vedou teplo mnohem l\u00e9pe ne\u017e organick\u00e9 lamin\u00e1ty. Tak\u00e9 odol\u00e1vaj\u00ed teplot\u00e1m a\u017e 350 \u00b0C u standardn\u00edho oxidu hlinit\u00e9ho a je\u0161t\u011b vy\u0161\u0161\u00edm u SiC. In\u017een\u00fd\u0159i vol\u00ed keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f, pokud pot\u0159ebuj\u00ed vysokou tepelnou vodivost, stabiln\u00ed elektrick\u00fd v\u00fdkon p\u0159i vysok\u00fdch frekvenc\u00edch nebo koeficient tepeln\u00e9 rozta\u017enosti (CTE), kter\u00fd odpov\u00edd\u00e1 k\u0159em\u00edkov\u00fdm \u010dip\u016fm. Na rozd\u00edl od desek s kovov\u00fdm j\u00e1drem nem\u00e1 keramika \u017e\u00e1dnou izola\u010dn\u00ed vrstvu mezi sou\u010d\u00e1stkou a materi\u00e1lem rozv\u00e1d\u011bj\u00edc\u00edm teplo. Sou\u010d\u00e1stky le\u017e\u00ed p\u0159\u00edmo na keramice, co\u017e sni\u017euje tepeln\u00fd odpor. Tato p\u0159\u00edm\u00e1 cesta udr\u017euje n\u00edzk\u00e9 teploty na spoji a prodlu\u017euje \u017eivotnost v\u00fdrobku.<\/p>\n\n\n\n

Typy keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f<\/h2>\n\n\n\n

Existuj\u00ed t\u0159i hlavn\u00ed rodiny proces\u016f. Ka\u017ed\u00e1 z nich vyhovuje jin\u00fdm v\u00fdkonnostn\u00edm a n\u00e1kladov\u00fdm c\u00edl\u016fm.<\/p>\n\n\n\n

\"Types<\/figure>\n\n\n\n

Vysokoteplotn\u00ed spoluvypalovan\u00e1 keramika (HTCC)<\/h3>\n\n\n\n

HTCC pou\u017e\u00edv\u00e1 substr\u00e1t z oxidu hlinit\u00e9ho se \u017e\u00e1ruvzdorn\u00fdmi kovov\u00fdmi pastami - wolframem nebo molybdenem. Vzor obvodu vytiskneme s\u00edtotiskem na zelenou keramickou p\u00e1sku, vrstv\u00edme vrstvy a pak v\u0161e vyp\u00e1l\u00edme p\u0159i teplot\u011b 1600-1700 \u00b0C v atmosf\u00e9\u0159e reduk\u010dn\u00edho plynu (vod\u00edku). Vysok\u00e1 teplota slinuje keramiku a kov do monolitick\u00e9 desky. HTCC se dob\u0159e osv\u011bd\u010duje u mal\u00fdch substr\u00e1t\u016f s vysok\u00fdm po\u010dtem vrstev. Extr\u00e9mn\u00ed vypalov\u00e1n\u00ed v\u0161ak zp\u016fsobuje smr\u0161t\u011bn\u00ed 15-20%; toto \u0161k\u00e1lov\u00e1n\u00ed kompenzujeme p\u0159i n\u00e1vrhu CAM. \u017d\u00e1ruvzdorn\u00e9 kovy maj\u00ed vy\u0161\u0161\u00ed odpor ne\u017e m\u011b\u010f, tak\u017ee stopy HTCC vykazuj\u00ed v\u011bt\u0161\u00ed ztr\u00e1ty. HTCC pou\u017eijte, pokud pot\u0159ebujete mnoho vrstev (a\u017e 10) a m\u016f\u017eete akceptovat v\u011bt\u0161\u00ed \u0161\u00ed\u0159ku \u010d\u00e1ry. Na\u0161e tov\u00e1rna dok\u00e1\u017ee udr\u017eet 100 \u00b5m \u010d\u00e1ry\/prostor po korekci smr\u0161t\u011bn\u00ed.<\/p>\n\n\n\n

N\u00edzkoteplotn\u00ed spole\u010dn\u011b vypalovan\u00e1 keramika (LTCC)<\/h3>\n\n\n\n

LTCC ho\u0159\u00ed p\u0159i teplot\u011b kolem 900 \u00b0C. Tato ni\u017e\u0161\u00ed teplota n\u00e1m umo\u017e\u0148uje pou\u017e\u00edvat pasty z drah\u00fdch kov\u016f - zlato, st\u0159\u00edbro nebo zlato-pal\u00e1dium. Substr\u00e1t za\u010d\u00edn\u00e1 jako sklokeramick\u00e1 kompozitn\u00ed p\u00e1ska. Vytiskneme vodi\u010de, laserem nebo mechanick\u00fdm d\u011brova\u010dem vyraz\u00edme pr\u016fchodky, vypln\u00edme je pastou a vrstvy laminujeme. Spole\u010dn\u00e9 vypalov\u00e1n\u00ed v oxida\u010dn\u00ed peci v\u0161e spoj\u00ed. LTCC poskytuje lep\u0161\u00ed kontrolu rozm\u011br\u016f ne\u017e HTCC (smr\u0161t\u011bn\u00ed pouze 0,1-0,2%), tak\u017ee dos\u00e1hneme jemn\u011bj\u0161\u00edch lini\u00ed: Typick\u00e1 stopa\/prostor je 75 \u00b5m. Proto\u017ee vypalovan\u00fd kov je zlat\u00fd, sm\u00e1\u010den\u00ed p\u00e1jky vy\u017eaduje speci\u00e1ln\u00ed povlaky na podlo\u017eky. \u010casto p\u0159id\u00e1v\u00e1me ENIG (elektrolyticky pono\u0159en\u00e9 niklov\u00e9 zlato)<\/a>\u00a0jako z\u00e1v\u011bre\u010dnou \u00fapravu. LTCC vynik\u00e1 pro RF a sm\u00ed\u0161en\u00e9 sign\u00e1lov\u00e9 aplikace, proto\u017ee dielektrick\u00e1 konstanta je rovnom\u011brn\u00e1 a m\u00e1 n\u00edzk\u00e9 ztr\u00e1ty.<\/p>\n\n\n\n

Keramick\u00e1 tlustovrstv\u00e1 deska plo\u0161n\u00fdch spoj\u016f<\/h3>\n\n\n\n

Technologie tlust\u00fdch vrstev za\u010d\u00edn\u00e1 s p\u0159edem vyp\u00e1len\u00fdm keramick\u00fdm substr\u00e1tem (obvykle oxid hlinit\u00fd 96%). S\u00edtotiskem tiskneme vodiv\u00e9, odporov\u00e9 a dielektrick\u00e9 pasty vrstvu po vrstv\u011b. Ka\u017ed\u00e1 vrstva se vypaluje p\u0159i teplot\u011b 850-1000 \u00b0C. Vodiv\u00e9 pasty jsou zlat\u00e9 nebo st\u0159\u00edbrno-paladiov\u00e9; dielektrick\u00e9 pasty izoluj\u00ed mezi vrstvami. Po vyp\u00e1len\u00ed m\u016f\u017eeme rezistory laserov\u011b upravit s toleranc\u00ed \u00b11%. Tlust\u00e1 vrstva je nejlevn\u011bj\u0161\u00ed keramick\u00fd proces pro v\u00fdrobu prototyp\u016f a st\u0159edn\u00edch objem\u016f. Modern\u00ed variantou je v\u00edcevrstv\u00e1 tlustovrstv\u00e1 m\u011b\u010f: tiskneme m\u011bd\u011bn\u00e9 pasty a vypalujeme v dus\u00edkov\u00e9 atmosf\u00e9\u0159e. T\u00edm se \u0159e\u0161\u00ed n\u00e1klady na zlatou pastu a probl\u00e9my s p\u00e1jitelnost\u00ed. Tlustovrstv\u00e9 desky zvl\u00e1dnou tlou\u0161\u0165ku hotov\u00e9 m\u011bdi 10-15 \u00b5m, co\u017e sta\u010d\u00ed pro v\u011bt\u0161inu v\u00fdkonov\u00fdch obvod\u016f do 10 A.<\/p>\n\n\n\n

