{"id":2364,"date":"2025-09-02T08:30:07","date_gmt":"2025-09-02T08:30:07","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=2364"},"modified":"2025-09-25T06:49:30","modified_gmt":"2025-09-25T06:49:30","slug":"ceramic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/da\/pcb-manufacturer\/ceramic-pcb\/","title":{"rendered":"Keramiske printkort: Materialer, termisk design og anvendelser"},"content":{"rendered":"
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Et keramisk substrat er en s\u00e6rlig type printplade, der fremstilles ved at binde kobberfolie direkte til overfladen af en oxid- eller keramikplade ved h\u00f8j temperatur. Kobberet forbindes med keramikken ved en h\u00f8jtemperaturproces, s\u00e5 metallet og keramikken danner en stabil base for kredsl\u00f8b.<\/div>\n
 <\/div>\n
\"ceramic<\/div>\n
 <\/div>\n

Egenskaber ved keramisk PCB<\/h2>\n

Mekaniske egenskaber (hvordan kredsl\u00f8bsspor dannes)<\/h3>\n
a. De har h\u00f8j mekanisk styrke. De kan holde p\u00e5 dele og fungerer ogs\u00e5 som st\u00f8ttestrukturer.
b. De er nemme at bearbejde. De holder n\u00f8jagtige dimensioner. De kan laves i mange lag.
c. Deres overflade er glat. De er ikke sk\u00e6ve, b\u00f8jede eller har sm\u00e5 revner.<\/div>\n

Elektriske egenskaber<\/h3>\n
a. De har h\u00f8j isolationsmodstand og h\u00f8j gennembrudssp\u00e6nding. Det beskytter kredsl\u00f8bene mod kortslutning og h\u00f8jsp\u00e6ndingsskader.
b. De har lav dielektrisk konstant og lavt dielektrisk tab. Det hj\u00e6lper signaler med at passere med mindre tab.
c. Deres ydeevne forbliver stabil ved h\u00f8je temperaturer og h\u00f8j luftfugtighed. Det er med til at sikre p\u00e5lidelighed under vanskelige forhold.<\/div>\n

Termiske egenskaber<\/h3>\n
a. De har en h\u00f8j varmeledningsevne. Det hj\u00e6lper med at flytte varmen v\u00e6k fra varme dele.
b. Deres varmeudvidelseskoefficient kan matche besl\u00e6gtede materialer, is\u00e6r silicium. Dette match reducerer stress, n\u00e5r dele opvarmes og afk\u00f8les.
c. De har god varmebestandighed. De forbliver stabile ved h\u00f8je temperaturer.<\/div>\n

Andre ejendomme<\/h3>\n
a. De er kemisk stabile. De er nemme at metallisere. Kredsl\u00f8bsm\u00f8nstre kl\u00e6ber godt til dem.
b. De absorberer ikke fugt. De modst\u00e5r olie og kemiske angreb. De afgiver kun lidt str\u00e5ling.
c. De anvendte materialer er uskadelige og ikke giftige. Deres krystalstruktur \u00e6ndrer sig ikke i arbejdstemperaturomr\u00e5det.
d. Der er rigeligt med r\u00e5materialer. Teknologien er moden. De er nemme at fremstille, og prisen er lav.<\/div>\n

Metoder til fremstilling af keramiske substrater<\/h2>\n
F\u00f8r keramikken br\u00e6ndes, er der fire almindelige formningsmetoder. Disse er pulverpresning (som kan v\u00e6re formpresning eller isostatisk presning), ekstrudering, b\u00e5ndst\u00f8bning og spr\u00f8jtest\u00f8bning. Blandt disse bruges b\u00e5ndst\u00f8bning oftere i de senere \u00e5r til LSI-pakker og hybridkredsl\u00f8bssubstrater, fordi det er lettere at lave mange lag, og det har h\u00f8jere produktionseffektivitet.<\/div>\n
Almindelige procesruter er disse tre:<\/div>\n
    \n
  1. Stak lag - varmpres - fjern bindemiddel - br\u00e6nd basisarket - form kredsl\u00f8bsm\u00f8nstre - br\u00e6nd kredsl\u00f8bet.<\/li>\n
  2. Stak lag - print kredsl\u00f8bsm\u00f8nsteret p\u00e5 overfladen - varmpres - fjern bindemiddel - sambr\u00e6nd.<\/li>\n
  3. Print kredsl\u00f8bsm\u00f8nster - stak - varmpres - fjern bindemiddel - sambr\u00e6nd.<\/li>\n<\/ol>\n

    Metallisering af keramisk PCB<\/h2>\n

    a. Tykfilmsmetoden:<\/h3>\n
    I tykfilmsmetoden dannes ledere (kredsl\u00f8bssporene) og modstande p\u00e5 keramikken ved hj\u00e6lp af serigrafi. Efter printning sintres delene for at danne kredsl\u00f8bet og kontaktpuderne. De bindemidler, der bruges til at fiksere det trykte metal, omfatter glastype, oxidtype og blandede glas-oxidtyper.<\/div>\n

    b. Tyndfilmsmetoden:<\/h3>\n
    Tyndfilm bruger vakuummetoder som fordampning, ionplettering eller sputtering til at p\u00e5f\u00f8re metal. Fordi tyndfilm aflejrer metal fra gasfasen, kan ethvert metal i princippet aflejres. Ogs\u00e5 ethvert substrat kan i princippet metalliseres p\u00e5 denne m\u00e5de. Men den termiske udvidelse af metalfilmen og det keramiske substrat skal matche s\u00e5 meget som muligt. Det er ogs\u00e5 vigtigt at \u00f8ge metallagets vedh\u00e6ftning til keramikken.<\/div>\n

