{"id":2364,"date":"2025-09-02T08:30:07","date_gmt":"2025-09-02T08:30:07","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=2364"},"modified":"2025-09-25T06:49:30","modified_gmt":"2025-09-25T06:49:30","slug":"ceramic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/de\/pcb-manufacturer\/ceramic-pcb\/","title":{"rendered":"Keramische Leiterplatten: Materialien, thermisches Design und Anwendungen"},"content":{"rendered":"
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Ein Keramiksubstrat ist eine spezielle Art von Leiterplatte, die durch direktes Aufkleben von Kupferfolie auf die Oberfl\u00e4che einer Oxid- oder Keramikplatte bei hoher Temperatur hergestellt wird. Das Kupfer wird durch einen Hochtemperaturprozess mit der Keramik verbunden, so dass das Metall und die Keramik eine stabile Basis f\u00fcr Schaltungen bilden.<\/div>\n
 <\/div>\n
\"ceramic<\/div>\n
 <\/div>\n

Eigenschaften von keramischen PCB<\/h2>\n

Mechanische Eigenschaften (wie Leiterbahnen geformt werden)<\/h3>\n
a. Sie haben eine hohe mechanische Festigkeit. Sie k\u00f6nnen Teile halten und auch als St\u00fctzstrukturen dienen.
b. Sie sind leicht zu bearbeiten. Sie sind ma\u00dfhaltig. Sie k\u00f6nnen in vielen Schichten hergestellt werden.
c. Ihre Oberfl\u00e4che ist glatt. Sie verziehen sich nicht, verbiegen sich nicht und weisen keine kleinen Risse auf.<\/div>\n

Elektrische Eigenschaften<\/h3>\n
a. Sie haben einen hohen Isolationswiderstand und eine hohe Durchbruchspannung. Dadurch sind die Stromkreise sicher vor Kurzschl\u00fcssen und Hochspannungssch\u00e4den.
b. Sie haben eine niedrige Dielektrizit\u00e4tskonstante und einen geringen dielektrischen Verlust. Dies tr\u00e4gt dazu bei, dass Signale mit weniger Verlusten \u00fcbertragen werden.
c. Ihre Leistung bleibt auch bei hohen Temperaturen und hoher Luftfeuchtigkeit stabil. Dies tr\u00e4gt dazu bei, die Zuverl\u00e4ssigkeit unter harten Einsatzbedingungen zu gew\u00e4hrleisten.<\/div>\n

Thermische Eigenschaften<\/h3>\n
a. Sie haben eine hohe W\u00e4rmeleitf\u00e4higkeit. Dadurch wird die W\u00e4rme von den hei\u00dfen Teilen weggeleitet.
b. Ihr W\u00e4rmeausdehnungskoeffizient kann an verwandte Materialien, insbesondere Silizium, angepasst werden. Diese \u00dcbereinstimmung verringert die Belastung beim Erhitzen und Abk\u00fchlen der Teile.
c. Sie haben eine gute Hitzebest\u00e4ndigkeit. Sie bleiben bei hohen Temperaturen stabil.<\/div>\n

Andere Eigenschaften<\/h3>\n
a. Sie sind chemisch stabil. Sie sind leicht zu metallisieren. Schaltungsmuster haften gut auf ihnen.
b. Sie nehmen keine Feuchtigkeit auf. Sie sind \u00f6l- und chemikalienbest\u00e4ndig. Sie setzen wenig Strahlung frei.
c. Die verwendeten Materialien sind unsch\u00e4dlich und nicht giftig. Ihre Kristallstruktur \u00e4ndert sich im Arbeitstemperaturbereich nicht.
d. Rohstoffe sind reichlich vorhanden. Die Technologie ist ausgereift. Sie sind einfach herzustellen und der Preis ist niedrig.<\/div>\n

Methoden zur Herstellung von Keramiksubstraten<\/h2>\n
Bevor die Keramik gebrannt wird, gibt es vier g\u00e4ngige Formgebungsverfahren. Es handelt sich dabei um das Pulverpressen (entweder durch Formpressen oder isostatisches Pressen), Strangpressen, Bandgie\u00dfen und Spritzgie\u00dfen. Das Bandgie\u00dfen wird in den letzten Jahren h\u00e4ufiger f\u00fcr LSI-Geh\u00e4use und Hybridschaltungssubstrate verwendet, da es einfacher ist, viele Schichten herzustellen und eine h\u00f6here Produktionseffizienz aufweist.<\/div>\n
\u00dcbliche Verfahrenswege sind diese drei:<\/div>\n
    \n
  1. Lagen stapeln - hei\u00df pressen - Bindemittel entfernen - Grundplatte brennen - Schaltungsmuster bilden - Schaltung brennen.<\/li>\n
  2. Schichten stapeln - das Schaltungsmuster auf die Oberfl\u00e4che drucken - hei\u00df pressen - Bindemittel entfernen - mitbrennen.<\/li>\n
  3. Schaltungsmuster drucken - stapeln - hei\u00df pressen - Binder entfernen - mitbrennen.<\/li>\n<\/ol>\n