Srovn\u00e1n\u00ed keramick\u00fdch materi\u00e1l\u016f PCB<\/h2>\n\n\n\n

V\u00fdb\u011br spr\u00e1vn\u00e9 keramiky p\u0159\u00edmo ovliv\u0148uje tepeln\u00fd v\u00fdkon a n\u00e1klady.<\/p>\n\n\n\n

Materi\u00e1l<\/th>Tepeln\u00e1 vodivost (W\/m-K)<\/th>CTE (ppm\/\u00b0C)<\/th>Dielektrick\u00e1 konstanta<\/th>Maxim\u00e1ln\u00ed provozn\u00ed teplota (\u00b0C)<\/th>Typick\u00fd p\u0159\u00edpad pou\u017eit\u00ed<\/th><\/tr><\/thead>
Hlin\u00edk 96%<\/td>20-24<\/td>6.5-7.0<\/td>9.4<\/td>350<\/td>LED moduly, v\u00fdkonov\u00e9 hybridy<\/td><\/tr>
Hlin\u00edk 99.6%<\/td>28-30<\/td>7.0<\/td>9.8<\/td>350<\/td>RF substr\u00e1ty, nosi\u010de \u010dip\u016f<\/td><\/tr>
Nitrid hlin\u00edku (AlN)<\/td>170-230<\/td>4.5<\/td>8.8<\/td>400<\/td>Vysoce v\u00fdkonn\u00e9 zesilova\u010de GaN, m\u011bni\u010de pro elektrick\u00e1 vozidla<\/td><\/tr>
Oxid berylia (BeO)<\/td>260<\/td>6.4<\/td>6.7<\/td>450<\/td>Vojensk\u00e9 radary (toxick\u00e9 - zvl\u00e1\u0161tn\u00ed zach\u00e1zen\u00ed)<\/td><\/tr>
Karbid k\u0159em\u00edku (SiC)<\/td>120-270<\/td>4.0<\/td>40<\/td>800+<\/td>Senzory pro extr\u00e9mn\u011b vysok\u00e9 teploty<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Materi\u00e1l Alumina 96% poskytuje nejlep\u0161\u00ed pom\u011br ceny a v\u00fdkonu. AlN stoj\u00ed asi 3\u00d7 v\u00edce, ale sni\u017euje teplotu spoje o v\u00edce ne\u017e 20 \u00b0C v proveden\u00ed 50 W. Tato dodate\u010dn\u00e1 tepeln\u00e1 rezerva m\u016f\u017ee zdvojn\u00e1sobit st\u0159edn\u00ed dobu mezi poruchami syst\u00e9mu. Na\u0161e tov\u00e1rna m\u00e1 skladem polotovary z oxidu hlinit\u00e9ho 96% i 99,6% v rozm\u011brech 4\" \u00d7 4\" a 6\" \u00d7 8\". Na vy\u017e\u00e1d\u00e1n\u00ed jsou k dispozici polotovary AlN s m\u00edrn\u011b del\u0161\u00edmi dodac\u00edmi lh\u016ftami.<\/p>\n\n\n\n

Hlavn\u00ed v\u00fdhody keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f<\/h2>\n\n\n\n

V\u00fdjime\u010dn\u00e1 tepeln\u00e1 vodivost<\/h3>\n\n\n\n

FR-4 vede teplo rychlost\u00ed p\u0159ibli\u017en\u011b 0,25 W\/m-K. Dokonce i standardn\u00ed oxid hlinit\u00fd (24 W\/m-K) p\u0159en\u00e1\u0161\u00ed teplo 96kr\u00e1t rychleji. Nitrid hlin\u00edku zvl\u00e1d\u00e1 170-230 W\/m-K. To znamen\u00e1, \u017ee 1 unce m\u011bd\u011bn\u00e9 roviny na keramice p\u016fsob\u00ed jako \u00fa\u010dinn\u00fd rozvad\u011b\u010d tepla. Nap\u0159\u00edklad m\u011bd\u011bn\u00e1 stopa o \u0161\u00ed\u0159ce 2 mm a tlou\u0161\u0165ce 0,3 mm p\u0159i proudu 100 A stoupne na desce z oxidu hlinit\u00e9ho pouze o 5 \u00b0C nad okoln\u00ed teplotu. Stejn\u00e1 stopa na desce FR-4 by se p\u0159eh\u0159\u00e1la a odlupovala. P\u0159\u00edm\u00e1 mont\u00e1\u017e sou\u010d\u00e1stek na keramiku eliminuje vrstvy materi\u00e1lu tepeln\u00e9ho rozhran\u00ed, \u010d\u00edm\u017e se sni\u017euje celkov\u00fd odpor spoje v\u016f\u010di okol\u00ed.<\/p>\n\n\n\n

Odolnost proti vysok\u00fdm teplot\u00e1m<\/h3>\n\n\n\n

Na\u0161e desky HTCC a tlustovrstv\u00e9 desky z oxidu hlinit\u00e9ho pracuj\u00ed nep\u0159etr\u017eit\u011b p\u0159i teplot\u011b 350 \u00b0C. Desky SiC maj\u00ed teplotu vy\u0161\u0161\u00ed ne\u017e 800 \u00b0C. Tradi\u010dn\u00ed desky FR-4 maj\u00ed teplotu skeln\u00e9ho p\u0159echodu (Tg) 130-170 \u00b0C; m\u011bknou a selh\u00e1vaj\u00ed ji\u017e pod 200 \u00b0C. D\u00edky t\u00e9to toleranci k vysok\u00fdm teplot\u00e1m jsou keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f nepostradateln\u00e9 pro n\u00e1stroje pro hloubkov\u00e9 vrt\u00e1n\u00ed, nav\u00e1d\u011bn\u00ed raket a senzory pod kapotou automobil\u016f.<\/p>\n\n\n\n

K\u0159em\u00edkov\u00e9 a keramick\u00e9 obaly s n\u00edzk\u00fdm CTE<\/h3>\n\n\n\n

K\u0159em\u00edkov\u00e9 \u010dipy se roz\u0161i\u0159uj\u00ed rychlost\u00ed p\u0159ibli\u017en\u011b 2,6 ppm\/\u00b0C. Bezolovnat\u00e9 keramick\u00e9 nosi\u010de \u010dip\u016f (LCCC) maj\u00ed CTE 6-7 ppm\/\u00b0C. FR-4 expanduje rychlost\u00ed 14-17 ppm\/\u00b0C. Tento nesoulad zp\u016fsobuje \u00fanavu p\u00e1jec\u00edch spoj\u016f p\u0159i tepeln\u00e9m cyklov\u00e1n\u00ed. Keramick\u00e1 deska plo\u0161n\u00fdch spoj\u016f s CTE 6,5 ppm\/\u00b0C t\u00e9m\u011b\u0159 dokonale odpov\u00edd\u00e1 pouzdru. V na\u0161ich testech spolehlivosti p\u0159e\u017eily p\u00e1jen\u00e9 spoje z keramiky na LCCC 2 000 cykl\u016f tepeln\u00e9ho \u0161oku (-55 \u00b0C a\u017e +125 \u00b0C) bez r\u016fstu trhlin, zat\u00edmco stejn\u00e9 spoje na FR-4 selhaly po 500 cyklech.<\/p>\n\n\n\n