    c. Sambr\u00e6ndingsmetode:<\/h3>\n
    F\u00f8r br\u00e6ndingen trykkes ildfaste metalpastaer af Mo, W og lignende metaller p\u00e5 de ubr\u00e6ndte keramiske plader. Stakken afrenses derefter og br\u00e6ndes, s\u00e5 keramikken og metallet danner en integreret struktur. Denne metode har disse funktioner:
    \u25a0 Det kan danne meget fine kredsl\u00f8bslinjer, og det er nemt at lave mange lag, s\u00e5 det er muligt at lave ledninger med h\u00f8j t\u00e6thed.
    \u25a0 Fordi isolatoren og lederen er formet sammen, er hermetisk forsegling i pakker mulig.
    Ved at v\u00e6lge den rigtige sammens\u00e6tning, formningstryk og sintringstemperatur kan sintringskrympningen kontrolleres. Is\u00e6r n\u00e5r der fremstilles et substrat med nul krympning i planet, \u00e5bner det op for brug i BGA, CSP og bare chip-emballage med h\u00f8j densitet.<\/div>\n

    Typer af keramiske substrater<\/h2>\n

    Substrat af aluminiumoxid (Al\u2082O\u2083)<\/h3>\n
    a. R\u00e5materiale: Al\u2082O\u2083 fremstilles ofte ved at Bayer-processen<\/a>. I denne metode er r\u00e5materialet bauxit, som indeholder hydratiserede aluminiumoxider og besl\u00e6gtede forbindelser.
    b. Fremstilling: Al\u2082O\u2083-keramik dannes normalt ved at stable ubr\u00e6ndte plader. Der bruges ofte et bindemiddel som polyvinylbutyral (PVB). Br\u00e6ndingstemperaturen varierer med tilsatte sintringshj\u00e6lpemidler og er normalt 1550-1600 \u00b0C. Metalliseringsmetoder til Al\u2082O\u2083 er hovedsageligt tykfilms- og sambr\u00e6ndingsmetoder. Pastaerne og procesteknologien er modne. De opfylder mange anvendelsesbehov i dag.
    c. Anvendelser: Substrater til hybride integrerede kredsl\u00f8b, substrater til LSI-pakker og substrater til flerlagskredsl\u00f8b.<\/div>\n
     <\/div>\n
    \"Alumina<\/div>\n
     <\/div>\n

    Mullit-substrat (3Al\u2082O\u2083-2SiO\u2082)<\/h3>\n
    Mullit er en af de mest stabile krystallinske faser i Al\u2082O\u2083-SiO\u2082-systemet. Sammenlignet med Al\u2082O\u2083 har mullit en smule lavere mekanisk styrke og lavere varmeledningsevne, men dens dielektriske konstant er lavere. Denne lavere dielektriske konstant kan hj\u00e6lpe med at forbedre signalhastigheden. Dens varmeudvidelseskoefficient er ogs\u00e5 lav, hvilket reducerer den termiske belastning p\u00e5 den monterede LSI. Udvidelsesforskellen i forhold til ledende metaller som Mo og W er ogs\u00e5 mindre, s\u00e5 sambr\u00e6nding medf\u00f8rer mindre stress mellem metallet og keramikken.<\/div>\n

    Substrat af aluminiumnitrid (AlN)<\/h3>\n
    a. R\u00e5materiale: AlN er ikke et naturligt mineral. Det er et menneskeskabt materiale, der f\u00f8rst blev syntetiseret i 1800-tallet. Typiske AlN-pulvere fremstilles ved reduktionsnitrering eller direkte nitrering. Reduktionsnitreringsmetoden starter med Al\u2082O\u2083 og bruger kulstof af h\u00f8j renhed til at reducere det, hvorefter det reagerer med nitrogen for at danne AlN. Den direkte nitreringsmetode reagerer Al-pulver med N\u2082 for at danne AlN direkte.
    b. Fremstilling: De samme formningsmetoder, der bruges til Al\u2082O\u2083-substrater, kan bruges til AlN. Den mest anvendte metode er at stable ubr\u00e6ndte plader. Til dette blandes AlN-pulver, organiske bindemidler, opl\u00f8sningsmiddel og et overfladeaktivt stof til en keramisk opsl\u00e6mning. Opsl\u00e6mningen b\u00e5ndst\u00f8bes, stables, varmpresses, afbinder og br\u00e6ndes derefter for at fremstille AlN-substratet.
    c. AlN-substratets egenskaber: AlN har en varmeledningsevne, der er mere end ti gange s\u00e5 h\u00f8j som Al\u2082O\u2083. Dets varmeudvidelseskoefficient (CTE) matcher silicium. Sammenlignet med Al\u2082O\u2083 har AlN h\u00f8jere isolationsmodstand og h\u00f8jere nedbrydningssp\u00e6nding. Dets dielektriske konstant er lavere. Disse egenskaber g\u00f8r AlN meget v\u00e6rdifuldt til pakkesubstrater.
    d. Anvendelser: Bruges til VHF-b\u00e5ndets effektforst\u00e6rkermoduler, h\u00f8jeffektsenheder og laserdiodesubstrater.<\/div>\n
     <\/div>\n
    \"Aluminum<\/div>\n
     <\/div>\n

