{"id":2364,"date":"2025-09-02T08:30:07","date_gmt":"2025-09-02T08:30:07","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=2364"},"modified":"2025-09-25T06:49:30","modified_gmt":"2025-09-25T06:49:30","slug":"ceramic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/es\/pcb-manufacturer\/ceramic-pcb\/","title":{"rendered":"PCB cer\u00e1micos: materiales, dise\u00f1o t\u00e9rmico y aplicaciones"},"content":{"rendered":"
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Un sustrato cer\u00e1mico es un tipo especial de placa que se fabrica uniendo directamente una l\u00e1mina de cobre a la superficie de una l\u00e1mina de \u00f3xido o cer\u00e1mica a alta temperatura. El cobre se une a la cer\u00e1mica mediante un proceso a alta temperatura para que el metal y la cer\u00e1mica formen una base estable para los circuitos.<\/div>\n
 <\/div>\n
\"ceramic<\/div>\n
 <\/div>\n

Propiedades de los PCB cer\u00e1micos<\/h2>\n

Propiedades mec\u00e1nicas (c\u00f3mo se forman las trazas de los circuitos)<\/h3>\n
a. Tienen una gran resistencia mec\u00e1nica. Pueden sujetar piezas y tambi\u00e9n actuar como estructuras de soporte.
b. Son f\u00e1ciles de mecanizar. Mantienen las dimensiones exactas. Pueden fabricarse en muchas capas.
c. Su superficie es lisa. No se deforman, ni se doblan, ni presentan peque\u00f1as grietas.<\/div>\n

Propiedades el\u00e9ctricas<\/h3>\n
a. Tienen una alta resistencia de aislamiento y una alta tensi\u00f3n de ruptura. Esto mantiene los circuitos a salvo de cortocircuitos y de da\u00f1os por alta tensi\u00f3n.
b. Tienen baja constante diel\u00e9ctrica y baja p\u00e9rdida diel\u00e9ctrica. Esto ayuda a que las se\u00f1ales pasen con menos p\u00e9rdidas.
c. Su rendimiento se mantiene estable a altas temperaturas y alta humedad. Esto ayuda a garantizar la fiabilidad en condiciones de uso duras.<\/div>\n

Propiedades t\u00e9rmicas<\/h3>\n
a. Tienen una alta conductividad t\u00e9rmica. Esto ayuda a alejar el calor de las piezas calientes.
b. Su coeficiente de dilataci\u00f3n t\u00e9rmica puede coincidir con el de materiales afines, especialmente el silicio. Esta coincidencia reduce la tensi\u00f3n cuando las piezas se calientan y se enfr\u00edan.
c. Tienen buena resistencia al calor. Permanecen estables a altas temperaturas.<\/div>\n

Otras propiedades<\/h3>\n
a. Son qu\u00edmicamente estables. Son f\u00e1ciles de metalizar. Los patrones de circuitos se adhieren bien a ellos.
b. No absorben la humedad. Son resistentes al aceite y a los ataques qu\u00edmicos. Liberan poca radiaci\u00f3n.
c. Los materiales utilizados son inocuos y no t\u00f3xicos. Su estructura cristalina no cambia en el intervalo de temperaturas de trabajo.
d. Las materias primas son abundantes. La tecnolog\u00eda est\u00e1 madura. Son f\u00e1ciles de fabricar y su precio es bajo.<\/div>\n

M\u00e9todos para fabricar sustratos cer\u00e1micos<\/h2>\n
Antes de cocer la cer\u00e1mica, existen cuatro m\u00e9todos habituales de conformado. Se trata del prensado de polvo (que puede ser prensado en molde o prensado isost\u00e1tico), la extrusi\u00f3n, el colado en cinta y el moldeo por inyecci\u00f3n. En los \u00faltimos a\u00f1os, el moldeo en cinta es el m\u00e1s utilizado para los paquetes LSI y los sustratos de circuitos h\u00edbridos, ya que es m\u00e1s f\u00e1cil hacer muchas capas y tiene una mayor eficiencia de producci\u00f3n.<\/div>\n
Las rutas de proceso habituales son estas tres:<\/div>\n
    \n
  1. Apilar capas - prensar en caliente - retirar el aglutinante - cocer la l\u00e1mina base - formar patrones de circuito - cocer el circuito.<\/li>\n
  2. Apilar capas - imprimir el patr\u00f3n del circuito en la superficie - prensar en caliente - retirar el aglutinante - cocer.<\/li>\n
  3. Imprimir patr\u00f3n de circuito - apilar - prensar en caliente - retirar carpeta - cocer.<\/li>\n<\/ol>\n

    Metalizaci\u00f3n de PCB cer\u00e1micos<\/h2>\n

    a. M\u00e9todo de pel\u00edcula gruesa:<\/h3>\n
    En el m\u00e9todo de pel\u00edcula gruesa, los conductores (las trazas del circuito) y las resistencias se forman sobre la cer\u00e1mica mediante serigraf\u00eda. Tras la impresi\u00f3n, las piezas se sinterizan para formar el circuito y las almohadillas de contacto. Los aglutinantes utilizados para fijar el metal impreso son de tipo vidrio, de tipo \u00f3xido y de tipo mixto vidrio-\u00f3xido.<\/div>\n

    b. M\u00e9todo de pel\u00edcula fina:<\/h3>\n
    La pel\u00edcula fina utiliza m\u00e9todos de vac\u00edo como la evaporaci\u00f3n, el recubrimiento i\u00f3nico o la pulverizaci\u00f3n cat\u00f3dica para aplicar el metal. Dado que la pel\u00edcula fina deposita el metal a partir de la fase gaseosa, en principio puede depositarse cualquier metal. Tambi\u00e9n se puede metalizar cualquier sustrato. Pero la dilataci\u00f3n t\u00e9rmica de la pel\u00edcula met\u00e1lica y del sustrato cer\u00e1mico debe coincidir en la medida de lo posible. Tambi\u00e9n es importante aumentar la adherencia de la capa met\u00e1lica a la cer\u00e1mica.<\/div>\n