Vynikaj\u00edc\u00ed elektrick\u00e1 izolace a vysokofrekven\u010dn\u00ed v\u00fdkony<\/h3>\n\n\n\n

Dielektrick\u00e1 pevnost p\u0159esahuje 20 kV\/mm na oxidu hlinit\u00e9m. Dielektrick\u00e1 konstanta z\u016fst\u00e1v\u00e1 stabiln\u00ed p\u0159i r\u016fzn\u00fdch teplot\u00e1ch a frekvenc\u00edch a m\u00e1 n\u00edzk\u00fd tangens ztr\u00e1t. D\u00edky tomu je mo\u017en\u00e9 pou\u017e\u00edt vysokoimpedan\u010dn\u00ed \u0159\u00eddic\u00ed stopy pro VF frekvence a\u017e do 20 GHz. U desek LTCC pro sm\u00ed\u0161en\u00e9 sign\u00e1ly m\u016f\u017ee parazitn\u00ed kapacita klesnout t\u00e9m\u011b\u0159 o 90% ve srovn\u00e1n\u00ed s konstrukcemi FR-4. Toto sn\u00ed\u017een\u00ed sni\u017euje p\u0159eslechy a zlep\u0161uje p\u0159esnost analogov\u011b-digit\u00e1ln\u00edho p\u0159evodu.<\/p>\n\n\n\n

Mechanick\u00e1 pevnost a dlouhodob\u00e1 stabilita<\/h3>\n\n\n\n

P\u0159esto\u017ee jsou keramick\u00e9 substr\u00e1ty k\u0159ehk\u00e9, maj\u00ed vysokou pevnost v tlaku (oxid hlinit\u00fd ~2 000 MPa). Odol\u00e1vaj\u00ed chemick\u00e9 erozi zp\u016fsoben\u00e9 palivy, kyselinami a \u010distic\u00edmi rozpou\u0161t\u011bdly. Absorpce vlhkosti je t\u00e9m\u011b\u0159 nulov\u00e1, tak\u017ee nedoch\u00e1z\u00ed ke kol\u00eds\u00e1n\u00ed elektrick\u00fdch vlastnost\u00ed. Na\u0161e desky spl\u0148uj\u00ed IPC-TM-650 <\/a>zkou\u0161ky odolnosti proti vlhkosti bez jak\u00e9koli degradace.<\/p>\n\n\n\n

Integrace s vysokou hustotou a miniaturizace<\/h3>\n\n\n\n

Pou\u017e\u00edv\u00e1me laserem vrtan\u00e9 mikrotvary o pr\u016fm\u011bru a\u017e 0,06 mm. Spole\u010dn\u011b s jemn\u00fdmi LTCC procesy (75 \u00b5m \u0159\u00e1dek\/prostor) m\u016f\u017eete na men\u0161\u00ed plochu um\u00edstit v\u00edce komponent. V\u00edcevrstv\u00e9 spole\u010dn\u00e9 vypalov\u00e1n\u00ed n\u00e1m umo\u017e\u0148uje vkl\u00e1dat pasivn\u00ed sou\u010d\u00e1stky - rezistory, kondenz\u00e1tory - dovnit\u0159 substr\u00e1tu b\u011bhem sp\u00e9k\u00e1n\u00ed. T\u00edm se uvoln\u00ed plocha pro aktivn\u00ed \u010dipy a konektory. Jedin\u00e1 deska LTCC m\u016f\u017ee nahradit celou sestavu z v\u00edce desek FR-4, \u010d\u00edm\u017e se sn\u00ed\u017e\u00ed hmotnost a objem.<\/p>\n\n\n\n

\"High\u2011Density<\/figure>\n\n\n\n

Pro\u010d pou\u017e\u00edvat keramick\u00e9 PCB m\u00edsto jin\u00fdch desek?<\/h2>\n\n\n\n

Tepeln\u00e1 vodivost: Skute\u010dn\u00e1 \u010d\u00edsla<\/h3>\n\n\n\n

FR-4: 0,25 W\/m-K. MCPCB (hlin\u00edkov\u00e1 zadn\u00ed strana): (1-2 W\/m-K), ale st\u00e1le pou\u017e\u00edv\u00e1 dielektrickou izola\u010dn\u00ed vrstvu, kter\u00e1 vytv\u00e1\u0159\u00ed \u00fazk\u00e9 hrdlo. Hlin\u00edkov\u00e1 keramika: 24 W\/m-K, bez izola\u010dn\u00ed vrstvy. Teplo tedy okam\u017eit\u011b proud\u00ed z podlo\u017eky sou\u010d\u00e1stky do keramick\u00e9ho t\u011bla. LED o v\u00fdkonu 10 W na MCPCB m\u016f\u017ee dos\u00e1hnout teploty spoje 120 \u00b0C, stejn\u00e1 LED na alumin\u011b z\u016fst\u00e1v\u00e1 pod 100 \u00b0C. Tento chladn\u011bj\u0161\u00ed provoz zdvojn\u00e1sobuje \u017eivotnost sv\u011bteln\u00e9ho toku.<\/p>\n\n\n\n

Srovn\u00e1n\u00ed cen a celkov\u00fdch n\u00e1klad\u016f na vlastnictv\u00ed<\/h3>\n\n\n\n

Keramick\u00e9 desky stoj\u00ed na jednotku plochy v\u00edce. Dvouvrstv\u00e1 deska z oxidu hlinit\u00e9ho 96% (100 \u00d7 80 mm) stoj\u00ed p\u0159ibli\u017en\u011b $0,8-1,2\/cm\u00b2 objemu (v\u00edce ne\u017e 100 kus\u016f). Ekvivalentn\u00ed \u010dty\u0159vrstv\u00e1 deska FR-4 stoj\u00ed $0,10\/cm\u00b2. Syst\u00e9mov\u00e9 n\u00e1klady v\u0161ak vypov\u00eddaj\u00ed o n\u011b\u010dem jin\u00e9m. Keramika eliminuje pot\u0159ebu tepeln\u00fdch podlo\u017eek, rozvad\u011b\u010d\u016f tepla a velk\u00fdch chladi\u010d\u016f. U 50W zdroje \u00faspory na chladic\u00edm hardwaru a pr\u00e1ci p\u0159i mont\u00e1\u017ei \u010dasto p\u0159esahuj\u00ed $10 na jednotku. Keramick\u00e9 proveden\u00ed tak\u00e9 sni\u017euje vratky v ter\u00e9nu. Po dobu \u017eivotnosti v\u00fdrobku poskytuje keramika ni\u017e\u0161\u00ed celkov\u00e9 n\u00e1klady na vlastnictv\u00ed.<\/p>\n\n\n\n

Technologick\u00e9 postupy: Kdy\u017e v\u00edt\u011bz\u00ed keramika<\/h3>\n\n\n\n