    Substrat af siliciumcarbid (SiC)<\/h3>\n
    a. R\u00e5materiale: SiC er ikke et naturligt mineral. Det fremstilles ved at blande silica, koks og lidt salt i pulverform. Blandingen opvarmes i en grafitovn til over 2000 \u00b0C for at reagere og danne \u03b1-SiC. Derefter kan SiC renses ved sublimering for at f\u00e5 en m\u00f8rkegr\u00f8n blok af polykrystallinsk materiale.
    b. Fremstilling: SiC har meget h\u00f8j kemisk og termisk stabilitet, s\u00e5 normale br\u00e6ndingsmetoder g\u00f8r det sv\u00e6rt at fort\u00e6tte. Der er brug for sintringshj\u00e6lpemidler og s\u00e6rlige br\u00e6ndingsmetoder. Vakuumvarmpresning er almindeligt anvendt.
    c. SiC's egenskaber: En vigtig egenskab er dens meget store termiske diffusionskoefficient. Den kan endda v\u00e6re st\u00f8rre end kobber. Dens varmeudvidelse er t\u00e6ttere p\u00e5 silicium. Men SiC har nogle ulemper. Dets dielektriske konstant er relativt h\u00f8j, og dets nedbrydningssp\u00e6nding er ikke s\u00e5 god som nogle andre keramiske materialer.
    d. Anvendelser: SiC-substrater bruges, hvor der er brug for stor varmespredning, og hvor sp\u00e6ndingen ikke er h\u00f8j. De bruges til VLSI-k\u00f8lepakker, h\u00f8jhastigheds- og h\u00f8jintegrationslogik-LSI med k\u00f8leplader, store computere og laserdiodesubstrater til optisk kommunikation.<\/div>\n

    Beryllia-substrat (BeO)<\/h3>\n
    BeO har en varmeledningsevne, der er mange gange h\u00f8jere end Al\u2082O\u2083. Det fungerer godt til kredsl\u00f8b med h\u00f8j effekt. Dets dielektriske konstant er lav, s\u00e5 det er velegnet til h\u00f8jfrekvente kredsl\u00f8b. BeO-substrater fremstilles normalt ved t\u00f8rpresning. De kan ogs\u00e5 fremstilles ved hj\u00e6lp af ubr\u00e6ndte plader med sm\u00e5 tils\u00e6tninger af MgO eller Al\u2082O\u2083. Da BeO-pulver er giftigt, giver BeO-produkter anledning til milj\u00f8- og sundhedsm\u00e6ssige bekymringer. I Japan er produktion af BeO-substrat ikke tilladt, og BeO skal importeres fra steder som USA.<\/div>\n

    Sammenligning af nogle keramiske materialer og substrattyper<\/h2>\n
    Ud fra struktur og fremstillingsmetoder kan keramiske substrater grupperes i HTCC, LTCC, TFC, DBC, DPC og s\u00e5 videre. Keramiske substrater bruges mere og mere i elektronisk emballage og i effektelektronik som IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED og CPV (concentrator photovoltaic) p\u00e5 grund af deres gode varmeledningsevne, varmebestandighed, isolering, lave termiske ekspansion og faldende omkostninger.<\/div>\n
    Almindelige keramiske basismaterialer er BeO, Al\u2082O\u2083, AlN og Si\u2083N\u2084. Blandt disse har Si\u2083N\u2084 meget h\u00f8j elektrisk isolering og kemisk stabilitet. Det har ogs\u00e5 god termisk stabilitet og h\u00f8j mekanisk styrke. Det kan bruges til printkort med h\u00f8j t\u00e6thed og h\u00f8j integration.<\/div>\n

    Co-fyret keramisk multilayer ved h\u00f8j temperatur (HTCC)<\/h3>\n
    HTCC er h\u00f8jtemperatur co-br\u00e6ndt keramisk substrat. For at fremstille HTCC blandes f\u00f8rst keramisk pulver som Al\u2082O\u2083 eller AlN med et organisk bindemiddel. Blandingen laves til en pasta og formes derefter til plader ved hj\u00e6lp af et barberblad eller lignende metoder. De t\u00f8rrede plader bliver til gr\u00f8nne legemer. Der bores huller til vias, og der trykkes lederpastaer til ledningsf\u00f8ring og udfyldning af vias. Derefter stables de gr\u00f8nne plader og placeres i en h\u00f8jtemperaturovn p\u00e5 omkring 1600 \u00b0C til sintring. Fordi sintringstemperaturen er h\u00f8j, er valget af ledermetaller begr\u00e6nset. Man bruger metaller med h\u00f8je smeltepunkter, men lavere ledningsevne, som f.eks. wolfram, molybd\u00e6n og mangan. Omkostningerne er h\u00f8je, og varmeledningsevnen ligger p\u00e5 ca. 20-200 W\/(m-\u00b0C).<\/div>\n