    Metallisierung von Keramik-Leiterplatten<\/h2>\n

    a. Dickschichtverfahren:<\/h3>\n
    Bei der Dickschichtmethode werden Leiterbahnen und Widerst\u00e4nde durch Siebdruck auf die Keramik aufgebracht. Nach dem Druck werden die Teile gesintert, um den Schaltkreis und die Kontaktfl\u00e4chen zu bilden. Als Bindemittel zur Fixierung des gedruckten Metalls werden Glas, Oxid und eine Mischung aus Glas und Oxid verwendet.<\/div>\n

    b. D\u00fcnnschichtverfahren:<\/h3>\n
    Bei der D\u00fcnnschichttechnik wird Metall durch Vakuumverfahren wie Verdampfen, Ionenplattieren oder Sputtern aufgebracht. Da bei der D\u00fcnnschicht Metall aus der Gasphase abgeschieden wird, kann im Prinzip jedes Metall aufgebracht werden. Auch jedes Substrat kann im Prinzip auf diese Weise metallisiert werden. Allerdings sollte die W\u00e4rmeausdehnung der Metallschicht und des keramischen Substrats so weit wie m\u00f6glich \u00fcbereinstimmen. Au\u00dferdem ist es wichtig, die Haftung der Metallschicht auf der Keramik zu erh\u00f6hen.<\/div>\n

    c. Methode der Mitbefeuerung:<\/h3>\n
    Vor dem Brennen werden feuerfeste Metallpasten aus Mo, W und \u00e4hnlichen Metallen im Siebdruckverfahren auf die ungebrannten Keramikplatten aufgebracht. Der Stapel wird dann entbastet und gebrannt, so dass die Keramik und das Metall eine einheitliche Struktur bilden. Dieses Verfahren zeichnet sich durch folgende Merkmale aus:
    \u25a0 Es k\u00f6nnen sehr feine Leiterbahnen gebildet werden, und es ist einfach, viele Schichten herzustellen, so dass eine hohe Verdrahtungsdichte m\u00f6glich ist.
    Da der Isolator und der Leiter gemeinsam geformt sind, ist ein hermetischer Verschluss in Verpackungen m\u00f6glich.
    Durch die Wahl der richtigen Zusammensetzung, des Formgebungsdrucks und der Sintertemperatur kann die Sinterschrumpfung kontrolliert werden. Insbesondere bei der Herstellung eines Substrats mit null Schrumpfung in der Ebene er\u00f6ffnet dies den Einsatz in BGA-, CSP- und Bare-Chip-High-Density-Packaging.<\/div>\n

    Arten von Keramiksubstraten<\/h2>\n

    Tonerde-Substrat (Al\u2082O\u2083)<\/h3>\n
    a. Rohmaterial: Al\u2082O\u2083 wird oft durch die Bayer-Verfahren<\/a>. Bei diesem Verfahren ist das Rohmaterial Bauxit, das hydratisierte Aluminiumoxide und verwandte Verbindungen enth\u00e4lt.
    b. Herstellung: Al\u2082O\u2083-Keramik wird in der Regel durch Stapeln ungebrannter Platten hergestellt. H\u00e4ufig wird ein Bindemittel wie Polyvinylbutyral (PVB) verwendet. Die Brenntemperatur variiert je nach den zugesetzten Sinterhilfsmitteln und liegt in der Regel bei 1550-1600 \u00b0C. Metallisierungsverfahren f\u00fcr Al\u2082O\u2083 sind vor allem die Dickschicht- und Co-Firing-Verfahren. Die Pasten und die Verfahrenstechnik sind ausgereift. Sie erf\u00fcllen heute viele Anwendungsbed\u00fcrfnisse.
    c. Anwendungen: Substrate f\u00fcr hybride integrierte Schaltungen, LSI-Geh\u00e4usesubstrate und Substrate f\u00fcr Mehrschichtschaltungen.<\/div>\n
     <\/div>\n
    \"Alumina<\/div>\n
     <\/div>\n

    Mullit-Substrat (3Al\u2082O\u2083-2SiO\u2082)<\/h3>\n
    Mullit ist eine der stabilsten kristallinen Phasen im System Al\u2082O\u2083-SiO\u2082. Im Vergleich zu Al\u2082O\u2083 hat Mullit eine etwas geringere mechanische Festigkeit und eine geringere W\u00e4rmeleitf\u00e4higkeit, aber seine Dielektrizit\u00e4tskonstante ist niedriger. Diese niedrigere Dielektrizit\u00e4tskonstante kann zur Verbesserung der Signalgeschwindigkeit beitragen. Sein W\u00e4rmeausdehnungskoeffizient ist ebenfalls niedrig, was die thermische Belastung der montierten LSI verringert. Auch der Ausdehnungsunterschied zu leitenden Metallen wie Mo und W ist geringer, so dass beim gemeinsamen Brennen weniger Spannungen zwischen dem Metall und der Keramik entstehen.<\/div>\n

    Substrat aus Aluminiumnitrid (AlN)<\/h3>\n
    a. Das Rohmaterial: AlN ist kein nat\u00fcrliches Mineral. Es ist ein k\u00fcnstliches Material, das erstmals in den 1800er Jahren synthetisiert wurde. Typische AlN-Pulver werden durch Reduktionsnitrierung oder direkte Nitrierung hergestellt. Bei der Reduktionsnitrierung wird Al\u2082O\u2083 mit Hilfe von hochreinem Kohlenstoff reduziert und reagiert dann mit Stickstoff zu AlN. Bei der direkten Nitridierung reagiert Al-Pulver mit N\u2082, um direkt AlN zu bilden.
    b. Herstellung: F\u00fcr AlN k\u00f6nnen dieselben Formgebungsverfahren wie f\u00fcr Al\u2082O\u2083-Substrate angewandt werden. Die am h\u00e4ufigsten verwendete Methode ist das Stapeln ungebrannter Platten. Dazu werden AlN-Pulver, organische Bindemittel, L\u00f6sungsmittel und ein Tensid zu einem keramischen Schlicker vermischt. Die Aufschl\u00e4mmung wird mit Band gegossen, gestapelt, hei\u00df gepresst, entbindert und dann gebrannt, um das AlN-Substrat herzustellen.
    c. Eigenschaften des AlN-Substrats: AlN hat eine mehr als zehnmal h\u00f6here W\u00e4rmeleitf\u00e4higkeit als Al\u2082O\u2083. Sein W\u00e4rmeausdehnungskoeffizient (CTE) entspricht dem von Silizium. Im Vergleich zu Al\u2082O\u2083 hat AlN einen h\u00f6heren Isolationswiderstand und eine h\u00f6here Durchbruchspannung. Seine Dielektrizit\u00e4tskonstante ist niedriger. Diese Eigenschaften machen AlN sehr wertvoll f\u00fcr Geh\u00e4usesubstrate.
    d. Anwendungen: F\u00fcr Leistungsverst\u00e4rkermodule im VHF-Band, Hochleistungsger\u00e4te und Laserdioden-Substrate.<\/div>\n
     <\/div>\n
    \"Aluminum<\/div>\n
     <\/div>\n