    c. M\u00e9todo de cocci\u00f3n conjunta:<\/h3>\n
    Antes de la cocci\u00f3n, las pastas met\u00e1licas refractarias de Mo, W y metales similares se serigraf\u00edan sobre las l\u00e1minas cer\u00e1micas sin cocer. A continuaci\u00f3n, la pila se desbarba y se cuece para que la cer\u00e1mica y el metal formen una estructura integral. Este m\u00e9todo presenta las siguientes caracter\u00edsticas:
    \u25a0 Puede formar l\u00edneas de circuito muy finas y es f\u00e1cil hacer muchas capas, por lo que es posible un cableado de alta densidad.
    \u25a0 Como el aislante y el conductor se forman juntos, es posible el sellado herm\u00e9tico en paquetes.
    Eligiendo la composici\u00f3n, la presi\u00f3n de conformado y la temperatura de sinterizaci\u00f3n adecuadas, se puede controlar la contracci\u00f3n por sinterizaci\u00f3n. Especialmente cuando se fabrica un sustrato con una contracci\u00f3n cero en el plano, se abre la posibilidad de utilizarlo en BGA, CSP y embalajes de alta densidad de chip desnudo.<\/div>\n

    Tipos de sustratos cer\u00e1micos<\/h2>\n

    Sustrato de al\u00famina (Al\u2082O\u2083)<\/h3>\n
    a. Materia prima: El Al\u2082O\u2083 se fabrica a menudo por la Proceso Bayer<\/a>. En este m\u00e9todo, la materia prima es la bauxita, que incluye \u00f3xidos de aluminio hidratados y compuestos relacionados.
    b. Fabricaci\u00f3n: Las cer\u00e1micas de Al\u2082O\u2083 suelen fabricarse apilando l\u00e1minas sin cocer. A menudo se utiliza un aglutinante como el butiral de polivinilo (PVB). La temperatura de cocci\u00f3n var\u00eda en funci\u00f3n de los coadyuvantes de sinterizaci\u00f3n a\u00f1adidos, y suele ser de 1550-1600\u00b0C. Los m\u00e9todos de metalizaci\u00f3n del Al\u2082O\u2083 son principalmente los de pel\u00edcula gruesa y los de cocci\u00f3n conjunta. Las pastas y la tecnolog\u00eda del proceso est\u00e1n maduras. Hoy en d\u00eda satisfacen muchas necesidades de aplicaci\u00f3n.
    c. Aplicaciones: Sustratos para circuitos integrados h\u00edbridos, sustratos para paquetes LSI y sustratos para circuitos multicapa.<\/div>\n
     <\/div>\n
    \"Alumina<\/div>\n
     <\/div>\n

    Sustrato de mullita (3Al\u2082O\u2083-2SiO\u2082)<\/h3>\n
    La mullita es una de las fases cristalinas m\u00e1s estables del sistema Al\u2082O\u2083-SiO\u2082. En comparaci\u00f3n con el Al\u2082O\u2083, la mullita tiene una resistencia mec\u00e1nica y una conductividad t\u00e9rmica algo menores, pero su constante diel\u00e9ctrica es m\u00e1s baja. Esta constante diel\u00e9ctrica m\u00e1s baja puede ayudar a mejorar la velocidad de la se\u00f1al. Su coeficiente de expansi\u00f3n t\u00e9rmica tambi\u00e9n es bajo, lo que reduce el estr\u00e9s t\u00e9rmico en el LSI montado. Adem\u00e1s, la diferencia de dilataci\u00f3n con metales conductores como el Mo y el W es menor, por lo que la cocci\u00f3n conjunta provoca menos tensi\u00f3n entre el metal y la cer\u00e1mica.<\/div>\n

    Sustrato de nitruro de aluminio (AlN)<\/h3>\n
    a. Materia prima: El AlN no es un mineral natural. Es un material artificial sintetizado por primera vez en el siglo XIX. Los polvos t\u00edpicos de AlN se fabrican mediante nitruraci\u00f3n por reducci\u00f3n o nitruraci\u00f3n directa. El m\u00e9todo de nitruraci\u00f3n por reducci\u00f3n parte del Al\u2082O\u2083 y utiliza carbono de gran pureza para reducirlo y, a continuaci\u00f3n, reacciona con nitr\u00f3geno para formar AlN. El m\u00e9todo de nitruraci\u00f3n directa hace reaccionar polvo de Al con N\u2082 para formar AlN directamente.
    b. Conformaci\u00f3n: Los mismos m\u00e9todos de conformado utilizados para los sustratos de Al\u2082O\u2083 pueden utilizarse para el AlN. La ruta m\u00e1s utilizada es el apilamiento de l\u00e1minas sin cocer. Para ello, se mezclan polvo de AlN, aglutinantes org\u00e1nicos, disolvente y un tensioactivo para obtener una pasta cer\u00e1mica. La lechada se funde con cinta, se apila, se prensa en caliente, se desbarba y, a continuaci\u00f3n, se cuece para fabricar el sustrato de AlN.
    c. Caracter\u00edsticas del sustrato de AlN: El AlN tiene una conductividad t\u00e9rmica m\u00e1s de diez veces superior a la del Al\u2082O\u2083. Su coeficiente de expansi\u00f3n t\u00e9rmica (CTE) es igual al del silicio. En comparaci\u00f3n con el Al\u2082O\u2083, el AlN tiene mayor resistencia de aislamiento y mayor tensi\u00f3n de ruptura. Su constante diel\u00e9ctrica es menor. Estas caracter\u00edsticas hacen que el AlN sea muy valioso para los sustratos de encapsulado.
    d. Aplicaciones: Utilizado para m\u00f3dulos amplificadores de potencia en banda VHF, dispositivos de alta potencia y sustratos de diodos l\u00e1ser.<\/div>\n
     <\/div>\n
    \"Aluminum<\/div>\n
     <\/div>\n