    Co-fyret keramisk PCB ved lav temperatur (LTCC)<\/h3>\n
    LTCC er co-fyret keramik ved lav temperatur. Dens fremstillingstrin svarer til HTCC. Forskellen er, at Al\u2082O\u2083-pulveret indeholder 30-50% i masse af glas med lavt smeltepunkt. Det s\u00e6nker br\u00e6ndingstemperaturen til ca. 850-900 \u00b0C. Fordi br\u00e6ndingstemperaturen er lav, kan ledende metaller med god ledningsevne som guld og s\u00f8lv bruges til elektroder og spor. LTCC bruger serigrafi til metallinjer. Denne metode kan medf\u00f8re justeringsfejl p\u00e5 grund af mesh-str\u00e6k. N\u00e5r flere lag stables og br\u00e6ndes sammen, kan der ogs\u00e5 opst\u00e5 forskellig krympning, og det g\u00e5r ud over udbyttet. For at \u00f8ge LTCC's varmeledningsevne kan der tilf\u00f8jes termiske eller ledende vias i komponentomr\u00e5derne, men det \u00f8ger omkostningerne.<\/div>\n

    Keramisk substrat med tyk film (TFC)<\/h3>\n
    Sammenlignet med LTCC og HTCC er TFC et efterbr\u00e6ndt keramisk substrat. Det bruger serigrafi til at p\u00e5f\u00f8re metalpasta p\u00e5 den keramiske overflade. Efter t\u00f8rring br\u00e6ndes delen ved h\u00f8j temperatur (700-800 \u00b0C). Metalpastaer er lavet af metalpulver, organisk harpiks og glas. Efter br\u00e6ndingen br\u00e6nder harpiksen af, og det lag, der er tilbage, er for det meste metal bundet af et glasagtigt kl\u00e6bemiddel p\u00e5 den keramiske overflade. Det br\u00e6ndte metallags tykkelse er typisk 10-20 \u03bcm, og den mindste linjebredde er ca. 0,3 mm. Fordi teknologien er moden, processen er enkel, og omkostningerne er lave, bruges TFC, hvor der ikke er behov for stor m\u00f8nsterpr\u00e6cision.<\/div>\n

    Direkte bundet kobberkeramisk PCB (DBC)<\/h3>\n
    DBC fremstilles ved co-sintring eller eutektisk binding af kobberfolie til en keramisk plade ved h\u00f8j temperatur (ca. 1065 \u00b0C). Efter limning dannes kredsl\u00f8bsm\u00f8nstre ved \u00e6tsning. Da kobberfolie har god elektrisk og termisk ledning, og Al\u2082O\u2083 kan kontrollere udvidelsen af Cu-Al\u2082O\u2083-Cu-kompositten, har DBC en termisk udvidelse, der ligger t\u00e6t p\u00e5 aluminiumoxid. DBC har god varmeledning, st\u00e6rk isolering og h\u00f8j p\u00e5lidelighed. Det er meget brugt i IGBT-, laserdiode- og CPV-emballage. DBC har ogs\u00e5 ulemper. Den eutektiske reaktion ved h\u00f8j temperatur mellem Cu og Al\u2082O\u2083 kr\u00e6ver streng kontrol af udstyr og proces, s\u00e5 omkostningerne er h\u00f8jere. Der kan dannes mikroporer mellem Al\u2082O\u2083 og Cu, hvilket s\u00e6nker modstanden mod termisk chok. Kobberfolie kan vride sig ved h\u00f8j temperatur, s\u00e5 kobbertykkelsen p\u00e5 DBC er normalt mere end 100 \u03bcm. \u00c6tsning bruges ogs\u00e5 til at danne m\u00f8nstre, s\u00e5 den mindste linjebredde er generelt mere end 100 \u03bcm.<\/div>\n
     <\/div>\n
    \"DBC\"<\/div>\n
     <\/div>\n

    Direkte belagt kobberkeramisk PCB (DPC)<\/h3>\n
    DPC starter med at reng\u00f8re og forbehandle den keramiske plade. Derefter afs\u00e6ttes et Ti\/Cu seed-lag ved vakuumforst\u00f8vning p\u00e5 substratets overflade. Fotolitografi, udvikling og \u00e6tsning bruges til at danne kredsl\u00f8bsm\u00f8nsteret. Derefter bruges elektroplettering eller kemisk plettering til at \u00f8ge kredsl\u00f8bets tykkelse. N\u00e5r fotoresisten er fjernet, er substratet f\u00e6rdigt. DPC har disse fordele: Lavtemperaturproces (under 300 \u00b0C), s\u00e5 man undg\u00e5r ulemperne ved h\u00f8je temperaturer p\u00e5 materialer og kredsl\u00f8b og s\u00e6nker produktionsomkostningerne. Brug af tyndfilm og fotolitografi g\u00f8r metallinjerne p\u00e5 substratet finere. S\u00e5 DPC er velegnet til indkapslinger, der kr\u00e6ver stor justeringsn\u00f8jagtighed. Men DPC har ogs\u00e5 ulemper. Den elektropletterede kobbertykkelse er begr\u00e6nset, og elektropletteringsaffald kan for\u00e5rsage forurening. Vedh\u00e6ftningen mellem metallag og keramik er lavere, s\u00e5 produktets p\u00e5lidelighed kan v\u00e6re mindre.<\/div>\n