    Siliziumkarbid-Substrat (SiC)<\/h3>\n
    a. Das Rohmaterial: SiC ist kein nat\u00fcrliches Mineral. Es wird durch Mischen von Siliziumdioxid, Koks und ein wenig Salz in Pulverform hergestellt. Die Mischung wird in einem Graphitofen auf \u00fcber 2000 \u00b0C erhitzt, um zu reagieren und \u03b1-SiC zu bilden. Anschlie\u00dfend kann SiC durch Sublimation gereinigt werden, um einen dunkelgr\u00fcnen Block aus polykristallinem Material zu erhalten.
    b. Herstellung: SiC hat eine sehr hohe chemische und thermische Stabilit\u00e4t, so dass es sich mit normalen Brennverfahren nur schwer verdichten l\u00e4sst. Es werden Sinterhilfsmittel und spezielle Brennverfahren ben\u00f6tigt. \u00dcblich ist das Vakuum-Hei\u00dfpressen.
    c. SiC-Merkmale: Ein Hauptmerkmal ist der sehr gro\u00dfe W\u00e4rmediffusionskoeffizient. Er kann sogar gr\u00f6\u00dfer sein als der von Kupfer. Seine W\u00e4rmeausdehnung ist n\u00e4her an der von Silizium. Aber SiC hat auch einige Nachteile. Seine Dielektrizit\u00e4tskonstante ist relativ hoch und seine Durchbruchspannung ist nicht so gut wie die einiger anderer Keramiken.
    d. Anwendungen: SiC-Substrate werden dort eingesetzt, wo eine hohe W\u00e4rmeausbreitung erforderlich ist und die Spannung nicht hoch ist. Sie werden f\u00fcr w\u00e4rmeableitende VLSI-Geh\u00e4use, Hochgeschwindigkeits- und Hochintegrations-Logik-LSI mit K\u00fchlk\u00f6rpern, gro\u00dfe Computer und Laserdioden-Substrate f\u00fcr die optische Kommunikation verwendet.<\/div>\n

    Beryllia-Substrat (BeO)<\/h3>\n
    BeO hat eine vielfach h\u00f6here W\u00e4rmeleitf\u00e4higkeit als Al\u2082O\u2083. Es eignet sich gut f\u00fcr Schaltungen mit hoher Leistung. Seine Dielektrizit\u00e4tskonstante ist niedrig, so dass es f\u00fcr Hochfrequenzschaltungen geeignet ist. BeO-Substrate werden normalerweise durch Trockenpressen hergestellt. Sie k\u00f6nnen auch durch ungebrannte Platten mit geringen Zus\u00e4tzen von MgO oder Al\u2082O\u2083 hergestellt werden. Da BeO-Pulver giftig ist, geben BeO-Produkte Anlass zu Bedenken hinsichtlich Umwelt und Gesundheit. In Japan ist die Herstellung von BeO-Substraten nicht erlaubt, und BeO muss aus L\u00e4ndern wie den Vereinigten Staaten importiert werden.<\/div>\n

    Vergleich einiger keramischer Werkstoffe und Substrattypen<\/h2>\n
    Nach Struktur und Herstellungsverfahren k\u00f6nnen keramische Substrate in HTCC, LTCC, TFC, DBC, DPC usw. eingeteilt werden. Keramische Substrate werden wegen ihrer guten W\u00e4rmeleitf\u00e4higkeit, W\u00e4rmebest\u00e4ndigkeit, Isolierung, geringen W\u00e4rmeausdehnung und sinkenden Kosten immer h\u00e4ufiger in der elektronischen Verpackung und in der Leistungselektronik wie IGBT (Insulated Gate Bipolar Transistor), LD (Laserdiode), Hochleistungs-LED und CPV (Konzentrator-Photovoltaik) eingesetzt.<\/div>\n
    \u00dcbliche keramische Grundmaterialien sind BeO, Al\u2082O\u2083, AlN und Si\u2083N\u2084. Si\u2083N\u2084 zeichnet sich durch eine sehr gute elektrische Isolierung und chemische Stabilit\u00e4t aus. Es hat auch eine gute thermische Stabilit\u00e4t und eine hohe mechanische Festigkeit. Es kann f\u00fcr Leiterplatten mit hoher Dichte und hoher Integration verwendet werden.<\/div>\n

    Bei hoher Temperatur gebrannte keramische Multilayer (HTCC)<\/h3>\n
    HTCC ist ein keramisches Substrat, das bei hohen Temperaturen gebrannt wird. Zur Herstellung von HTCC wird zun\u00e4chst Keramikpulver wie Al\u2082O\u2083 oder AlN mit einem organischen Bindemittel gemischt. Die Mischung wird zu einer Paste verarbeitet und dann mit einem Rakel oder \u00e4hnlichen Verfahren zu Platten geformt. Die getrockneten Platten werden zu Gr\u00fcnk\u00f6rpern. F\u00fcr die Verdrahtung und das F\u00fcllen von Durchgangsl\u00f6chern werden L\u00f6cher gebohrt und Leiterpasten im Siebdruckverfahren aufgebracht. Anschlie\u00dfend werden die gr\u00fcnen Platten gestapelt und zum Sintern in einen Hochtemperaturofen mit einer Temperatur von etwa 1600 \u00b0C gelegt. Da die Sintertemperatur hoch ist, ist die Auswahl der Leitermetalle begrenzt. Es werden Metalle mit hohem Schmelzpunkt, aber geringerer Leitf\u00e4higkeit verwendet, z. B. Wolfram, Molybd\u00e4n und Mangan. Die Kosten sind hoch und die W\u00e4rmeleitf\u00e4higkeit liegt bei etwa 20-200 W\/(m-\u00b0C).<\/div>\n