Keramiku pou\u017e\u00edvejte, kdy\u017e:<\/p>\n\n\n\n

    \n
  • Teplota spoje mus\u00ed z\u016fstat pod 150 \u00b0C p\u0159i vysok\u00e9 okoln\u00ed teplot\u011b.<\/li>\n\n\n\n
  • Konstrukce obsahuje mnoho komponent citliv\u00fdch na CTE (hol\u00e1 kostka, keramick\u00e9 integrovan\u00e9 obvody).<\/li>\n\n\n\n
  • Pot\u0159ebujete r\u00e1diov\u00fd v\u00fdkon nad 5 GHz.<\/li>\n\n\n\n
  • V\u00fdrobek je vystaven siln\u00fdm vibrac\u00edm nebo korozivn\u00edmu prost\u0159ed\u00ed.<\/li>\n\n\n\n
  • Miniaturizace vy\u017eaduje slep\u00e9\/zapu\u0161t\u011bn\u00e9 pr\u016fchodky a vestav\u011bn\u00e9 pasivy.<\/li>\n<\/ul>\n\n\n\n

    Pokud v\u00e1s omezuje pouze m\u00edrn\u00e9 teplo a prim\u00e1rn\u00ed je cena, m\u016f\u017ee v\u00e1m sta\u010dit MCPCB nebo tlust\u00e1 m\u011bd\u011bn\u00e1 deska FR-4. Jakmile v\u0161ak naraz\u00edte na tepelnou st\u011bnu, probl\u00e9m vy\u0159e\u0161\u00ed keramika.<\/p>\n\n\n\n

    Jak vyrobit keramickou desku plo\u0161n\u00fdch spoj\u016f?<\/h2>\n\n\n\n

    V na\u0161\u00ed tov\u00e1rn\u011b pou\u017e\u00edv\u00e1me \u010dty\u0159i hlavn\u00ed v\u00fdrobn\u00ed postupy. Ka\u017ed\u00fd z nich v\u00e1m jednodu\u0161e p\u0159ibl\u00ed\u017e\u00edm.<\/p>\n\n\n\n

    Proces HTCC<\/h3>\n\n\n\n
      \n
    1. Odl\u00e9v\u00e1n\u00ed p\u00e1sky:<\/strong>\u00a0Sm\u00edch\u00e1me pr\u00e1\u0161kov\u00fd oxid hlinit\u00fd s organick\u00fdm pojivem a odl\u00e9v\u00e1me do tenk\u00fdch zelen\u00fdch pl\u00e1t\u016f.<\/li>\n\n\n\n
    2. Zaslepen\u00ed a d\u011brov\u00e1n\u00ed:<\/strong>\u00a0\u0158e\u017eeme plechy na velikost panelu a d\u011brujeme nebo laserem vrt\u00e1me pr\u016fchodky.<\/li>\n\n\n\n
    3. Prost\u0159ednictv\u00edm pln\u011bn\u00ed a tisku:<\/strong>\u00a0Vypl\u0148te pr\u016fchodky wolframovou pastou. Na ka\u017edou vrstvu naneste s\u00edtotiskem stopy vodi\u010de.<\/li>\n\n\n\n
    4. Laminace:<\/strong>\u00a0Vrstvy naskl\u00e1dejte na sebe v lisu za tepla a pod tlakem.<\/li>\n\n\n\n
    5. Spoluspalov\u00e1n\u00ed:<\/strong>\u00a0Zah\u0159\u00edvejte laminovan\u00fd stoh na teplotu 1600-1700 \u00b0C po dobu 32-48 hodin v atmosf\u00e9\u0159e \u0159\u00edzen\u00e9 vod\u00edkem a dus\u00edkem. Pojivo sho\u0159\u00ed a keramika se slinuje s kovem.<\/li>\n\n\n\n
    6. N\u00e1sledn\u00e9 zpracov\u00e1n\u00ed:<\/strong>\u00a0Laserov\u00e9 o\u0159ez\u00e1v\u00e1n\u00ed v\u0161ech vlo\u017een\u00fdch rezistor\u016f. V p\u0159\u00edpad\u011b pot\u0159eby p\u0159idejte povrchovou \u00fapravu (ENIG, ponorn\u00e9 st\u0159\u00edbro).<\/li>\n<\/ol>\n\n\n\n

      Proces LTCC<\/h3>\n\n\n\n

      Stejn\u00fd postup, ale se sklokeramickou p\u00e1skou, zlatou pastou a vypalov\u00e1n\u00edm p\u0159i 900 \u00b0C na vzduchu. Vod\u00edk nen\u00ed pot\u0159eba. Velikost pr\u016fchodek je a\u017e 0,1 mm. Uvnit\u0159 stohu m\u016f\u017eeme vlo\u017eit induktory a kondenz\u00e1tory.<\/p>\n\n\n\n

      Proces zpracov\u00e1n\u00ed tlust\u00e9 vrstvy<\/h3>\n\n\n\n
        \n
      1. Za\u010dn\u011bte s p\u0159edem vyp\u00e1len\u00fdm substr\u00e1tem z oxidu hlinit\u00e9ho.<\/li>\n\n\n\n
      2. S\u00edtotisk vodiv\u00e9 vrstvy (zlato nebo st\u0159\u00edbro-pal\u00e1dium), vysu\u0161te a vypalte p\u0159i teplot\u011b 850-1000 \u00b0C.<\/li>\n\n\n\n
      3. Vytiskn\u011bte dielektrickou vrstvu, kter\u00e1 izoluje, a pak ji vypalte.<\/li>\n\n\n\n
      4. Opakujte pro ka\u017edou vrstvu. U tlust\u00e9 vrstvy m\u011bdi vytiskn\u011bte a vypalte v dus\u00edku.<\/li>\n\n\n\n
      5. Naneste kone\u010dnou kryc\u00ed glazuru nebo p\u00e1jec\u00ed masku (je-li to nutn\u00e9).<\/li>\n\n\n\n
      6. Laserov\u00e9 trimovac\u00ed rezistory na hodnotu.<\/li>\n<\/ol>\n\n\n\n

        Typick\u00e9 specifikace tlust\u00e9 vrstvy: \u0159\u00e1dek\/prostor 125 \u00b5m, pr\u016fm\u011br pr\u016fchodky 0,3 mm, a\u017e 4 vrstvy vodi\u010d\u016f, tlou\u0161\u0165ka hotov\u00e9 m\u011bdi 10-15 \u00b5m na vrstvu.<\/p>\n\n\n\n

        P\u0159\u00edmo pokoven\u00e1 m\u011b\u010f (DPC) a p\u0159\u00edmo pokoven\u00e1 m\u011b\u010f (DCB)<\/h3>\n\n\n\n

        Jedn\u00e1 se o jednodu\u0161\u0161\u00ed metody pro jednostrann\u00e9 nebo oboustrann\u00e9 desky. P\u0159i DPC se na keramiku nanese m\u011bd\u011bn\u00e1 z\u00e1rode\u010dn\u00e1 vrstva a pot\u00e9 se galvanicky nanese na po\u017eadovanou tlou\u0161\u0165ku. DCB lep\u00ed silnou m\u011bd\u011bnou f\u00f3lii (0,1-0,3 mm) p\u0159\u00edmo na oxid hlinit\u00fd nebo AlN p\u0159i vysok\u00e9 teplot\u011b v dus\u00edku. DPC pou\u017e\u00edv\u00e1me pro LED obaly a DCB pro vysokoproud\u00e9 IGBT moduly. Ob\u011b technologie poskytuj\u00ed vynikaj\u00edc\u00ed tepeln\u00fd v\u00fdkon p\u0159i tlou\u0161\u0165ce m\u011bdi a\u017e 300 \u00b5m.<\/p>\n\n\n\n