    Noter om brug og udv\u00e6lgelse<\/h2>\n
    N\u00e5r du v\u00e6lger et keramisk substrat, skal du matche materialet med applikationens behov. Hvis du har brug for h\u00f8j varmeledningsevne og en varmeudvidelse t\u00e6t p\u00e5 silicium, kan AlN eller SiC v\u00e6re det bedste. Hvis omkostninger og moden forarbejdning betyder noget, er Al\u2082O\u2083 et godt valg. Hvis du har brug for fine linjer og behandling ved lav temperatur, kan DPC og LTCC fungere. Hvis du har brug for flerlagsledninger med h\u00f8j t\u00e6thed og hermetisk forsegling, kan co-firede ruter som LTCC eller HTCC med co-sintret metal v\u00e6re det rigtige.<\/div>\n
    Almindelige anvendelsesomr\u00e5der omfatter effektmoduler, RF-effektforst\u00e6rkere, laserdiodemoduler, h\u00f8jeffekt-LED'er og LSI-emballage med h\u00f8j densitet. Effektelektronik har gavn af keramiske substrater, fordi de flytter varmen godt og bevarer isolering og mekanisk styrke under termisk stress. RF-enheder f\u00e5r gavn af lavt dielektrisk tab og stabile dielektriske egenskaber. H\u00f8jt\u00e6thedsemballage har fordel af muligheden for at lave fine linjer og stable mange lag med god justeringskontrol, hvis processen er egnet.<\/div>\n

    Afvejninger i produktionen og praktiske punkter<\/h2>\n
    Hver keramiktype og hver proces har kompromiser. HTCC bruger h\u00f8j fyringstemperatur og bruger derfor ildfaste metaller som ledere. Det begr\u00e6nser ledningsevnen og \u00f8ger omkostningerne, men HTCC kan v\u00e6re meget robust ved h\u00f8je temperaturer. LTCC s\u00e6nker br\u00e6ndingstemperaturen ved at tils\u00e6tte glas, s\u00e5 der kan bruges bedre ledere, men LTCC kan have problemer med krympning og justering i flere lag. TFC er billigt og enkelt, men det kan ikke give meget fine m\u00f8nstre. DBC giver fremragende varmespredning med tykt kobber, men dets m\u00f8nsterbegr\u00e6nsning og produktionsomkostninger kan v\u00e6re et problem. DPC giver mulighed for fine m\u00f8nstre og behandling ved lave temperaturer, men man skal v\u00e6re opm\u00e6rksom p\u00e5 vedh\u00e6ftning og spildkontrol.<\/div>\n

    Co-firing vs post-firing metallisering<\/h3>\n
    Co-firing betyder, at man printer metalpasta p\u00e5 den gr\u00f8nne keramik og br\u00e6nder det hele sammen. P\u00e5 den m\u00e5de kan man lave meget sm\u00e5 detaljer og \u00e6gte flerlagsledninger. Det lader ogs\u00e5 keramikken og metallet blive til \u00e9n integreret krop, hvilket hj\u00e6lper med hermetisk forsegling. Men sambr\u00e6nding kr\u00e6ver omhyggelig kontrol af materialerne for at matche krympning og sintring. Metallisering efter br\u00e6ndingen, som tyk eller tynd film p\u00e5 br\u00e6ndt keramik, undg\u00e5r problemer med krympning ved samsintring. Det kan v\u00e6re nemmere ved behov for enkeltlag eller enkle dobbeltlag. Men efterbr\u00e6ndte metoder opn\u00e5r m\u00e5ske ikke den samme ledningst\u00e6thed og kan have forskellige vedh\u00e6ftnings- eller termiske egenskaber.<\/div>\n

    Typiske eksempler p\u00e5 procesflow (kort resum\u00e9)<\/h2>\n
      \n
    1. For co-firede flerlagssubstrater: lav keramisk opsl\u00e6mning, tape-st\u00f8bning, bor vias i gr\u00f8n tape, print lederpasta ved hj\u00e6lp af sk\u00e6rm, stak tape, pres og afbind, og br\u00e6nd derefter. Efter br\u00e6ndingen udf\u00f8res den endelige behandling som pad-metallisering og kredsl\u00f8bs\u00e6tsning, hvis det er n\u00f8dvendigt.<\/li>\n
    2. Til tyk film p\u00e5 keramik: brug br\u00e6ndt keramisk substrat, serigrafisk leder- og modstandspasta, br\u00e6nd ved 700-800 \u00b0C, trim derefter modstande og tilf\u00f8j de sidste metalpuder.<\/li>\n
    3. Til DPC: Reng\u00f8r keramik, aflejr Ti\/Cu-fr\u00f8 ved hj\u00e6lp af sputter, lav et m\u00f8nster af fotoresist, \u00e6ts fr\u00f8et for at lave et m\u00f8nster, elektroplade for at dyrke kobber, strip resist og endelig reng\u00f8ring.<\/li>\n<\/ol>\n

      Sammenfatning<\/strong><\/h2>\n
      Keramiske printkort er en klasse af substratmaterialer, der giver unikke styrker til elektronisk indpakning. De tilbyder gode termiske baner, stabil elektrisk opf\u00f8rsel ved temperatur og god mekanisk styrke. Forskellige keramiske valg og forskellige metalliseringsruter giver designere mulighed for at afbalancere omkostninger, termisk ydeevne, elektrisk ydeevne og behov for fine linjem\u00f8nstre. Derfor bruges keramiske substrater i vid udstr\u00e6kning i effektelektronik, RF-moduler, laser- og diodepakker, h\u00f8jeffekt-LED'er og mange andre omr\u00e5der med h\u00f8j t\u00e6thed.<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t\t\t\t
      <\/div>\n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t
      \n\t\t\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t