    Sustrato de carburo de silicio (SiC)<\/h3>\n
    a. Materia prima: El SiC no es un mineral natural. Se fabrica mezclando s\u00edlice, coque y un poco de sal en forma de polvo. La mezcla se calienta en un horno de grafito a m\u00e1s de 2000\u00b0C para que reaccione y forme \u03b1-SiC. Despu\u00e9s, el SiC puede purificarse por sublimaci\u00f3n para obtener un bloque de material policristalino de color verde oscuro.
    b. Fabricaci\u00f3n: El SiC tiene una estabilidad qu\u00edmica y t\u00e9rmica muy elevada, por lo que los m\u00e9todos de cocci\u00f3n normales dificultan su densificaci\u00f3n. Se necesitan auxiliares de sinterizaci\u00f3n y m\u00e9todos de cocci\u00f3n especiales. Se suele utilizar el prensado en caliente al vac\u00edo.
    c. Caracter\u00edsticas del SiC: Una caracter\u00edstica clave es su gran coeficiente de difusi\u00f3n t\u00e9rmica. Puede ser incluso mayor que el del cobre. Su dilataci\u00f3n t\u00e9rmica es m\u00e1s parecida a la del silicio. Pero el SiC tiene algunos inconvenientes. Su constante diel\u00e9ctrica es relativamente alta y su tensi\u00f3n de ruptura no es tan buena como la de otras cer\u00e1micas.
    d. Aplicaciones: Los sustratos de SiC se utilizan cuando se necesita una alta dispersi\u00f3n del calor y el voltaje no es elevado. Se utilizan para paquetes disipadores de calor VLSI, LSI l\u00f3gicos de alta velocidad y alta integraci\u00f3n con disipadores de calor, grandes ordenadores y sustratos de diodos l\u00e1ser para comunicaciones \u00f3pticas.<\/div>\n

    Sustrato de berilio (BeO)<\/h3>\n
    El BeO tiene una conductividad t\u00e9rmica varias veces superior a la del Al\u2082O\u2083. Funciona bien en circuitos de alta potencia. Su constante diel\u00e9ctrica es baja, por lo que resulta adecuado para circuitos de alta frecuencia. Los sustratos de BeO suelen fabricarse por prensado en seco. Tambi\u00e9n pueden fabricarse por la v\u00eda de l\u00e1minas sin cocer con peque\u00f1as adiciones de MgO o Al\u2082O\u2083. Como el polvo de BeO es t\u00f3xico, los productos de BeO plantean problemas medioambientales y sanitarios. En Jap\u00f3n no est\u00e1 permitida la producci\u00f3n de sustratos de BeO y hay que importarlo de lugares como Estados Unidos.<\/div>\n

    Comparaci\u00f3n de algunos materiales cer\u00e1micos y tipos de sustrato<\/h2>\n
    Desde el punto de vista de la estructura y los m\u00e9todos de fabricaci\u00f3n, los sustratos cer\u00e1micos pueden agruparse en HTCC, LTCC, TFC, DBC, DPC, etc. Los sustratos cer\u00e1micos se utilizan cada vez m\u00e1s en envases electr\u00f3nicos y en electr\u00f3nica de potencia como IGBT (transistor bipolar de puerta aislada), LD (diodo l\u00e1ser), LED de alta potencia y CPV (concentrador fotovoltaico) debido a su buena conductividad t\u00e9rmica, resistencia al calor, aislamiento, baja expansi\u00f3n t\u00e9rmica y coste decreciente.<\/div>\n
    Los materiales de base cer\u00e1mica m\u00e1s comunes son BeO, Al\u2082O\u2083, AlN y Si\u2083N\u2084. Entre ellos, el Si\u2083N\u2084 tiene un aislamiento el\u00e9ctrico y una estabilidad qu\u00edmica muy elevados. Tambi\u00e9n tiene buena estabilidad t\u00e9rmica y alta resistencia mec\u00e1nica. Puede utilizarse para placas de circuitos de alta densidad y alta integraci\u00f3n.<\/div>\n

    Multicapa cer\u00e1mica de cocci\u00f3n a alta temperatura (HTCC)<\/h3>\n
    HTCC es un sustrato cer\u00e1mico cocido a alta temperatura. Para fabricar HTCC, primero se mezcla polvo cer\u00e1mico como Al\u2082O\u2083 o AlN con un aglutinante org\u00e1nico. La mezcla se convierte en una pasta y, a continuaci\u00f3n, se forman l\u00e1minas con una rasqueta o m\u00e9todos similares. Las l\u00e1minas secas se convierten en cuerpos verdes. Se taladran los agujeros para las v\u00edas y se serigraf\u00edan las pastas conductoras para el cableado y el relleno de las v\u00edas. A continuaci\u00f3n, las l\u00e1minas verdes se apilan y se introducen en un horno de alta temperatura, en torno a 1600 \u00b0C, para su sinterizaci\u00f3n. Como la temperatura de sinterizaci\u00f3n es alta, la elecci\u00f3n de los metales conductores es limitada. Se utilizan metales con altos puntos de fusi\u00f3n pero menor conductividad, como el wolframio, el molibdeno y el manganeso. El coste es elevado y la conductividad t\u00e9rmica oscila en torno a 20-200 W\/(m-\u00b0C).<\/div>\n