    Bei niedriger Temperatur gebrannte keramische PCB (LTCC)<\/h3>\n
    LTCC ist eine bei niedriger Temperatur gebrannte Keramik. Die Herstellungsschritte sind \u00e4hnlich wie bei HTCC. Der Unterschied besteht darin, dass das Al\u2082O\u2083-Pulver 30-50% Masse an Glas mit niedrigem Schmelzpunkt enth\u00e4lt. Dadurch wird die Brenntemperatur auf etwa 850-900\u00b0C gesenkt. Da die Brenntemperatur niedrig ist, k\u00f6nnen leitf\u00e4hige Metalle mit guter Leitf\u00e4higkeit wie Gold und Silber f\u00fcr Elektroden und Leiterbahnen verwendet werden. Bei LTCC wird der Siebdruck f\u00fcr die Metalllinien verwendet. Bei dieser Methode kann es aufgrund der Dehnung des Gewebes zu Ausrichtungsfehlern kommen. Auch beim Stapeln und gleichzeitigen Brennen von Multilayern kann es zu einer unterschiedlichen Schrumpfung kommen, was die Ausbeute beeintr\u00e4chtigt. Um die W\u00e4rmeleitf\u00e4higkeit von LTCC zu erh\u00f6hen, k\u00f6nnen in den Bauteilbereichen thermische Durchkontaktierungen oder leitf\u00e4hige Durchkontaktierungen angebracht werden, was jedoch die Kosten erh\u00f6ht.<\/div>\n

    Dickschicht-Keramik-Substrat (TFC)<\/h3>\n
    Im Vergleich zu LTCC und HTCC ist TFC ein nachgebranntes Keramiksubstrat. Dabei werden im Siebdruckverfahren Metallpasten auf die keramische Grundfl\u00e4che aufgebracht. Nach dem Trocknen wird das Teil bei hoher Temperatur (700-800 \u00b0C) gebrannt. Die Metallpasten werden aus Metallpulver, organischem Harz und Glas hergestellt. Nach dem Brennen brennt das Harz ab, und die verbleibende Schicht besteht haupts\u00e4chlich aus Metall, das durch einen glasartigen Klebstoff auf der Keramikoberfl\u00e4che gebunden ist. Die Dicke der gebrannten Metallschicht betr\u00e4gt in der Regel 10-20 \u03bcm, und die minimale Linienbreite liegt bei etwa 0,3 mm. Da die Technologie ausgereift, das Verfahren einfach und die Kosten niedrig sind, wird TFC dort eingesetzt, wo die Anforderungen an die Pr\u00e4zision der Muster nicht hoch sind.<\/div>\n

    Direkt gebondete Kupfer-Keramik-Leiterplatte (DBC)<\/h3>\n
    DBC wird durch Co-Sintern oder eutektisches Verbinden von Kupferfolie mit einer Keramikplatte bei hoher Temperatur (ca. 1065 \u00b0C) hergestellt. Nach dem Verbinden werden die Schaltkreismuster durch \u00c4tzen hergestellt. Da Kupferfolie eine gute elektrische und thermische Leitf\u00e4higkeit besitzt und Al\u2082O\u2083 die Ausdehnung des Cu-Al\u2082O\u2083-Cu-Verbunds kontrollieren kann, hat DBC eine thermische Ausdehnung nahe der von Aluminiumoxid. DBC hat eine gute W\u00e4rmeleitung, eine starke Isolierung und eine hohe Zuverl\u00e4ssigkeit. Es wird h\u00e4ufig in IGBT-, Laserdioden- und CPV-Geh\u00e4usen verwendet. DBC hat auch Nachteile. Die eutektische Reaktion zwischen Cu und Al\u2082O\u2083 bei hohen Temperaturen erfordert eine strenge Kontrolle der Ausr\u00fcstung und des Prozesses, so dass die Kosten h\u00f6her sind. Zwischen Al\u2082O\u2083 und Cu k\u00f6nnen sich Mikroporen bilden, was die Temperaturwechselbest\u00e4ndigkeit verringert. Kupferfolie kann sich bei hohen Temperaturen verziehen, daher betr\u00e4gt die Kupferdicke auf DBC in der Regel mehr als 100 \u03bcm. Auch das \u00c4tzen wird zur Herstellung von Mustern verwendet, so dass die Mindestlinienbreite im Allgemeinen mehr als 100 \u03bcm betr\u00e4gt.<\/div>\n
     <\/div>\n
    \"DBC\"<\/div>\n
     <\/div>\n

    Direkt beschichtete Kupfer-Keramik-Leiterplatte (DPC)<\/h3>\n
    Die DPC beginnt mit der Reinigung und Vorbehandlung der Keramikplatte. Dann wird eine Ti\/Cu-Keimschicht durch Vakuumsputtern auf die Substratoberfl\u00e4che aufgebracht. Durch Fotolithografie, Entwicklung und \u00c4tzen wird das Schaltungsmuster erstellt. Anschlie\u00dfend wird die Schaltungsdicke durch Galvanisieren oder chemisches Beschichten erh\u00f6ht. Nach dem Entfernen des Fotolacks ist das Substrat fertig. Das DPC-Verfahren hat folgende Vorteile: Es hat eine niedrige Temperatur (unter 300 \u00b0C), so dass die Nachteile hoher Temperaturen f\u00fcr Materialien und Schaltungen vermieden werden und die Herstellungskosten sinken. Durch die Verwendung von D\u00fcnnfilm und Fotolithografie werden die Metalllinien auf dem Substrat feiner. DPC eignet sich daher gut f\u00fcr Geh\u00e4use, die eine hohe Ausrichtungsgenauigkeit erfordern. Aber DPC hat auch Nachteile. Die Dicke des galvanisch aufgebrachten Kupfers ist begrenzt, und die bei der Galvanisierung anfallende Fl\u00fcssigkeit kann zu Umweltverschmutzung f\u00fchren. Die Haftung zwischen Metallschicht und Keramik ist geringer, so dass die Produktzuverl\u00e4ssigkeit geringer sein kann.<\/div>\n