      Ofte stillede sp\u00f8rgsm\u00e5l<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tHvilke typer keramiske materialer bruges ofte?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      De mest almindelige er aluminiumoxid (Al\u2082O\u2083) til almindelig brug og aluminiumnitrid (AlN) til h\u00f8jere varmeledningsevne; andre specialiserede keramer (f.eks. siliciumcarbid) bruges til nichebehov med h\u00f8j effekt eller h\u00f8j temperatur.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tHvilke fremstillingsprocesser bruges til keramiske printkort?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Keramiske printkort fremstilles ved hj\u00e6lp af processer som tykfilmsprintning, tyndfilmsaflejring, laserbearbejdning og metallisering (kobber eller s\u00f8lv), efterfulgt af br\u00e6nding og efterbehandling.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tHvad er de st\u00f8rste fordele ved keramiske printkort i forhold til FR-4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Vigtige fordele: meget bedre varmeledningsevne (varmeafledning), lavere varmeudvidelseskoefficient (CTE), h\u00f8jtemperaturtolerance og fremragende elektrisk isolering - hvilket g\u00f8r dem ideelle til LED'er, effektelektronik og RF-\/h\u00f8jfrekvensapplikationer.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tEr keramiske printkort dyrere?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ja - materialeomkostninger og specialiserede processer (br\u00e6nding, laserbearbejdning, metallisering) g\u00f8r typisk keramiske printkort dyrere end standard FR-4; men til design med h\u00f8j effekt eller h\u00f8j p\u00e5lidelighed kan de reducere systemomkostningerne ved at forbedre ydeevnen og levetiden.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tKan keramiske printkort bruges til h\u00f8jfrekvente\/RF-applikationer?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ja, det er det. Keramiske substrater har stabile dielektriske egenskaber og lavt tab ved h\u00f8je frekvenser, hvilket g\u00f8r dem til et godt valg til RF- og mikrob\u00f8lgekredsl\u00f8bskomponenter.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tHvordan skal jeg v\u00e6lge mellem aluminiumoxid (Al\u2082O\u2083) og aluminiumnitrid (AlN)?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      V\u00e6lg aluminiumoxid for omkostningseffektivitet og generel brug; v\u00e6lg AlN, n\u00e5r du har brug for h\u00f8jere varmeledningsevne og bedre termisk styring til applikationer med h\u00f8j effekt. Dit valg b\u00f8r afspejle termiske, mekaniske og budgetm\u00e6ssige krav.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an 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      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\\\/div>\\n
       <\\\/div>\\n
      \\\"ceramic<\\\/div>\\n
       <\\\/div>\\n

      Properties of ceramic PCB<\\\/h2>\\n

      Mechanical properties (how circuit traces are formed)<\\\/h3>\\n
      a. They have high mechanical strength. They can hold parts and also act as support structures.
      b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.
      c. Their surface is smooth. They do not warp, bend, or show small cracks.<\\\/div>\\n

      Electrical properties<\\\/h3>\\n
      a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.
      b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.
      c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\\\/div>\\n

      Thermal properties<\\\/h3>\\n
      a. They have high thermal conductivity. This helps move heat away from hot parts.
      b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.
      c. They have good heat resistance. They stay stable at high temperature.<\\\/div>\\n

      Other properties<\\\/h3>\\n
      a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.
      b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.
      c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.
      d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\\\/div>\\n

      Methods to make ceramic substrates<\\\/h2>\\n
      Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\\\/div>\\n
      Common process routes are these three:<\\\/div>\\n
        \\n
      1. Stack layers \\u2013 hot press \\u2013 remove binder \\u2013 fire the base sheet \\u2013 form circuit patterns \\u2013 fire the circuit.<\\\/li>\\n
      2. Stack layers \\u2013 print the circuit pattern on the surface \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n
      3. Print circuit pattern \\u2013 stack \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n<\\\/ol>\\n

        Metallization of ceramic PCB<\\\/h2>\\n

        a. Thick film method:<\\\/h3>\\n
        In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\\u2013oxide types.<\\\/div>\\n

        b. Thin film method:<\\\/h3>\\n
        Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\\\/div>\\n

        c. Co-firing method:<\\\/h3>\\n
        Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:
        \\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.
        \\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.
        \\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\\\/div>\\n

        Types of ceramic substrates<\\\/h2>\\n

        Alumina substrate (Al\\u2082O\\u2083)<\\\/h3>\\n
        a. Raw material: Al\\u2082O\\u2083 is often made by the Bayer process<\\\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.
        b. Making: Al\\u2082O\\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\\u20131600\\u00b0C. Metalization methods for Al\\u2082O\\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.
        c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Alumina<\\\/div>\\n
         <\\\/div>\\n

        Mullite substrate (3Al\\u2082O\\u2083\\u00b72SiO\\u2082)<\\\/h3>\\n
        Mullite is one of the most stable crystalline phases in the Al\\u2082O\\u2083\\u2013SiO\\u2082 system. Compared to Al\\u2082O\\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\\\/div>\\n

        Aluminum nitride substrate (AlN)<\\\/h3>\\n
        a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\\u2082O\\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\\u2082 to form AlN directly.
        b. Making: The same forming methods used for Al\\u2082O\\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.
        c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\\u2082O\\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\\u2082O\\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.
        d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Aluminum<\\\/div>\\n
         <\\\/div>\\n