    PCB de cer\u00e1mica cocida a baja temperatura (LTCC)<\/h3>\n
    LTCC es una cer\u00e1mica de cocci\u00f3n a baja temperatura. Sus pasos de fabricaci\u00f3n son similares a los de la HTCC. La diferencia es que el polvo de Al\u2082O\u2083 incluye 30-50% en masa de vidrio de bajo punto de fusi\u00f3n. Esto reduce la temperatura de cocci\u00f3n a unos 850-900\u00b0C. Como la temperatura de cocci\u00f3n es baja, pueden utilizarse metales conductores con buena conductividad, como el oro y la plata, para electrodos y trazas. LTCC utiliza serigraf\u00eda para las l\u00edneas met\u00e1licas. Este m\u00e9todo puede presentar errores de alineaci\u00f3n debido al estiramiento de la malla. Adem\u00e1s, cuando las multicapas se apilan y se cocinan conjuntamente, pueden producirse diferentes contracciones que perjudican el rendimiento. Para aumentar la conductividad t\u00e9rmica de los LTCC, pueden a\u00f1adirse v\u00edas t\u00e9rmicas o conductivas en las zonas de los componentes, pero esto aumenta el coste.<\/div>\n

    Sustrato cer\u00e1mico de capa gruesa (TFC)<\/h3>\n
    Comparado con el LTCC y el HTCC, el TFC es un sustrato cer\u00e1mico postcocci\u00f3n. Utiliza serigraf\u00eda para aplicar pastas met\u00e1licas sobre la superficie de la base cer\u00e1mica. Tras el secado, la pieza se cuece a alta temperatura (700-800\u00b0C). Las pastas met\u00e1licas est\u00e1n compuestas de polvo met\u00e1lico, resina org\u00e1nica y vidrio. Tras la cocci\u00f3n, la resina se quema y la capa que queda es principalmente de metal unido por un adhesivo v\u00edtreo a la superficie cer\u00e1mica. El grosor de la capa met\u00e1lica cocida suele ser de 10-20 \u03bcm y la anchura m\u00ednima de la l\u00ednea es de unos 0,3 mm. Dado que la tecnolog\u00eda est\u00e1 madura, el proceso es sencillo y el coste es bajo, el TFC se utiliza cuando las necesidades de precisi\u00f3n del patr\u00f3n no son elevadas.<\/div>\n

    Placa de circuito impreso (PCB) de cobre-cer\u00e1mica de enlace directo (DBC)<\/h3>\n
    El DBC se fabrica por co-sinterizaci\u00f3n o uni\u00f3n eut\u00e9ctica de una l\u00e1mina de cobre a una l\u00e1mina cer\u00e1mica a alta temperatura (unos 1065\u00b0C). Tras la uni\u00f3n, se forman patrones de circuito mediante grabado. Como la l\u00e1mina de cobre tiene buena conducci\u00f3n el\u00e9ctrica y t\u00e9rmica y el Al\u2082O\u2083 puede controlar la expansi\u00f3n del compuesto Cu-Al\u2082O\u2083-Cu, el DBC tiene una expansi\u00f3n t\u00e9rmica cercana a la de la al\u00famina. El DBC tiene buena conducci\u00f3n t\u00e9rmica, fuerte aislamiento y alta fiabilidad. Se utiliza mucho en el embalaje de IGBT, diodos l\u00e1ser y CPV. El DBC tiene inconvenientes. La reacci\u00f3n eut\u00e9ctica a alta temperatura entre Cu y Al\u2082O\u2083 requiere un control estricto del equipo y el proceso, por lo que el coste es mayor. Pueden formarse microporos entre el Al\u2082O\u2083 y el Cu, lo que reduce la resistencia al choque t\u00e9rmico. La l\u00e1mina de cobre puede deformarse a altas temperaturas, por lo que el grosor del cobre en el DBC suele ser superior a 100 \u03bcm. Tambi\u00e9n se utiliza el grabado para formar patrones, por lo que la anchura m\u00ednima de las l\u00edneas suele ser superior a 100 \u03bcm.<\/div>\n
     <\/div>\n
    \"DBC\"<\/div>\n
     <\/div>\n

    Placa de circuito impreso cer\u00e1mica de cobre con chapado directo (DPC)<\/h3>\n
    El DPC comienza con la limpieza y el pretratamiento de la l\u00e1mina cer\u00e1mica. A continuaci\u00f3n, se deposita una capa semilla de Ti\/Cu mediante pulverizaci\u00f3n cat\u00f3dica al vac\u00edo sobre la superficie del sustrato. La fotolitograf\u00eda, el revelado y el grabado se utilizan para formar el patr\u00f3n del circuito. A continuaci\u00f3n, se utiliza la galvanoplastia o el revestimiento qu\u00edmico para aumentar el grosor del circuito. Una vez eliminada la capa fotorresistente, el sustrato est\u00e1 completo. El DPC presenta las siguientes ventajas: proceso a baja temperatura (inferior a 300\u00b0C), por lo que evita los inconvenientes de las altas temperaturas para los materiales y circuitos y reduce el coste de fabricaci\u00f3n. El uso de pel\u00edcula fina y fotolitograf\u00eda hace que las l\u00edneas de metal en el sustrato sean m\u00e1s finas. Por tanto, el DPC es muy adecuado para paquetes que necesitan una gran precisi\u00f3n de alineaci\u00f3n. Pero el DPC tambi\u00e9n tiene sus inconvenientes. El grosor del cobre galv\u00e1nico es limitado, y el l\u00edquido residual de la galvanoplastia puede contaminar. La adherencia entre la capa met\u00e1lica y la cer\u00e1mica es menor, por lo que la fiabilidad del producto puede ser menor.<\/div>\n