        Na\u0161e tov\u00e1rna udr\u017euje standardn\u00ed velikosti panel\u016f: V na\u0161\u00ed nab\u00eddce jsou standardn\u00ed velikosti: 4\u2033\u00d74\u2033, 5\u2033\u00d75\u2033, 6\u2033\u00d78\u2033 a 8\u2033\u00d710\u2033. Po\u010det vrstev se pohybuje od 1 do 6 u tlust\u00fdch f\u00f3li\u00ed a a\u017e do 10 u HTCC\/LTCC. U LTCC dosahujeme 75 \u00b5m \u0159\u00e1dek\/prostor, u HTCC 100 \u00b5m. Povrchov\u00e9 \u00fapravy zahrnuj\u00ed ENIG, ENEPIG, imerzn\u00ed st\u0159\u00edbro a m\u011bkk\u00e9 zlato v\u00e1zan\u00e9 dr\u00e1tem.<\/p>\n\n\n\n

        Pokyny pro navrhov\u00e1n\u00ed keramick\u00fdch PCB a kontroln\u00ed seznam DFM<\/h2>\n\n\n\n

        Navrhov\u00e1n\u00ed s keramikou vy\u017eaduje zvl\u00e1\u0161tn\u00ed p\u00e9\u010di, aby se zabr\u00e1nilo vzniku trhlin a ztr\u00e1t\u011b v\u00fdt\u011b\u017enosti. Uvedu v\u00e1m nejlep\u0161\u00ed pravidla z patn\u00e1ctilet\u00fdch zku\u0161enost\u00ed na\u0161\u00ed tov\u00e1rny.<\/p>\n\n\n\n

        \"Ceramic<\/figure>\n\n\n\n

        Voln\u00fd prostor od pr\u016fchodu ke kraji<\/h3>\n\n\n\n

        Nej\u010dast\u011bj\u0161\u00ed poruchou, se kterou se setk\u00e1v\u00e1me, je praskl\u00fd pr\u016fchod v bl\u00edzkosti okraje desky. Keramika je k\u0159ehk\u00e1. Kdy\u017e desky depanujeme diamantovou pilou nebo laserem, mohou se mikrotrhliny \u0161\u00ed\u0159it dovnit\u0159. Udr\u017eujte st\u0159edy v\u0161ech pr\u016fchodek alespo\u0148 2,0 mm od kone\u010dn\u00e9ho okraje desky. Pokud si konstrukce vynucuje bli\u017e\u0161\u00ed pr\u016fchodky, pou\u017eijte ke zpevn\u011bn\u00ed trhac\u00ed podlo\u017eky. D\u00e9lka slzi\u010dky 0,5\u00d7 pr\u016fm\u011br podlo\u017eky zvy\u0161uje v\u00fdznamnou odolnost proti trhlin\u00e1m.<\/p>\n\n\n\n

        Konstrukce podlo\u017eky a otvor\u016f<\/h3>\n\n\n\n

        Na ka\u017edou pr\u016fchodku a podlo\u017eku SMD pou\u017eijte slzn\u00e9 kapky. T\u00edm se rozlo\u017e\u00ed mechanick\u00e9 nam\u00e1h\u00e1n\u00ed. Minim\u00e1ln\u00ed krou\u017eek by m\u011bl b\u00fdt 0,15 mm pro t\u0159\u00eddu spolehlivosti 3. Neumis\u0165ujte pr\u016fchodky pod rohy BGA, kde se p\u0159i tepeln\u00e9m cyklov\u00e1n\u00ed koncentruje nap\u011bt\u00ed.<\/p>\n\n\n\n

        P\u00e1jec\u00ed profil<\/h3>\n\n\n\n

        Keramika m\u00e1 vysokou tepelnou hmotnost a vodivost. P\u0159edeh\u0159\u00e1t\u00ed se st\u00e1v\u00e1 kritick\u00fdm. Na\u0161e mont\u00e1\u017en\u00ed d\u00edlna pou\u017e\u00edv\u00e1 rychlost n\u00e1b\u011bhu 2,5 \u00b0C za sekundu, nam\u00e1\u010den\u00ed p\u0159i 150-170 \u00b0C po dobu 90 sekund a \u0161pi\u010dkovou teplotu p\u0159etaven\u00ed 245 \u00b0C pro p\u00e1jku SAC305. Deska mus\u00ed z\u016fstat nad 217 \u00b0C pouze 45-60 sekund, aby nedo\u0161lo k p\u0159eh\u0159\u00e1t\u00ed citliv\u00fdch sou\u010d\u00e1stek. Pro THT pou\u017eijte p\u00e1je\u010dku s \u0159\u00edzen\u00fdm oh\u0159evem a desku lok\u00e1ln\u011b p\u0159edeh\u0159ejte. Nikdy nepou\u017e\u00edvejte p\u0159\u00edm\u00fd plamen.<\/p>\n\n\n\n

        Um\u00edst\u011bn\u00ed komponent a manipulace s nimi<\/h3>\n\n\n\n

        T\u011b\u017ek\u00e9 komponenty (transform\u00e1tory, v\u00fdkonn\u00e9 rezistory) um\u00edst\u011bte mimo hrany a rohy. U velk\u00fdch BGA bal\u00ed\u010dk\u016f pou\u017eijte podkladovou v\u00fdpl\u0148, abyste zvl\u00e1dli p\u0159\u00edpadn\u00fd rozd\u00edl CTE mezi keramickou deskou a organick\u00fdm substr\u00e1tem \u010dipu. P\u0159i ru\u010dn\u00ed manipulaci pou\u017e\u00edvejte pinzety s m\u011bkk\u00fdmi hroty bezpe\u010dn\u00e9 proti ESD. Keramick\u00e9 hrany jsou ostr\u00e9; pou\u017e\u00edvejte rukavice. Na\u0161i oper\u00e1to\u0159i pou\u017e\u00edvaj\u00ed k p\u0159esouv\u00e1n\u00ed velk\u00fdch desek vakuov\u00e1 skl\u00ed\u010didla.<\/p>\n\n\n\n

        \u0158\u00edzen\u00ed impedance a RF stopy<\/h3>\n\n\n\n

        Dielektrick\u00e1 konstanta keramiky (9,4-9,8) se li\u0161\u00ed od FR-4 (4,5). Rozm\u011bry stop v\u017edy p\u0159epo\u010d\u00edtejte pomoc\u00ed vhodn\u00e9ho \u0159e\u0161i\u010de pole, nikoliv obecn\u00e9ho kalkul\u00e1toru FR-4. Pro mikrop\u00e1sky 50 \u03a9 na hlin\u00edku 96% o tlou\u0161\u0165ce 0,635 mm je \u0161\u00ed\u0159ka stopy p\u0159ibli\u017en\u011b 0,6 mm. Uv\u00e1d\u00edme \u00fadaje o stack-up a testov\u00e1n\u00ed \u0159\u00edzen\u00e9 impedance pro diferenci\u00e1ln\u00ed p\u00e1ry do 20 GHz.<\/p>\n\n\n\n

        PTH a Via Fill<\/h3>\n\n\n\n

        B\u011bhem spole\u010dn\u00e9ho vypalov\u00e1n\u00ed vypl\u0148ujeme pr\u016fchodky vodivou pastou. U tlust\u00fdch vrstev se pr\u016fchodky vypl\u0148uj\u00ed dielektrikem nebo se nech\u00e1vaj\u00ed otev\u0159en\u00e9. Pokud pot\u0159ebujete vypln\u011bn\u00e9 a pokoven\u00e9 pr\u016fchodky, zadejte proveden\u00ed via-in-pad. Pro BGA s jemnou rozte\u010d\u00ed m\u016f\u017eeme povrch planarizovat brou\u0161en\u00edm.<\/p>\n\n\n\n