        Silicon carbide substrate (SiC)<\\\/h3>\\n
        a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\\u00b0C to react and form \\u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.
        b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.
        c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.
        d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\\\/div>\\n

        Beryllia substrate (BeO)<\\\/h3>\\n
        BeO has thermal conductivity many times that of Al\\u2082O\\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\\u2082O\\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\\\/div>\\n

        Comparison of some ceramic materials and substrate types<\\\/h2>\\n
        From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\\\/div>\\n
        Common ceramic base materials are BeO, Al\\u2082O\\u2083, AlN, and Si\\u2083N\\u2084. Among these, Si\\u2083N\\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\\\/div>\\n

        High temperature co-fired ceramic multilayer (HTCC)<\\\/h3>\\n
        HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\\u2082O\\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\\u2013200 W\\\/(m\\u00b7\\u00b0C).<\\\/div>\\n

        Low temperature co-fired ceramic PCB(LTCC)<\\\/h3>\\n
        LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\\u2082O\\u2083 powder includes 30\\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\\u2013900\\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\\\/div>\\n

        Thick film ceramic substrate (TFC)<\\\/h3>\\n
        Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\\u2013800\\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\\u201320 \\u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\\\/div>\\n

        Direct bonded copper ceramic PCB(DBC)<\\\/h3>\\n
        DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\\u2082O\\u2083 can control the expansion of the Cu\\u2013Al\\u2082O\\u2083\\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\\u2082O\\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\\u2082O\\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \\u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \\u03bcm.<\\\/div>\\n
         <\\\/div>\\n
        \\\"DBC\\\"<\\\/div>\\n
         <\\\/div>\\n

        Direct plated copper ceramic PCB(DPC)<\\\/h3>\\n
        DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\\\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\\\/div>\\n

        Notes on use and selection<\\\/h2>\\n
        When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\\u2082O\\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\\\/div>\\n
        Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\\\/div>\\n

        Manufacturing tradeoffs and practical points<\\\/h2>\\n
        Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\\\/div>\\n

        Co-firing vs post-firing metallization<\\\/h3>\\n
        Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\\\/div>\\n

        Typical process flow examples (short summary)<\\\/h2>\\n
          \\n
        1. For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\\\/li>\\n
        2. For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\\u2013800\\u00b0C, then trim resistors and add final metal pads.<\\\/li>\\n
        3. For DPC: clean ceramic, deposit Ti\\\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\\\/li>\\n<\\\/ol>\\n

          Summary<\\\/strong><\\\/h2>\\n
          Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\\\/div>\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"c857395\"}]},\"elements\":[],\"widgetType\":\"text-editor\"}],\"isInner\":false},{\"id\":\"jcauneg\",\"elType\":\"section\",\"settings\":{\"gap\":\"no\",\"content_position\":\"top\",\"background_background\":\"classic\",\"background_color\":\"#FFFFFF00\",\"background_position\":\"bottom center\",\"background_attachment\":\"scroll\",\"background_repeat\":\"no-repeat\",\"background_size\":\"cover\",\"background_size_mobile\":\"cover\",\"background_overlay_background\":\"classic\",\"background_overlay_color_b\":\"rgba(255,255,255,0)\",\"background_overlay_opacity\":{\"unit\":\"px\",\"size\":\"\",\"sizes\":[]},\"padding\":{\"unit\":\"px\",\"top\":\"120\",\"right\":\"0\",\"bottom\":\"120\",\"left\":\"0\",\"isLinked\":false},\"padding_tablet\":{\"unit\":\"px\",\"top\":\"80\",\"right\":\"40\",\"bottom\":\"80\",\"left\":\"40\",\"isLinked\":false},\"padding_mobile\":{\"unit\":\"px\",\"top\":\"50\",\"right\":\"25\",\"bottom\":\"50\",\"left\":\"25\",\"isLinked\":false},\"content_width\":{\"unit\":\"px\",\"size\":800,\"sizes\":[]},\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"4cb1949\"}]},\"elements\":[{\"id\":\"7882748\",\"elType\":\"column\",\"settings\":{\"_column_size\":100,\"_inline_size\":null,\"padding\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"space_between_widgets\":40,\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"bcc1c8f\"}]},\"elements\":[{\"id\":\"9fc6712\",\"elType\":\"widget\",\"settings\":{\"title\":\"Frequently Asked Questions\",\"align\":\"center\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"79a2a25\"}]},\"elements\":[],\"widgetType\":\"heading\"},{\"id\":\"631b990\",\"elType\":\"widget\",\"settings\":{\"tabs\":[{\"tab_title\":\"What types of ceramic materials are commonly used?\",\"tab_content\":\"

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p>\",\"_id\":\"9c164e4\"},{\"_id\":\"70a3236\",\"tab_title\":\"What manufacturing processes are used for ceramic PCBs?\",\"tab_content\":\"

          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p>\"},{\"_id\":\"eded620\",\"tab_title\":\"What are the main advantages of ceramic PCBs over FR-4?\",\"tab_content\":\"

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p>\"},{\"_id\":\"4798292\",\"tab_title\":\"Are ceramic PCBs more expensive?\",\"tab_content\":\"

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p>\"},{\"_id\":\"379846e\",\"tab_title\":\"Can ceramic PCBs be used for high-frequency\\\/RF applications?\",\"tab_content\":\"

          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p>\"},{\"_id\":\"662a19b\",\"tab_title\":\"How should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?\",\"tab_content\":\"