    Notas sobre el uso y la selecci\u00f3n<\/h2>\n
    Al elegir un sustrato cer\u00e1mico, adapte el material a las necesidades de la aplicaci\u00f3n. Si necesita una alta conductividad t\u00e9rmica y una expansi\u00f3n t\u00e9rmica cercana a la del silicio, el AlN o el SiC pueden ser los mejores. Si lo que importa es el coste y un procesamiento maduro, el Al\u2082O\u2083 es una opci\u00f3n s\u00f3lida. Si necesita l\u00edneas finas y un procesamiento a baja temperatura, DPC y LTCC pueden funcionar. Si necesita un cableado multicapa de alta densidad y un sellado herm\u00e9tico, las rutas de cocci\u00f3n como LTCC o HTCC con metal co-sinterizado pueden ser las adecuadas.<\/div>\n
    Entre las \u00e1reas de aplicaci\u00f3n m\u00e1s comunes se encuentran los m\u00f3dulos de potencia, los amplificadores de potencia de RF, los m\u00f3dulos de diodos l\u00e1ser, los LED de alta potencia y el envasado de LSI de alta densidad. La electr\u00f3nica de potencia se beneficia de los sustratos cer\u00e1micos porque mueven bien el calor y mantienen el aislamiento y la resistencia mec\u00e1nica en condiciones de estr\u00e9s t\u00e9rmico. Los dispositivos de radiofrecuencia se benefician de su baja p\u00e9rdida diel\u00e9ctrica y sus propiedades diel\u00e9ctricas estables. Los envases de alta densidad se benefician de la posibilidad de hacer l\u00edneas finas y apilar muchas capas con un buen control de la alineaci\u00f3n si el proceso es adecuado.<\/div>\n

    Compromisos de fabricaci\u00f3n y aspectos pr\u00e1cticos<\/h2>\n
    Cada tipo de cer\u00e1mica y cada proceso tiene sus ventajas y sus inconvenientes. El HTCC utiliza altas temperaturas de cocci\u00f3n, por lo que emplea metales refractarios como conductores. Esto limita la conductividad y aumenta el coste, pero el HTCC puede ser muy robusto a altas temperaturas. El LTCC reduce la temperatura de cocci\u00f3n a\u00f1adiendo vidrio, lo que permite utilizar mejores conductores, pero puede presentar problemas de contracci\u00f3n y alineaci\u00f3n en multicapas. El TFC es barato y sencillo, pero no permite obtener patrones muy finos. El DBC ofrece una excelente dispersi\u00f3n del calor con cobre grueso, pero su l\u00edmite de patr\u00f3n y su coste de fabricaci\u00f3n pueden ser un problema. El DPC permite patrones finos y un procesamiento a baja temperatura, pero hay que tener cuidado con la adherencia y el control de los residuos.<\/div>\n

    Co-cocci\u00f3n vs metalizaci\u00f3n post-cocci\u00f3n<\/h3>\n
    La cocci\u00f3n conjunta consiste en imprimir pastas met\u00e1licas sobre la cer\u00e1mica verde y cocerlo todo junto. De este modo se pueden conseguir caracter\u00edsticas muy peque\u00f1as y un verdadero cableado multicapa. Tambi\u00e9n permite que la cer\u00e1mica y el metal se conviertan en un cuerpo integrado, lo que facilita el sellado herm\u00e9tico. Pero la cocci\u00f3n conjunta requiere un control cuidadoso de los materiales para igualar la contracci\u00f3n y la sinterizaci\u00f3n. La metalizaci\u00f3n posterior a la cocci\u00f3n, como una pel\u00edcula gruesa o fina sobre cer\u00e1mica cocida, evita los problemas de contracci\u00f3n de la co-sinterizaci\u00f3n. Puede ser m\u00e1s f\u00e1cil para necesidades de una sola capa o de doble capa simple. Pero los m\u00e9todos de postcocci\u00f3n pueden no alcanzar la misma densidad de cableado y tener propiedades t\u00e9rmicas o de adhesi\u00f3n diferentes.<\/div>\n

    Ejemplos de flujos de procesos t\u00edpicos (breve resumen)<\/h2>\n
      \n
    1. Para sustrato multicapa cocido: hacer pasta cer\u00e1mica, colar cinta, perforar v\u00edas en cinta verde, imprimir pastas conductoras por pantalla, apilar cintas, prensar y desenrollar, y luego cocer. Despu\u00e9s de la cocci\u00f3n, realice el procesamiento final, como la metalizaci\u00f3n de la almohadilla y el grabado del circuito, si es necesario.<\/li>\n
    2. Para pel\u00edcula gruesa sobre cer\u00e1mica: utilizar sustrato cer\u00e1mico cocido, serigrafiar pastas conductoras y resistencias, cocer a 700-800\u00b0C, despu\u00e9s recortar las resistencias y a\u00f1adir las almohadillas met\u00e1licas finales.<\/li>\n
    3. Para DPC: limpiar la cer\u00e1mica, depositar la semilla de Ti\/Cu por pulverizaci\u00f3n cat\u00f3dica, crear el patr\u00f3n fotorresistente, grabar la semilla para crear el patr\u00f3n, electrodepositar para hacer crecer el cobre, retirar la resistencia y limpieza final.<\/li>\n<\/ol>\n