        Aplikace keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f<\/h2>\n\n\n\n

        Pam\u011b\u0165ov\u00e9 moduly a vysokorychlostn\u00ed digit\u00e1ln\u00ed pam\u011bti<\/h3>\n\n\n\n

        Vysokorychlostn\u00ed pam\u011b\u0165ov\u00e9 moduly DDR t\u011b\u017e\u00ed z n\u00edzk\u00fdch dielektrick\u00fdch ztr\u00e1t a tepeln\u00e9 stability keramiky. Na\u0161i z\u00e1kazn\u00edci pou\u017e\u00edvaj\u00ed desky LTCC k veden\u00ed 64bitov\u00fdch sb\u011brnic s minim\u00e1ln\u00edm zkreslen\u00edm. Konzistentn\u00ed dielektrick\u00e1 konstanta sni\u017euje inter-symbolov\u00e9 ru\u0161en\u00ed.<\/p>\n\n\n\n

        P\u0159ij\u00edmac\u00ed\/vys\u00edlac\u00ed moduly (RF)<\/h3>\n\n\n\n

        Satelitn\u00ed komunika\u010dn\u00ed vys\u00edla\u010de vy\u017eaduj\u00ed substr\u00e1ty s n\u00edzk\u00fdmi ztr\u00e1tami. Desky z oxidu hlinit\u00e9ho a AlN s laserov\u00fdmi pr\u016fchodkami o pr\u016fm\u011bru 0,06 mm umo\u017e\u0148uj\u00ed kompaktn\u00ed ant\u00e9ny s f\u00e1zovou ant\u00e9nn\u00ed soustavou. U satelitn\u00edho zesilova\u010de o v\u00fdkonu 50 W udr\u017euje deska z AlN \u0161pi\u010dkovou teplotu pod 150 \u00b0C. Konstrukce spolehliv\u011b fungovala ve vakuu bez konvek\u010dn\u00edho chlazen\u00ed.<\/p>\n\n\n\n

        V\u00edcevrstv\u00e9 propojovac\u00ed desky<\/h3>\n\n\n\n

        Pomoc\u00ed HTCC\/LTCC integrujeme a\u017e 30 vestav\u011bn\u00fdch pasivn\u00edch komponent do \u0161estivrstv\u00e9 desky. T\u00edm se stoh 4 desek FR-4 smrskne do jednoho keramick\u00e9ho modulu. Z\u00e1kazn\u00edk z leteck\u00e9ho sektoru sn\u00ed\u017eil hmotnost o 70% a zv\u00fd\u0161il hustotu p\u0159ipojen\u00ed 5\u00d7.<\/p>\n\n\n\n

        Analogov\u00e9\/digit\u00e1ln\u00ed desky plo\u0161n\u00fdch spoj\u016f se sm\u00ed\u0161en\u00fdm sign\u00e1lem<\/h3>\n\n\n\n

        Parazitn\u00ed kapacita po\u0161kozuje v\u00fdkon ADC. S LTCC jsme sn\u00ed\u017eili parazitn\u00ed kapacitu mezi analogovou a digit\u00e1ln\u00ed \u010d\u00e1st\u00ed p\u0159ibli\u017en\u011b o 90% ve srovn\u00e1n\u00ed se stejn\u00fdm obvodem na FR-4. \u0160umov\u00e1 hladina desky klesla o 12 dB.<\/p>\n\n\n\n

        Letectv\u00ed a kosmonautika<\/h3>\n\n\n\n

        \u0158\u00eddic\u00ed syst\u00e9my raket pracuj\u00ed p\u0159i teplot\u011b 300 \u00b0C. Na\u0161e desky HTCC vydr\u017e\u00ed tis\u00edce n\u00e1raz\u016f a vibrac\u00ed. Nen\u00ed pot\u0159eba konformn\u00ed povlak, proto\u017ee keramika je inertn\u00ed.<\/p>\n\n\n\n

        V\u00fdkonov\u00e1 elektronika pro automobilov\u00fd pr\u016fmysl a elektromobily<\/h3>\n\n\n\n

        Nab\u00edjec\u00ed stanice pro elektromobily pou\u017e\u00edv\u00e1 desku AlN DCB, kter\u00e1 zvl\u00e1d\u00e1 nep\u0159etr\u017eit\u011b 200 A. N\u00e1r\u016fst teploty z\u016fst\u00e1v\u00e1 pod 20 \u00b0C. Deska pro\u0161la kvalifikac\u00ed IATF 16949.<\/p>\n\n\n\n

        Vysoce v\u00fdkonn\u00e9 osv\u011btlen\u00ed LED<\/h3>\n\n\n\n

        10W LED dioda na na\u0161\u00ed desce z tlustovrstv\u00e9ho oxidu hlinit\u00e9ho vykazuje teplotu spoje 105 \u00b0C, co\u017e je v\u00fdrazn\u011b pod hranic\u00ed 120 \u00b0C. Stejn\u00e1 LED na MCPCB dosahuje 130 \u00b0C. Tato p\u0159\u00edm\u00e1 vazba zlep\u0161uje sv\u011bteln\u00fd tok a \u017eivotnost.<\/p>\n\n\n\n

        Po\u0159izov\u00e1n\u00ed keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f: N\u00e1klady, dodac\u00ed lh\u016fta a MOQ<\/h2>\n\n\n\n

        Re\u00e1ln\u00e1 \u010d\u00edsla v\u00e1m pomohou napl\u00e1novat rozpo\u010det a harmonogram projektu.<\/p>\n\n\n\n

        Rozpis n\u00e1klad\u016f na keramick\u00e9 PCB<\/h3>\n\n\n\n
          \n
        • Dvouvrstv\u00fd oxid hlinit\u00fd 96%, silnovrstv\u00fd st\u0159\u00edbrn\u00fd vodi\u010d, 100 \u00d7 80 mm, povrchov\u00e1 \u00faprava ENIG: $8-12\/ks po 100 kusech.<\/li>\n\n\n\n
        • 2-vrstv\u00fd oxid hlinit\u00fd 96%, m\u011bd\u011bn\u00fd tlustovrstv\u00fd materi\u00e1l: $10-15\/ks.<\/li>\n\n\n\n
        • 4vrstv\u00fd zlat\u00fd vodi\u010d LTCC, stejn\u00e1 velikost: $25-40\/ks (kv\u016fli v\u00edce procesn\u00edm krok\u016fm).<\/li>\n\n\n\n
        • 1-vrstv\u00e1 deska AlN DPC pro LED: $1-2 na cm\u00b2. Tyto ceny nezahrnuj\u00ed poplatky za n\u00e1stroje. N\u00e1stroje (s\u00edtov\u00e9 n\u00e1stroje, fotomasky) obvykle stoj\u00ed $500-1 000, kter\u00e9 amortizujeme v pr\u016fb\u011bhu objemu.<\/li>\n<\/ul>\n\n\n\n

          Minim\u00e1ln\u00ed objednac\u00ed mno\u017estv\u00ed (MOQ)<\/h3>\n\n\n\n

          Pro standardn\u00ed zpracov\u00e1n\u00ed tlust\u00e9 vrstvy p\u0159ij\u00edm\u00e1me objedn\u00e1vky ji\u017e od 10 kus\u016f. Pro LTCC a HTCC je MOQ 50 kus\u016f z d\u016fvodu pevn\u011b stanoven\u00e9 velikosti d\u00e1vky pro spoluspalov\u00e1n\u00ed. Prototypov\u00e9 s\u00e9rie jsou k dispozici s krat\u0161\u00edmi dodac\u00edmi lh\u016ftami.<\/p>\n\n\n\n