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p>\"}],\"border_width\":{\"unit\":\"px\",\"size\":1,\"sizes\":[]},\"border_color\":\"#F5F5F5\",\"selected_icon\":{\"value\":\"fas fa-plus-circle\",\"library\":\"fa-solid\"},\"selected_active_icon\":{\"value\":\"fas fa-minus-circle\",\"library\":\"fa-solid\"},\"tab_active_color\":\"rgba(0, 124, 186, 0.97)\",\"_border_radius\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"_box_shadow_box_shadow\":{\"horizontal\":0,\"vertical\":3,\"blur\":12,\"spread\":4,\"color\":\"rgba(0, 0, 0, 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          \\n\\t\\t[elementor-element k=\\\"0e46bd9387093ca73b9000e38f18cce4\\\" data=\\\"{"id":"612671e","elType":"widget","settings":{"editor":"<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"alignnone size-full wp-image-2693\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/ceramic-pcb.webp\" alt=\"ceramic pcb\" width=\"356\" height=\"289\"><\/div>\n<div>&nbsp;<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Properties of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mechanical properties (how circuit traces are formed)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high mechanical strength. They can hold parts and also act as support structures.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their surface is smooth. They do not warp, bend, or show small cracks.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Electrical properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thermal properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high thermal conductivity. This helps move heat away from hot parts.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. They have good heat resistance. They stay stable at high temperature.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Other properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Methods to make ceramic substrates<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common process routes are these three:<\/div>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>Stack layers \u2013 hot press \u2013 remove binder \u2013 fire the base sheet \u2013 form circuit patterns \u2013 fire the circuit.<\/li>\n<li>Stack layers \u2013 print the circuit pattern on the surface \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<li>Print circuit pattern \u2013 stack \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Metallization of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">a. Thick film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\u2013oxide types.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">b. Thin film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">c. Co-firing method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Types of ceramic substrates<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Alumina substrate (Al\u2082O\u2083)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: Al\u2082O\u2083 is often made by the <a href=\"https:\/\/en.wikipedia.org\/wiki\/Bayer_process\">Bayer process<\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: Al\u2082O\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\u20131600\u00b0C. Metalization methods for Al\u2082O\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2691 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Alumina-substrate.webp\" alt=\"Alumina substrate\" width=\"600\" height=\"476\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mullite substrate (3Al\u2082O\u2083\u00b72SiO\u2082)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Mullite is one of the most stable crystalline phases in the Al\u2082O\u2083\u2013SiO\u2082 system. Compared to Al\u2082O\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Aluminum nitride substrate (AlN)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\u2082O\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\u2082 to form AlN directly.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: The same forming methods used for Al\u2082O\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\u2082O\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\u2082O\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2692 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Aluminum-nitride-substrate.webp\" alt=\"Aluminum nitride substrate\" width=\"600\" height=\"383\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Silicon carbide substrate (SiC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\u00b0C to react and form \u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Beryllia substrate (BeO)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">BeO has thermal conductivity many times that of Al\u2082O\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\u2082O\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Comparison of some ceramic materials and substrate types<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common ceramic base materials are BeO, Al\u2082O\u2083, AlN, and Si\u2083N\u2084. Among these, Si\u2083N\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">High temperature co-fired ceramic multilayer (HTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\u2082O\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\u2013200 W\/(m\u00b7\u00b0C).<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Low temperature co-fired ceramic PCB(LTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\u2082O\u2083 powder includes 30\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\u2013900\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thick film ceramic substrate (TFC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\u2013800\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\u201320 \u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct bonded copper ceramic PCB(DBC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\u2082O\u2083 can control the expansion of the Cu\u2013Al\u2082O\u2083\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\u2082O\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\u2082O\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \u03bcm.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2694 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/DBC.webp\" alt=\"DBC\" width=\"600\" height=\"450\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct plated copper ceramic PCB(DPC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Notes on use and selection<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\u2082O\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Manufacturing tradeoffs and practical points<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Co-firing vs post-firing metallization<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Typical process flow examples (short summary)<\/h2>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\/li>\n<li>For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\u2013800\u00b0C, then trim resistors and add final metal pads.<\/li>\n<li>For DPC: clean ceramic, deposit Ti\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\"><strong data-start=\"32\" data-end=\"43\">Summary<\/strong><\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\/div>","display_condition_list":[{"display_condition_login_status":"subscriber","_id":"c857395"}]},"elements":[],"widgetType":"text-editor"}\\\"]\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          Frequently Asked Questions<\\\/h2>\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat types of ceramic materials are commonly used?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat are the main advantages of ceramic PCBs over FR-4?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tAre ceramic PCBs more expensive?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

          \\n\\t\\t\\t\\t\\t
          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tHow should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/section>\\n\\t\\t\",\"scripts\":[],\"styles\":[]}}"],"_uag_css_file_name":["uag-css-2364.css"],"_uag_js_file_name":["uag-js-2364.js"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"Philifast","author_link":"https:\/\/flj-pcb.com\/da\/author\/2475017442jygmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an […]","_links":{"self":[{"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/pages\/2364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/comments?post=2364"}],"version-history":[{"count":26,"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/pages\/2364\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/pages\/2364\/revisions\/3323"}],"up":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/pages\/1898"}],"wp:attachment":[{"href":"https:\/\/flj-pcb.com\/da\/wp-json\/wp\/v2\/media?parent=2364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}