      Resumen<\/strong><\/h2>\n
      Los PCB cer\u00e1micos son una clase de materiales de sustrato que ofrecen ventajas \u00fanicas para el envasado electr\u00f3nico. Ofrecen buenas trayectorias t\u00e9rmicas, un comportamiento el\u00e9ctrico estable a temperatura y una buena resistencia mec\u00e1nica. Las distintas opciones cer\u00e1micas y las diferentes rutas de metalizaci\u00f3n permiten a los dise\u00f1adores equilibrar el coste, el rendimiento t\u00e9rmico, el rendimiento el\u00e9ctrico y las necesidades de patrones de l\u00edneas finas. Por ello, los sustratos cer\u00e1micos se utilizan ampliamente en electr\u00f3nica de potencia, m\u00f3dulos de RF, paquetes de l\u00e1ser y diodos, LED de alta potencia y muchos campos de embalaje de alta densidad.<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t\t\t\t
      <\/div>\n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t
      \n\t\t\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t

      Preguntas frecuentes<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\u00bfQu\u00e9 tipos de materiales cer\u00e1micos se utilizan habitualmente?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Las m\u00e1s comunes son la al\u00famina (Al\u2082O\u2083) para uso general y el nitruro de aluminio (AlN) para una mayor conductividad t\u00e9rmica; otras cer\u00e1micas especializadas (por ejemplo, el carburo de silicio) se utilizan para necesidades espec\u00edficas de alta potencia o alta temperatura.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\u00bfQu\u00e9 procesos de fabricaci\u00f3n se utilizan para las placas de circuito impreso cer\u00e1micas?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Las placas de circuito impreso cer\u00e1micas se fabrican mediante procesos como la impresi\u00f3n de pel\u00edcula gruesa, la deposici\u00f3n de pel\u00edcula fina, el mecanizado por l\u00e1ser y la metalizaci\u00f3n (cobre o plata), seguidos de la cocci\u00f3n y el acabado.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\u00bfCu\u00e1les son las principales ventajas de las placas de circuito impreso cer\u00e1micas frente a las FR-4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Ventajas clave: conductividad t\u00e9rmica mucho mejor (disipaci\u00f3n del calor), menor coeficiente de expansi\u00f3n t\u00e9rmica (CTE), tolerancia a altas temperaturas y excelente aislamiento el\u00e9ctrico, lo que los hace ideales para LED, electr\u00f3nica de potencia y aplicaciones de RF\/alta frecuencia.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\u00bfSon m\u00e1s caras las placas de circuito impreso cer\u00e1micas?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      S\u00ed: los costes de los materiales y los procesos especializados (cocci\u00f3n, mecanizado por l\u00e1ser, metalizaci\u00f3n) hacen que las placas de circuito impreso cer\u00e1micas sean m\u00e1s caras que las FR-4 est\u00e1ndar; sin embargo, para dise\u00f1os de alta potencia o fiabilidad pueden reducir los costes del sistema al mejorar el rendimiento y la vida \u00fatil.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\u00bfPueden utilizarse placas de circuito impreso cer\u00e1micas para aplicaciones de alta frecuencia\/RF?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      S\u00ed. Los sustratos cer\u00e1micos ofrecen propiedades diel\u00e9ctricas estables y bajas p\u00e9rdidas a altas frecuencias, lo que los convierte en una buena elecci\u00f3n para componentes de circuitos de RF y microondas.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tC\u00f3mo debo elegir entre al\u00famina (Al\u2082O\u2083) y nitruro de aluminio (AlN)?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Elija la al\u00famina por su rentabilidad y uso general; elija el AlN cuando necesite una mayor conductividad t\u00e9rmica y una mejor gesti\u00f3n t\u00e9rmica para aplicaciones de alta potencia. Su elecci\u00f3n debe reflejar los requisitos t\u00e9rmicos, mec\u00e1nicos y presupuestarios.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an 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      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\\\/div>\\n
       <\\\/div>\\n
      \\\"ceramic<\\\/div>\\n
       <\\\/div>\\n

      Properties of ceramic PCB<\\\/h2>\\n

      Mechanical properties (how circuit traces are formed)<\\\/h3>\\n
      a. They have high mechanical strength. They can hold parts and also act as support structures.
      b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.
      c. Their surface is smooth. They do not warp, bend, or show small cracks.<\\\/div>\\n

      Electrical properties<\\\/h3>\\n
      a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.
      b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.
      c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\\\/div>\\n

      Thermal properties<\\\/h3>\\n
      a. They have high thermal conductivity. This helps move heat away from hot parts.
      b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.
      c. They have good heat resistance. They stay stable at high temperature.<\\\/div>\\n

      Other properties<\\\/h3>\\n
      a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.
      b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.
      c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.
      d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\\\/div>\\n

      Methods to make ceramic substrates<\\\/h2>\\n
      Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\\\/div>\\n
      Common process routes are these three:<\\\/div>\\n
        \\n
      1. Stack layers \\u2013 hot press \\u2013 remove binder \\u2013 fire the base sheet \\u2013 form circuit patterns \\u2013 fire the circuit.<\\\/li>\\n
      2. Stack layers \\u2013 print the circuit pattern on the surface \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n
      3. Print circuit pattern \\u2013 stack \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n<\\\/ol>\\n

        Metallization of ceramic PCB<\\\/h2>\\n

        a. Thick film method:<\\\/h3>\\n
        In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\\u2013oxide types.<\\\/div>\\n

        b. Thin film method:<\\\/h3>\\n
        Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\\\/div>\\n

        c. Co-firing method:<\\\/h3>\\n
        Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:
        \\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.
        \\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.
        \\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\\\/div>\\n

        Types of ceramic substrates<\\\/h2>\\n

        Alumina substrate (Al\\u2082O\\u2083)<\\\/h3>\\n
        a. Raw material: Al\\u2082O\\u2083 is often made by the Bayer process<\\\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.
        b. Making: Al\\u2082O\\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\\u20131600\\u00b0C. Metalization methods for Al\\u2082O\\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.
        c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Alumina<\\\/div>\\n
         <\\\/div>\\n