    Hinweise zur Verwendung und Auswahl<\/h2>\n
    Bei der Wahl eines keramischen Substrats sollten Sie das Material auf die Anforderungen der Anwendung abstimmen. Wenn Sie eine hohe W\u00e4rmeleitf\u00e4higkeit und eine W\u00e4rmeausdehnung nahe an der von Silizium ben\u00f6tigen, sind AlN oder SiC m\u00f6glicherweise die beste Wahl. Wenn Kosten und ausgereifte Verarbeitung eine Rolle spielen, ist Al\u2082O\u2083 eine gute Wahl. Wenn Sie feine Linien und eine Verarbeitung bei niedrigen Temperaturen ben\u00f6tigen, k\u00f6nnen Sie DPC und LTCC verwenden. Wenn Sie eine mehrlagige Verdrahtung mit hoher Dichte und eine hermetische Abdichtung ben\u00f6tigen, sind co-fired-Routen wie LTCC oder HTCC mit mitgesintertem Metall m\u00f6glicherweise die richtige Wahl.<\/div>\n
    Zu den g\u00e4ngigen Anwendungsbereichen geh\u00f6ren Leistungsmodule, HF-Leistungsverst\u00e4rker, Laserdiodenmodule, Hochleistungs-LEDs und LSI-Geh\u00e4use mit hoher Dichte. Leistungselektronik profitiert von keramischen Substraten, da sie W\u00e4rme gut ableiten und auch bei thermischer Belastung ihre Isolation und mechanische Festigkeit beibehalten. HF-Ger\u00e4te profitieren von einem geringen dielektrischen Verlust und stabilen dielektrischen Eigenschaften. Die hohe Packungsdichte profitiert von der M\u00f6glichkeit, feine Linien zu ziehen und viele Schichten mit guter Ausrichtungskontrolle zu stapeln, wenn der Prozess geeignet ist.<\/div>\n

    Kompromisse bei der Herstellung und praktische Punkte<\/h2>\n
    Jeder Keramiktyp und jedes Verfahren bringt Kompromisse mit sich. Bei HTCC werden hohe Brenntemperaturen verwendet und daher hochschmelzende Metalle als Leiter eingesetzt. Dies schr\u00e4nkt die Leitf\u00e4higkeit ein und erh\u00f6ht die Kosten, aber HTCC kann bei hohen Temperaturen sehr robust sein. Bei LTCC wird die Brenntemperatur durch die Zugabe von Glas gesenkt, so dass bessere Leiter verwendet werden k\u00f6nnen, aber bei LTCC kann es zu Schrumpfungsproblemen und Ausrichtungsproblemen bei Multilayern kommen. TFC ist billig und einfach, aber es kann keine sehr feinen Strukturen erzeugen. DBC bietet eine hervorragende W\u00e4rmeausbreitung mit dickem Kupfer, aber die begrenzte Strukturierung und die Herstellungskosten k\u00f6nnen ein Problem darstellen. DPC erm\u00f6glicht eine feine Strukturierung und Verarbeitung bei niedrigen Temperaturen, aber Haftung und Abfallkontrolle erfordern Sorgfalt.<\/div>\n

    Co-Brand vs. Metallisierung nach dem Brand<\/h3>\n
    Co-Firing bedeutet, dass Metallpasten auf die gr\u00fcne Keramik gedruckt und alles zusammen gebrannt wird. Auf diese Weise k\u00f6nnen sehr kleine Merkmale und echte Mehrschichtverdrahtungen hergestellt werden. Au\u00dferdem werden Keramik und Metall zu einem integrierten K\u00f6rper, was zur hermetischen Abdichtung beitr\u00e4gt. Das Co-Firing erfordert jedoch eine sorgf\u00e4ltige Kontrolle der Materialien, um Schrumpfung und Sinterung aufeinander abzustimmen. Die Metallisierung nach dem Brennen, z. B. als Dick- oder D\u00fcnnschicht auf gebrannter Keramik, vermeidet Probleme mit der Schrumpfung beim Sintern. Sie kann einfacher sein, wenn nur eine Schicht oder eine einfache Doppelschicht ben\u00f6tigt wird. Nachgebrannte Verfahren erreichen jedoch m\u00f6glicherweise nicht die gleiche Verdrahtungsdichte und haben m\u00f6glicherweise andere Haftungs- oder thermische Eigenschaften.<\/div>\n

    Beispiele f\u00fcr typische Prozessabl\u00e4ufe (kurze Zusammenfassung)<\/h2>\n
      \n
    1. Bei gemeinsam gebranntem Mehrschichtsubstrat: Keramikschlamm herstellen, B\u00e4nder gie\u00dfen, Durchgangsl\u00f6cher in gr\u00fcnes Band bohren, Leiterpasten per Siebdruck aufdrucken, B\u00e4nder stapeln, pressen und entbinden, dann brennen. Nach dem Brennen erfolgt die abschlie\u00dfende Bearbeitung, wie z. B. die Metallisierung der Pads und das \u00c4tzen der Schaltkreise, falls erforderlich.<\/li>\n
    2. F\u00fcr Dickschicht auf Keramik: gebranntes Keramiksubstrat verwenden, Leiter- und Widerstandspasten im Siebdruckverfahren auftragen, bei 700-800\u00b0C brennen, dann Widerst\u00e4nde trimmen und abschlie\u00dfende Metallpads hinzuf\u00fcgen.<\/li>\n
    3. F\u00fcr DPC: Reinigen der Keramik, Abscheidung von Ti\/Cu-Keim durch Sputtern, Strukturierung des Fotolacks, \u00c4tzen des Keims zur Herstellung der Struktur, Elektroplattieren zum Aufwachsen von Kupfer, Abziehen des Resists und abschlie\u00dfende Reinigung.<\/li>\n<\/ol>\n