          P\u0159edb\u011b\u017en\u00e9 \u010dasy<\/h3>\n\n\n\n
            \n
          • Dvouvrstv\u00fd prototyp tlust\u00e9 vrstvy: 10-12 pracovn\u00edch dn\u016f (v\u010detn\u011b laserov\u00e9ho o\u0159ezu)<\/li>\n\n\n\n
          • \u010cty\u0159vrstv\u00fd prototyp LTCC: 18-20 pracovn\u00edch dn\u016f<\/li>\n\n\n\n
          • V\u00fdrobn\u00ed zak\u00e1zky: 15-25 dn\u00ed v z\u00e1vislosti na objemu<\/li>\n\n\n\n
          • Expedi\u010dn\u00ed slu\u017eba: 5-7 dn\u00ed pro silnou f\u00f3lii s pou\u017eit\u00edm p\u0159edem p\u0159ipraven\u00fdch velikost\u00ed polotovar\u016f.<\/li>\n<\/ul>\n\n\n\n

            Nab\u00eddku poskytujeme rychle do 24 hodin po obdr\u017een\u00ed soubor\u016f Gerber a stohov\u00e1n\u00ed.<\/p>\n\n\n\n

            Normy kvality a spolehlivosti pro keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f<\/h2>\n\n\n\n

            Nep\u0159edpokl\u00e1dejte, \u017ee v\u0161echny keramick\u00e9 desky jsou \u201cvysoce spolehliv\u00e9\u201d. Na certifikaci z\u00e1le\u017e\u00ed.<\/p>\n\n\n\n

            Certifikace IPC-6012 t\u0159\u00eddy 3<\/h3>\n\n\n\n

            Vyr\u00e1b\u00edme keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f podle normy IPC-6012 t\u0159\u00eddy 3 pro kritick\u00e9 aplikace. T\u0159\u00edda 3 vy\u017eaduje kontrolu pr\u016fchoz\u00edch pr\u016f\u0159ez\u016f 100% po tepeln\u00e9m \u0161oku. Na\u0161e tov\u00e1rna prov\u00e1d\u00ed 6\u00d7 testy tepeln\u00fdm \u0161okem od -65 \u00b0C do +150 \u00b0C a pot\u00e9 mikro\u00fasek pr\u016fchodek. Povolujeme nulov\u00e9 praskliny nebo odd\u011blen\u00ed vnit\u0159n\u00ed vrstvy. Krou\u017eek na vn\u011bj\u0161\u00edch podlo\u017ek\u00e1ch mus\u00ed b\u00fdt minim\u00e1ln\u011b 0,050 mm.<\/p>\n\n\n\n

            Dal\u0161\u00ed testy, kter\u00e9 prov\u00e1d\u00edme<\/h3>\n\n\n\n
              \n
            • P\u00e1jen\u00ed p\u0159i teplot\u011b 288 \u00b0C po dobu 10 sekund: \u017e\u00e1dn\u00e1 delaminace, \u017e\u00e1dn\u00e9 puch\u00fd\u0159e.<\/li>\n\n\n\n
            • Pevnost v tahu >5 gf pro podlo\u017eky s dr\u00e1t\u011bnou vazbou.<\/li>\n\n\n\n
            • Iontov\u00e1 kontaminace <1,5 \u00b5g\/cm\u00b2 ekvivalentu NaCl.<\/li>\n\n\n\n
            • Dielektrick\u00e9 v\u00fddr\u017en\u00e9 nap\u011bt\u00ed 500 V DC pro tlustou vrstvu, 1 500 V pro soub\u011b\u017en\u011b vypalovan\u00e9.<\/li>\n<\/ul>\n\n\n\n

              N\u00e1\u0161 z\u00e1vod je dr\u017eitelem certifik\u00e1t\u016f ISO 9001 a IATF 16949. Dodr\u017eujeme sm\u011brnice RoHS a REACH. U ka\u017ed\u00e9 v\u00edcevrstv\u00e9 desky LTCC pou\u017e\u00edv\u00e1me rentgenovou kontrolu, abychom ov\u011b\u0159ili jej\u00ed zarovn\u00e1n\u00ed.<\/p>\n\n\n\n

              V\u00fdzvy a \u00favahy<\/h2>\n\n\n\n

              Keramika se ned\u00e1 nahradit z\u00e1suvkou. Vy\u017eaduje promy\u0161len\u00fd design.<\/p>\n\n\n\n

                \n
              • K\u0159ehkost:<\/strong>\u00a0Keramika m\u016f\u017ee p\u0159i mechanick\u00e9m n\u00e1razu prasknout. Vyhn\u011bte se konzolov\u00e9 mont\u00e1\u017ei. Pou\u017eijte dr\u017e\u00e1ky nebo celou desku p\u0159ilepte ke kovov\u00e9mu nosi\u010di.<\/li>\n\n\n\n
              • Omezen\u00e1 velikost desky:<\/strong>\u00a0Maxim\u00e1ln\u00ed rozm\u011br jednoho kusu desky je p\u0159ibli\u017en\u011b 200 \u00d7 200 mm z d\u016fvodu deformace p\u0159i spoluspalov\u00e1n\u00ed. U v\u011bt\u0161\u00edch sestav je nutn\u00e9 pou\u017e\u00edt modul\u00e1rn\u00ed konstrukce.<\/li>\n\n\n\n
              • Dodac\u00ed lh\u016fta pro zak\u00e1zkov\u00e9 materi\u00e1ly:<\/strong>\u00a0U polotovar\u016f z oxidu berylnat\u00e9ho a AlN se n\u011bkdy prodlu\u017euje dodac\u00ed lh\u016fta od v\u00fdrobce substr\u00e1tu na 4-6 t\u00fddn\u016f. Pl\u00e1nujte v\u010das.<\/li>\n\n\n\n
              • Proces p\u00e1jen\u00ed:<\/strong>\u00a0Bez p\u0159edeh\u0159\u00e1t\u00ed m\u016f\u017ee tepeln\u00fd \u0161ok zp\u016fsobit prasknut\u00ed desky. V\u017edy p\u0159edeh\u0159\u00edvejte desku na teplotu do 100 \u00b0C od bodu t\u00e1n\u00ed p\u00e1jky.<\/li>\n\n\n\n
              • N\u00e1klady:<\/strong>\u00a0U v\u00fdrobk\u016f ur\u010den\u00fdch pro spot\u0159ebitele m\u016f\u017ee b\u00fdt keramika nadm\u011brn\u011b specifikov\u00e1na. Pou\u017e\u00edvejte ji pouze tam, kde se vyplat\u00ed tepeln\u00fd nebo RF v\u00fdkon.<\/li>\n<\/ul>\n\n\n\n

                \u010casto kladen\u00e9 ot\u00e1zky<\/h2>\n\n\n\n

                Lze p\u00e1jit na keramickou desku plo\u0161n\u00fdch spoj\u016f?<\/h3>\n\n\n\n

                Ano. P\u00e1jka dob\u0159e p\u0159ilne k povrchov\u00fdm \u00faprav\u00e1m, jako je ENIG, st\u0159\u00edbro-paladium nebo tlustovrstv\u00e1 m\u011b\u010f. Pou\u017eijte tavidlo na b\u00e1zi kalafuny a kontrolovan\u00fd p\u0159edeh\u0159ev, abyste se vyhnuli tepeln\u00e9mu \u0161oku. U LTCC se zlatou pastou naneseme na podlo\u017eky desku ENIG, abychom zajistili spr\u00e1vn\u00e9 sm\u00e1\u010dedlo p\u00e1jky.<\/p>\n\n\n\n

                Jak\u00e1 je dielektrick\u00e1 konstanta keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f?<\/h3>\n\n\n\n