        Mullite substrate (3Al\\u2082O\\u2083\\u00b72SiO\\u2082)<\\\/h3>\\n
        Mullite is one of the most stable crystalline phases in the Al\\u2082O\\u2083\\u2013SiO\\u2082 system. Compared to Al\\u2082O\\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\\\/div>\\n

        Aluminum nitride substrate (AlN)<\\\/h3>\\n
        a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\\u2082O\\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\\u2082 to form AlN directly.
        b. Making: The same forming methods used for Al\\u2082O\\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.
        c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\\u2082O\\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\\u2082O\\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.
        d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Aluminum<\\\/div>\\n
         <\\\/div>\\n

        Silicon carbide substrate (SiC)<\\\/h3>\\n
        a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\\u00b0C to react and form \\u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.
        b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.
        c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.
        d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\\\/div>\\n

        Beryllia substrate (BeO)<\\\/h3>\\n
        BeO has thermal conductivity many times that of Al\\u2082O\\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\\u2082O\\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\\\/div>\\n

        Comparison of some ceramic materials and substrate types<\\\/h2>\\n
        From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\\\/div>\\n
        Common ceramic base materials are BeO, Al\\u2082O\\u2083, AlN, and Si\\u2083N\\u2084. Among these, Si\\u2083N\\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\\\/div>\\n

        High temperature co-fired ceramic multilayer (HTCC)<\\\/h3>\\n
        HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\\u2082O\\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\\u2013200 W\\\/(m\\u00b7\\u00b0C).<\\\/div>\\n

        Low temperature co-fired ceramic PCB(LTCC)<\\\/h3>\\n
        LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\\u2082O\\u2083 powder includes 30\\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\\u2013900\\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\\\/div>\\n

        Thick film ceramic substrate (TFC)<\\\/h3>\\n
        Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\\u2013800\\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\\u201320 \\u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\\\/div>\\n

        Direct bonded copper ceramic PCB(DBC)<\\\/h3>\\n
        DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\\u2082O\\u2083 can control the expansion of the Cu\\u2013Al\\u2082O\\u2083\\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\\u2082O\\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\\u2082O\\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \\u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \\u03bcm.<\\\/div>\\n
         <\\\/div>\\n
        \\\"DBC\\\"<\\\/div>\\n
         <\\\/div>\\n

        Direct plated copper ceramic PCB(DPC)<\\\/h3>\\n
        DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\\\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\\\/div>\\n

        Notes on use and selection<\\\/h2>\\n
        When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\\u2082O\\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\\\/div>\\n
        Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\\\/div>\\n

        Manufacturing tradeoffs and practical points<\\\/h2>\\n
        Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\\\/div>\\n

        Co-firing vs post-firing metallization<\\\/h3>\\n
        Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\\\/div>\\n

        Typical process flow examples (short summary)<\\\/h2>\\n
          \\n
        1. For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\\\/li>\\n
        2. For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\\u2013800\\u00b0C, then trim resistors and add final metal pads.<\\\/li>\\n
        3. For DPC: clean ceramic, deposit Ti\\\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\\\/li>\\n<\\\/ol>\\n

          Summary<\\\/strong><\\\/h2>\\n
          Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\\\/div>\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"c857395\"}]},\"elements\":[],\"widgetType\":\"text-editor\"}],\"isInner\":false},{\"id\":\"jcauneg\",\"elType\":\"section\",\"settings\":{\"gap\":\"no\",\"content_position\":\"top\",\"background_background\":\"classic\",\"background_color\":\"#FFFFFF00\",\"background_position\":\"bottom center\",\"background_attachment\":\"scroll\",\"background_repeat\":\"no-repeat\",\"background_size\":\"cover\",\"background_size_mobile\":\"cover\",\"background_overlay_background\":\"classic\",\"background_overlay_color_b\":\"rgba(255,255,255,0)\",\"background_overlay_opacity\":{\"unit\":\"px\",\"size\":\"\",\"sizes\":[]},\"padding\":{\"unit\":\"px\",\"top\":\"120\",\"right\":\"0\",\"bottom\":\"120\",\"left\":\"0\",\"isLinked\":false},\"padding_tablet\":{\"unit\":\"px\",\"top\":\"80\",\"right\":\"40\",\"bottom\":\"80\",\"left\":\"40\",\"isLinked\":false},\"padding_mobile\":{\"unit\":\"px\",\"top\":\"50\",\"right\":\"25\",\"bottom\":\"50\",\"left\":\"25\",\"isLinked\":false},\"content_width\":{\"unit\":\"px\",\"size\":800,\"sizes\":[]},\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"4cb1949\"}]},\"elements\":[{\"id\":\"7882748\",\"elType\":\"column\",\"settings\":{\"_column_size\":100,\"_inline_size\":null,\"padding\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"space_between_widgets\":40,\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"bcc1c8f\"}]},\"elements\":[{\"id\":\"9fc6712\",\"elType\":\"widget\",\"settings\":{\"title\":\"Frequently Asked Questions\",\"align\":\"center\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"79a2a25\"}]},\"elements\":[],\"widgetType\":\"heading\"},{\"id\":\"631b990\",\"elType\":\"widget\",\"settings\":{\"tabs\":[{\"tab_title\":\"What types of ceramic materials are commonly used?\",\"tab_content\":\"

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p>\",\"_id\":\"9c164e4\"},{\"_id\":\"70a3236\",\"tab_title\":\"What manufacturing processes are used for ceramic PCBs?\",\"tab_content\":\"

          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p>\"},{\"_id\":\"eded620\",\"tab_title\":\"What are the main advantages of ceramic PCBs over FR-4?\",\"tab_content\":\"