      Zusammenfassung<\/strong><\/h2>\n
      Keramische Leiterplatten sind eine Klasse von Tr\u00e4germaterialien, die einzigartige St\u00e4rken f\u00fcr elektronische Geh\u00e4use aufweisen. Sie bieten gute thermische Pfade, ein stabiles elektrisches Verhalten bei Temperatur und eine gute mechanische Festigkeit. Durch die Wahl verschiedener Keramikmaterialien und verschiedener Metallisierungsverfahren k\u00f6nnen die Designer Kosten, thermische Leistung, elektrische Leistung und Anforderungen an feine Linienmuster ausgleichen. Aus diesem Grund werden keramische Substrate h\u00e4ufig in der Leistungselektronik, bei HF-Modulen, Laser- und Diodengeh\u00e4usen, Hochleistungs-LEDs und vielen anderen Bereichen mit hoher Packungsdichte eingesetzt.<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t\t\t\t
      <\/div>\n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t
      \n\t\t\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t

      H\u00e4ufig gestellte Fragen<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tWelche Arten von keramischen Werkstoffen werden \u00fcblicherweise verwendet?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Die gebr\u00e4uchlichsten sind Aluminiumoxid (Al\u2082O\u2083) f\u00fcr allgemeine Zwecke und Aluminiumnitrid (AlN) f\u00fcr eine h\u00f6here W\u00e4rmeleitf\u00e4higkeit; andere Spezialkeramiken (z. B. Siliziumkarbid) werden f\u00fcr Nischenanforderungen im Hochleistungs- oder Hochtemperaturbereich verwendet.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tWelche Herstellungsverfahren werden f\u00fcr keramische Leiterplatten verwendet?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Keramische Leiterplatten werden durch Verfahren wie Dickschichtdruck, D\u00fcnnschichtabscheidung, Laserbearbeitung und Metallisierung (Kupfer oder Silber) hergestellt, gefolgt von Brennen und Endbearbeitung.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tWas sind die Hauptvorteile von Keramikleiterplatten gegen\u00fcber FR-4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Die wichtigsten Vorteile: wesentlich bessere W\u00e4rmeleitf\u00e4higkeit (W\u00e4rmeableitung), geringerer W\u00e4rmeausdehnungskoeffizient (WAK), hohe Temperaturtoleranz und hervorragende elektrische Isolierung - ideal f\u00fcr LEDs, Leistungselektronik und HF-\/Hochfrequenzanwendungen.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tSind keramische Leiterplatten teurer?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ja - Materialkosten und spezielle Verfahren (Brennen, Laserbearbeitung, Metallisierung) machen keramische Leiterplatten in der Regel teurer als Standard-FR-4; bei Designs mit hoher Leistung oder hoher Zuverl\u00e4ssigkeit k\u00f6nnen sie jedoch die Systemkosten senken, indem sie die Leistung und Lebensdauer verbessern.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tK\u00f6nnen keramische Leiterplatten f\u00fcr Hochfrequenz-\/RF-Anwendungen verwendet werden?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ja. Keramische Substrate bieten stabile dielektrische Eigenschaften und geringe Verluste bei hohen Frequenzen, was sie zu einer guten Wahl f\u00fcr HF- und Mikrowellenschaltungskomponenten macht.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tWie sollte ich zwischen Aluminiumoxid (Al\u2082O\u2083) und Aluminiumnitrid (AlN) w\u00e4hlen?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Entscheiden Sie sich f\u00fcr Aluminiumoxid, wenn Sie kosteng\u00fcnstig und allgemein einsetzbar sein wollen; w\u00e4hlen Sie AlN, wenn Sie eine h\u00f6here W\u00e4rmeleitf\u00e4higkeit und ein besseres W\u00e4rmemanagement f\u00fcr Hochleistungsanwendungen ben\u00f6tigen. Ihre Wahl sollte die thermischen, mechanischen und finanziellen Anforderungen widerspiegeln.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an 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      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\\\/div>\\n
       <\\\/div>\\n
      \\\"ceramic<\\\/div>\\n
       <\\\/div>\\n

      Properties of ceramic PCB<\\\/h2>\\n

      Mechanical properties (how circuit traces are formed)<\\\/h3>\\n
      a. They have high mechanical strength. They can hold parts and also act as support structures.
      b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.
      c. Their surface is smooth. They do not warp, bend, or show small cracks.<\\\/div>\\n

      Electrical properties<\\\/h3>\\n
      a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.
      b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.
      c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\\\/div>\\n

      Thermal properties<\\\/h3>\\n
      a. They have high thermal conductivity. This helps move heat away from hot parts.
      b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.
      c. They have good heat resistance. They stay stable at high temperature.<\\\/div>\\n

      Other properties<\\\/h3>\\n
      a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.
      b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.
      c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.
      d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\\\/div>\\n

      Methods to make ceramic substrates<\\\/h2>\\n
      Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\\\/div>\\n
      Common process routes are these three:<\\\/div>\\n
        \\n
      1. Stack layers \\u2013 hot press \\u2013 remove binder \\u2013 fire the base sheet \\u2013 form circuit patterns \\u2013 fire the circuit.<\\\/li>\\n
      2. Stack layers \\u2013 print the circuit pattern on the surface \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n
      3. Print circuit pattern \\u2013 stack \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n<\\\/ol>\\n

        Metallization of ceramic PCB<\\\/h2>\\n

        a. Thick film method:<\\\/h3>\\n
        In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\\u2013oxide types.<\\\/div>\\n

        b. Thin film method:<\\\/h3>\\n
        Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\\\/div>\\n

        c. Co-firing method:<\\\/h3>\\n
        Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:
        \\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.
        \\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.
        \\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\\\/div>\\n