                Hlin\u00edk 96% m\u00e1 dielektrickou konstantu 9,4-9,8, AlN asi 8,8, BeO 6,7. Pro VF konstrukce tato vy\u0161\u0161\u00ed hodnota umo\u017e\u0148uje u\u017e\u0161\u00ed stopy pro danou impedanci ve srovn\u00e1n\u00ed s FR-4.<\/p>\n\n\n\n

                Jak\u00e1 je maxim\u00e1ln\u00ed teplota pro keramick\u00e9 PCB?<\/h3>\n\n\n\n

                Desky z oxidu hlinit\u00e9ho a AlN mohou pracovat nep\u0159etr\u017eit\u011b p\u0159i teplot\u011b 350 \u00b0C. Desky SiC maj\u00ed teplotu vy\u0161\u0161\u00ed ne\u017e 800 \u00b0C. Teplotn\u00ed limit obvykle vych\u00e1z\u00ed z kovov\u00e9 pasty (zlato se netav\u00ed, ale st\u0159\u00edbro m\u016f\u017ee p\u0159i vysok\u00e9 teplot\u011b migrovat p\u0159i stejnosm\u011brn\u00e9m zkreslen\u00ed) a v\u0161ech osazen\u00fdch sou\u010d\u00e1stek.<\/p>\n\n\n\n

                Jak se \u0159e\u017ee keramick\u00e1 deska plo\u0161n\u00fdch spoj\u016f?<\/h3>\n\n\n\n

                Pou\u017e\u00edv\u00e1me laserov\u00e9 r\u00fdhov\u00e1n\u00ed nebo kr\u00e1jen\u00ed diamantovou pilou. Ru\u010dn\u011b m\u016f\u017eete r\u00fdhovat a l\u00e1mat rovn\u00e9 linie, ale po\u010d\u00edtejte s hrub\u00fdmi hranami. U prototyp\u016f objedn\u00e1vejte desky s fin\u00e1ln\u00edm obrysov\u00fdm fr\u00e9zov\u00e1n\u00edm proveden\u00fdm ve v\u00fdrob\u011b.<\/p>\n\n\n\n

                Jak siln\u00e1 je keramick\u00e1 deska plo\u0161n\u00fdch spoj\u016f?<\/h3>\n\n\n\n

                Standardn\u00ed tlou\u0161\u0165ky substr\u00e1tu jsou 0,25 mm, 0,38 mm, 0,5 mm, 0,635 mm, 1,0 mm. Pro vysokonap\u011b\u0165ovou izolaci je mo\u017en\u00e9 pou\u017e\u00edt siln\u011bj\u0161\u00ed substr\u00e1ty a\u017e do tlou\u0161\u0165ky 2,0 mm.<\/p>\n\n\n\n

                Jak\u00e1 je cena keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f ve srovn\u00e1n\u00ed s deskou FR-4?<\/h3>\n\n\n\n

                Keramick\u00e1 deska stoj\u00ed 5-30\u00d7 v\u00edce na jednotku plochy ne\u017e deska FR-4, ale n\u00e1klady na \u00farovni syst\u00e9mu mohou b\u00fdt ni\u017e\u0161\u00ed, pokud eliminujete hardware pro \u0159\u00edzen\u00ed teploty a zv\u00fd\u0161\u00edte spolehlivost.<\/p>\n\n\n\n

                Mohou m\u00edt keramick\u00e9 desky plo\u0161n\u00fdch spoj\u016f v\u00edce ne\u017e 2 vrstvy?<\/h3>\n\n\n\n

                Ano. HTCC a LTCC snadno podporuj\u00ed 4 a\u017e 10 vrstev. Pasivn\u00ed komponenty vkl\u00e1d\u00e1me dovnit\u0159, co\u017e zvy\u0161uje funk\u010dn\u00ed hustotu.<\/p>\n\n\n\n

                Kl\u00ed\u010dov\u00e9 poznatky<\/h2>\n\n\n\n
                  \n
                • Keramick\u00e9 substr\u00e1ty PCB (oxid hlinit\u00fd, AlN atd.) vedou teplo 100\u00d7 rychleji ne\u017e FR-4.<\/li>\n\n\n\n
                • N\u00edzk\u00e1 CTE se shoduje s k\u0159em\u00edkov\u00fdmi a keramick\u00fdmi pouzdry, co\u017e zabra\u0148uje \u00fanav\u011b p\u00e1jky.<\/li>\n\n\n\n
                • Zvolte spr\u00e1vn\u00fd v\u00fdrobn\u00ed proces: tlust\u00e1 vrstva pro n\u00edzkou cenu, LTCC pro p\u0159esnost\/RF, HTCC pro extr\u00e9mn\u011b vysokoteplotn\u00ed v\u00edcevrstv\u00e9 materi\u00e1ly.<\/li>\n\n\n\n
                • Pou\u017eijte pravidla DFM: udr\u017eujte pr\u016fchodky 2 mm od okraj\u016f, pou\u017e\u00edvejte slzi\u010dky, p\u0159edeh\u0159\u00edvejte p\u00e1jen\u00ed.<\/li>\n\n\n\n
                • Zohledn\u011bte celkov\u00e9 n\u00e1klady, nejen cenu desky; keramika \u0161et\u0159\u00ed pen\u00edze za chlazen\u00ed a poruchy v ter\u00e9nu.<\/li>\n\n\n\n
                • Spolupracujte s v\u00fdrobn\u00edm z\u00e1vodem, kter\u00fd poskytuje certifikaci IPC-6012 t\u0159\u00eddy 3 a re\u00e1ln\u00e9 dodac\u00ed lh\u016fty.<\/li>\n<\/ul>\n\n\n\n

                  N\u00e1\u0161 t\u00fdm m\u00e1 v\u00edce ne\u017e 15 let zku\u0161enost\u00ed s v\u00fdrobou keramick\u00fdch desek plo\u0161n\u00fdch spoj\u016f. Podpo\u0159\u00edme v\u00e1s od v\u00fdb\u011bru materi\u00e1lu a\u017e po kontrolu prvn\u00edho v\u00fdrobku. Za\u0161lete sv\u00e9 n\u00e1vrhov\u00e9 soubory nebo po\u017eadavky na\u0161im in\u017een\u00fdr\u016fm, aby v\u00e1m zdarma posoudili n\u00e1vrh a odhadli n\u00e1klady. Dod\u00e1v\u00e1me spolehliv\u00e9 keramick\u00e9 desky, kter\u00e9 funguj\u00ed i v t\u011bch nejn\u00e1ro\u010dn\u011bj\u0161\u00edch podm\u00ednk\u00e1ch.<\/p>","protected":false},"excerpt":{"rendered":"

                  What Is a Ceramic PCB? A ceramic PCB uses an inorganic ceramic substrate instead of traditional FR\u20114 fiberglass.\u00a0Common substrate materials […]<\/p>","protected":false},"author":1,"featured_media":4984,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_uag_custom_page_level_css":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[36,30],"tags":[118,345,27,37,29],"class_list":["post-4981","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-design","category-pcb-manufacturers","tag-ceramic-pcb","tag-fr-4-pcb","tag-pcb-assembly","tag-pcb-design","tag-pcb-manufacturers"],"spectra_custom_meta":{"_edit_lock":["1779960816:1"],"rank_math_internal_links_processed":["1"],"rank_math_primary_category":["36"],"rank_math_seo_score":["90"],"rank_math_title":["Ceramic PCB: Complete Guide to Design & Manufacturing"],"rank_math_description":["Discover ceramic PCB manufacturing and DFM rules. 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