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p>\"},{\"_id\":\"4798292\",\"tab_title\":\"Are ceramic PCBs more expensive?\",\"tab_content\":\"

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p>\"},{\"_id\":\"379846e\",\"tab_title\":\"Can ceramic PCBs be used for high-frequency\\\/RF applications?\",\"tab_content\":\"

          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p>\"},{\"_id\":\"662a19b\",\"tab_title\":\"How should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?\",\"tab_content\":\"

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p>\"}],\"border_width\":{\"unit\":\"px\",\"size\":1,\"sizes\":[]},\"border_color\":\"#F5F5F5\",\"selected_icon\":{\"value\":\"fas fa-plus-circle\",\"library\":\"fa-solid\"},\"selected_active_icon\":{\"value\":\"fas fa-minus-circle\",\"library\":\"fa-solid\"},\"tab_active_color\":\"rgba(0, 124, 186, 0.97)\",\"_border_radius\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"_box_shadow_box_shadow\":{\"horizontal\":0,\"vertical\":3,\"blur\":12,\"spread\":4,\"color\":\"rgba(0, 0, 0, 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          \\n\\t\\t[elementor-element k=\\\"0e46bd9387093ca73b9000e38f18cce4\\\" data=\\\"{"id":"612671e","elType":"widget","settings":{"editor":"<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"alignnone size-full wp-image-2693\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/ceramic-pcb.webp\" alt=\"ceramic pcb\" width=\"356\" height=\"289\"><\/div>\n<div>&nbsp;<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Properties of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mechanical properties (how circuit traces are formed)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high mechanical strength. They can hold parts and also act as support structures.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their surface is smooth. They do not warp, bend, or show small cracks.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Electrical properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thermal properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high thermal conductivity. This helps move heat away from hot parts.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. They have good heat resistance. They stay stable at high temperature.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Other properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Methods to make ceramic substrates<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common process routes are these three:<\/div>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>Stack layers \u2013 hot press \u2013 remove binder \u2013 fire the base sheet \u2013 form circuit patterns \u2013 fire the circuit.<\/li>\n<li>Stack layers \u2013 print the circuit pattern on the surface \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<li>Print circuit pattern \u2013 stack \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Metallization of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">a. Thick film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\u2013oxide types.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">b. Thin film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">c. Co-firing method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Types of ceramic substrates<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Alumina substrate (Al\u2082O\u2083)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: Al\u2082O\u2083 is often made by the <a href=\"https:\/\/en.wikipedia.org\/wiki\/Bayer_process\">Bayer process<\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: Al\u2082O\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\u20131600\u00b0C. Metalization methods for Al\u2082O\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2691 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Alumina-substrate.webp\" alt=\"Alumina substrate\" width=\"600\" height=\"476\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mullite substrate (3Al\u2082O\u2083\u00b72SiO\u2082)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Mullite is one of the most stable crystalline phases in the Al\u2082O\u2083\u2013SiO\u2082 system. Compared to Al\u2082O\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Aluminum nitride substrate (AlN)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\u2082O\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\u2082 to form AlN directly.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: The same forming methods used for Al\u2082O\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\u2082O\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\u2082O\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2692 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Aluminum-nitride-substrate.webp\" alt=\"Aluminum nitride substrate\" width=\"600\" height=\"383\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Silicon carbide substrate (SiC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\u00b0C to react and form \u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Beryllia substrate (BeO)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">BeO has thermal conductivity many times that of Al\u2082O\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\u2082O\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Comparison of some ceramic materials and substrate types<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common ceramic base materials are BeO, Al\u2082O\u2083, AlN, and Si\u2083N\u2084. Among these, Si\u2083N\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">High temperature co-fired ceramic multilayer (HTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\u2082O\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\u2013200 W\/(m\u00b7\u00b0C).<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Low temperature co-fired ceramic PCB(LTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\u2082O\u2083 powder includes 30\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\u2013900\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thick film ceramic substrate (TFC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\u2013800\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\u201320 \u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct bonded copper ceramic PCB(DBC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\u2082O\u2083 can control the expansion of the Cu\u2013Al\u2082O\u2083\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\u2082O\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\u2082O\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \u03bcm.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2694 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/DBC.webp\" alt=\"DBC\" width=\"600\" height=\"450\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct plated copper ceramic PCB(DPC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Notes on use and selection<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\u2082O\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Manufacturing tradeoffs and practical points<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Co-firing vs post-firing metallization<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Typical process flow examples (short summary)<\/h2>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\/li>\n<li>For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\u2013800\u00b0C, then trim resistors and add final metal pads.<\/li>\n<li>For DPC: clean ceramic, deposit Ti\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\"><strong data-start=\"32\" data-end=\"43\">Summary<\/strong><\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\/div>","display_condition_list":[{"display_condition_login_status":"subscriber","_id":"c857395"}]},"elements":[],"widgetType":"text-editor"}\\\"]\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          Frequently Asked Questions<\\\/h2>\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat types of ceramic materials are commonly used?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat are the main advantages of ceramic PCBs over FR-4?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tAre ceramic PCBs more expensive?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tHow should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/section>\\n\\t\\t\",\"scripts\":[],\"styles\":[]}}"],"_uag_css_file_name":["uag-css-2364.css"],"_uag_js_file_name":["uag-js-2364.js"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"Philifast","author_link":"https:\/\/flj-pcb.com\/es\/author\/2475017442jygmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an […]","_links":{"self":[{"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/pages\/2364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/comments?post=2364"}],"version-history":[{"count":26,"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/pages\/2364\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/pages\/2364\/revisions\/3323"}],"up":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/pages\/1898"}],"wp:attachment":[{"href":"https:\/\/flj-pcb.com\/es\/wp-json\/wp\/v2\/media?parent=2364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}