        Types of ceramic substrates<\\\/h2>\\n

        Alumina substrate (Al\\u2082O\\u2083)<\\\/h3>\\n
        a. Raw material: Al\\u2082O\\u2083 is often made by the Bayer process<\\\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.
        b. Making: Al\\u2082O\\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\\u20131600\\u00b0C. Metalization methods for Al\\u2082O\\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.
        c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Alumina<\\\/div>\\n
         <\\\/div>\\n

        Mullite substrate (3Al\\u2082O\\u2083\\u00b72SiO\\u2082)<\\\/h3>\\n
        Mullite is one of the most stable crystalline phases in the Al\\u2082O\\u2083\\u2013SiO\\u2082 system. Compared to Al\\u2082O\\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\\\/div>\\n

        Aluminum nitride substrate (AlN)<\\\/h3>\\n
        a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\\u2082O\\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\\u2082 to form AlN directly.
        b. Making: The same forming methods used for Al\\u2082O\\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.
        c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\\u2082O\\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\\u2082O\\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.
        d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Aluminum<\\\/div>\\n
         <\\\/div>\\n

        Silicon carbide substrate (SiC)<\\\/h3>\\n
        a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\\u00b0C to react and form \\u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.
        b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.
        c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.
        d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\\\/div>\\n

        Beryllia substrate (BeO)<\\\/h3>\\n
        BeO has thermal conductivity many times that of Al\\u2082O\\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\\u2082O\\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\\\/div>\\n

        Comparison of some ceramic materials and substrate types<\\\/h2>\\n
        From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\\\/div>\\n
        Common ceramic base materials are BeO, Al\\u2082O\\u2083, AlN, and Si\\u2083N\\u2084. Among these, Si\\u2083N\\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\\\/div>\\n

        High temperature co-fired ceramic multilayer (HTCC)<\\\/h3>\\n
        HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\\u2082O\\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\\u2013200 W\\\/(m\\u00b7\\u00b0C).<\\\/div>\\n

        Low temperature co-fired ceramic PCB(LTCC)<\\\/h3>\\n
        LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\\u2082O\\u2083 powder includes 30\\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\\u2013900\\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\\\/div>\\n

        Thick film ceramic substrate (TFC)<\\\/h3>\\n
        Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\\u2013800\\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\\u201320 \\u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\\\/div>\\n

        Direct bonded copper ceramic PCB(DBC)<\\\/h3>\\n
        DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\\u2082O\\u2083 can control the expansion of the Cu\\u2013Al\\u2082O\\u2083\\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\\u2082O\\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\\u2082O\\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \\u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \\u03bcm.<\\\/div>\\n
         <\\\/div>\\n
        \\\"DBC\\\"<\\\/div>\\n
         <\\\/div>\\n

        Direct plated copper ceramic PCB(DPC)<\\\/h3>\\n
        DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\\\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\\\/div>\\n

        Notes on use and selection<\\\/h2>\\n
        When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\\u2082O\\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\\\/div>\\n
        Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\\\/div>\\n

        Manufacturing tradeoffs and practical points<\\\/h2>\\n
        Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\\\/div>\\n

        Co-firing vs post-firing metallization<\\\/h3>\\n
        Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\\\/div>\\n

        Typical process flow examples (short summary)<\\\/h2>\\n
          \\n
        1. For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\\\/li>\\n
        2. For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\\u2013800\\u00b0C, then trim resistors and add final metal pads.<\\\/li>\\n
        3. For DPC: clean ceramic, deposit Ti\\\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\\\/li>\\n<\\\/ol>\\n

          Summary<\\\/strong><\\\/h2>\\n
          Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\\\/div>\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"c857395\"}]},\"elements\":[],\"widgetType\":\"text-editor\"}],\"isInner\":false},{\"id\":\"jcauneg\",\"elType\":\"section\",\"settings\":{\"gap\":\"no\",\"content_position\":\"top\",\"background_background\":\"classic\",\"background_color\":\"#FFFFFF00\",\"background_position\":\"bottom center\",\"background_attachment\":\"scroll\",\"background_repeat\":\"no-repeat\",\"background_size\":\"cover\",\"background_size_mobile\":\"cover\",\"background_overlay_background\":\"classic\",\"background_overlay_color_b\":\"rgba(255,255,255,0)\",\"background_overlay_opacity\":{\"unit\":\"px\",\"size\":\"\",\"sizes\":[]},\"padding\":{\"unit\":\"px\",\"top\":\"120\",\"right\":\"0\",\"bottom\":\"120\",\"left\":\"0\",\"isLinked\":false},\"padding_tablet\":{\"unit\":\"px\",\"top\":\"80\",\"right\":\"40\",\"bottom\":\"80\",\"left\":\"40\",\"isLinked\":false},\"padding_mobile\":{\"unit\":\"px\",\"top\":\"50\",\"right\":\"25\",\"bottom\":\"50\",\"left\":\"25\",\"isLinked\":false},\"content_width\":{\"unit\":\"px\",\"size\":800,\"sizes\":[]},\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"4cb1949\"}]},\"elements\":[{\"id\":\"7882748\",\"elType\":\"column\",\"settings\":{\"_column_size\":100,\"_inline_size\":null,\"padding\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"space_between_widgets\":40,\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"bcc1c8f\"}]},\"elements\":[{\"id\":\"9fc6712\",\"elType\":\"widget\",\"settings\":{\"title\":\"Frequently Asked Questions\",\"align\":\"center\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"79a2a25\"}]},\"elements\":[],\"widgetType\":\"heading\"},{\"id\":\"631b990\",\"elType\":\"widget\",\"settings\":{\"tabs\":[{\"tab_title\":\"What types of ceramic materials are commonly used?\",\"tab_content\":\"

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p>\",\"_id\":\"9c164e4\"},{\"_id\":\"70a3236\",\"tab_title\":\"What manufacturing processes are used for ceramic PCBs?\",\"tab_content\":\"

          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p>\"},{\"_id\":\"eded620\",\"tab_title\":\"What are the main advantages of ceramic PCBs over FR-4?\",\"tab_content\":\"

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p>\"},{\"_id\":\"4798292\",\"tab_title\":\"Are ceramic PCBs more expensive?\",\"tab_content\":\"

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p>\"},{\"_id\":\"379846e\",\"tab_title\":\"Can ceramic PCBs be used for high-frequency\\\/RF applications?\",\"tab_content\":\"

          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p>\"},{\"_id\":\"662a19b\",\"tab_title\":\"How should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?\",\"tab_content\":\"

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p>\"}],\"border_width\":{\"unit\":\"px\",\"size\":1,\"sizes\":[]},\"border_color\":\"#F5F5F5\",\"selected_icon\":{\"value\":\"fas fa-plus-circle\",\"library\":\"fa-solid\"},\"selected_active_icon\":{\"value\":\"fas fa-minus-circle\",\"library\":\"fa-solid\"},\"tab_active_color\":\"rgba(0, 124, 186, 0.97)\",\"_border_radius\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"_box_shadow_box_shadow\":{\"horizontal\":0,\"vertical\":3,\"blur\":12,\"spread\":4,\"color\":\"rgba(0, 0, 0, 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          \\n\\t\\t[elementor-element k=\\\"0e46bd9387093ca73b9000e38f18cce4\\\" data=\\\"{"id":"612671e","elType":"widget","settings":{"editor":"<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"alignnone size-full wp-image-2693\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/ceramic-pcb.webp\" alt=\"ceramic pcb\" width=\"356\" height=\"289\"><\/div>\n<div>&nbsp;<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Properties of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mechanical properties (how circuit traces are formed)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high mechanical strength. They can hold parts and also act as support structures.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their surface is smooth. They do not warp, bend, or show small cracks.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Electrical properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thermal properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high thermal conductivity. This helps move heat away from hot parts.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. They have good heat resistance. They stay stable at high temperature.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Other properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Methods to make ceramic substrates<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common process routes are these three:<\/div>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>Stack layers \u2013 hot press \u2013 remove binder \u2013 fire the base sheet \u2013 form circuit patterns \u2013 fire the circuit.<\/li>\n<li>Stack layers \u2013 print the circuit pattern on the surface \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<li>Print circuit pattern \u2013 stack \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Metallization of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">a. Thick film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\u2013oxide types.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">b. Thin film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">c. Co-firing method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Types of ceramic substrates<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Alumina substrate (Al\u2082O\u2083)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: Al\u2082O\u2083 is often made by the <a href=\"https:\/\/en.wikipedia.org\/wiki\/Bayer_process\">Bayer process<\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: Al\u2082O\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\u20131600\u00b0C. Metalization methods for Al\u2082O\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2691 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Alumina-substrate.webp\" alt=\"Alumina substrate\" width=\"600\" height=\"476\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mullite substrate (3Al\u2082O\u2083\u00b72SiO\u2082)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Mullite is one of the most stable crystalline phases in the Al\u2082O\u2083\u2013SiO\u2082 system. Compared to Al\u2082O\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Aluminum nitride substrate (AlN)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\u2082O\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\u2082 to form AlN directly.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: The same forming methods used for Al\u2082O\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\u2082O\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\u2082O\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2692 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Aluminum-nitride-substrate.webp\" alt=\"Aluminum nitride substrate\" width=\"600\" height=\"383\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Silicon carbide substrate (SiC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\u00b0C to react and form \u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Beryllia substrate (BeO)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">BeO has thermal conductivity many times that of Al\u2082O\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\u2082O\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Comparison of some ceramic materials and substrate types<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common ceramic base materials are BeO, Al\u2082O\u2083, AlN, and Si\u2083N\u2084. Among these, Si\u2083N\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">High temperature co-fired ceramic multilayer (HTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\u2082O\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\u2013200 W\/(m\u00b7\u00b0C).<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Low temperature co-fired ceramic PCB(LTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\u2082O\u2083 powder includes 30\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\u2013900\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thick film ceramic substrate (TFC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\u2013800\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\u201320 \u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct bonded copper ceramic PCB(DBC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\u2082O\u2083 can control the expansion of the Cu\u2013Al\u2082O\u2083\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\u2082O\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\u2082O\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \u03bcm.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2694 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/DBC.webp\" alt=\"DBC\" width=\"600\" height=\"450\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct plated copper ceramic PCB(DPC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Notes on use and selection<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\u2082O\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Manufacturing tradeoffs and practical points<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Co-firing vs post-firing metallization<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Typical process flow examples (short summary)<\/h2>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\/li>\n<li>For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\u2013800\u00b0C, then trim resistors and add final metal pads.<\/li>\n<li>For DPC: clean ceramic, deposit Ti\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\"><strong data-start=\"32\" data-end=\"43\">Summary<\/strong><\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\/div>","display_condition_list":[{"display_condition_login_status":"subscriber","_id":"c857395"}]},"elements":[],"widgetType":"text-editor"}\\\"]\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          Frequently Asked Questions<\\\/h2>\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat types of ceramic materials are commonly used?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat are the main advantages of ceramic PCBs over FR-4?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tAre ceramic PCBs more expensive?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

          \\n\\t\\t\\t\\t\\t
          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tHow should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/section>\\n\\t\\t\",\"scripts\":[],\"styles\":[]}}"],"_uag_css_file_name":["uag-css-2364.css"],"_uag_js_file_name":["uag-js-2364.js"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"Philifast","author_link":"https:\/\/flj-pcb.com\/de\/author\/2475017442jygmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an […]","_links":{"self":[{"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/pages\/2364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/comments?post=2364"}],"version-history":[{"count":26,"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/pages\/2364\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/pages\/2364\/revisions\/3323"}],"up":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/pages\/1898"}],"wp:attachment":[{"href":"https:\/\/flj-pcb.com\/de\/wp-json\/wp\/v2\/media?parent=2364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}