{"id":2364,"date":"2025-09-02T08:30:07","date_gmt":"2025-09-02T08:30:07","guid":{"rendered":"https:\/\/flj-pcb.com\/?page_id=2364"},"modified":"2025-09-25T06:49:30","modified_gmt":"2025-09-25T06:49:30","slug":"ceramic-pcb","status":"publish","type":"page","link":"https:\/\/flj-pcb.com\/fi\/pcb-manufacturer\/ceramic-pcb\/","title":{"rendered":"Keraaminen PCB: materiaalit, l\u00e4mp\u00f6suunnittelu ja sovellukset"},"content":{"rendered":"
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Keraaminen substraatti on erityinen levytyyppi, joka on valmistettu liimaamalla kuparifolio suoraan oksidin tai keraamisen levyn pintaan korkeassa l\u00e4mp\u00f6tilassa. Kupari liitet\u00e4\u00e4n keraamiseen korkeassa l\u00e4mp\u00f6tilassa, joten metalli ja keraaminen muodostavat vakaan pohjan virtapiireille.<\/div>\n
 <\/div>\n
\"ceramic<\/div>\n
 <\/div>\n

Keraamisen PCB:n ominaisuudet<\/h2>\n

Mekaaniset ominaisuudet (miten piirij\u00e4ljet muodostuvat)<\/h3>\n
a. Niill\u00e4 on suuri mekaaninen lujuus. Ne voivat pit\u00e4\u00e4 osia ja toimia my\u00f6s tukirakenteina.
b. Ne on helppo ty\u00f6st\u00e4\u00e4. Ne s\u00e4ilytt\u00e4v\u00e4t tarkat mitat. Niit\u00e4 voidaan valmistaa monikerroksisina.
c. Niiden pinta on sile\u00e4. Ne eiv\u00e4t v\u00e4\u00e4ntyile, taivu tai niiss\u00e4 ei ole pieni\u00e4 halkeamia.<\/div>\n

S\u00e4hk\u00f6iset ominaisuudet<\/h3>\n
a. Niill\u00e4 on korkea eristysresistanssi ja korkea l\u00e4pily\u00f6ntij\u00e4nnite. T\u00e4m\u00e4 suojaa virtapiirej\u00e4 oikosululta ja suurj\u00e4nnitevaurioilta.
b. Niiden dielektrisyysvakio ja dielektrinen h\u00e4vi\u00f6 ovat alhaiset. T\u00e4m\u00e4 auttaa signaaleja kulkemaan pienemm\u00e4ll\u00e4 h\u00e4vi\u00f6ll\u00e4.
c. Niiden suorituskyky pysyy vakaana korkeassa l\u00e4mp\u00f6tilassa ja korkeassa kosteudessa. T\u00e4m\u00e4 auttaa varmistamaan luotettavuuden kovissa k\u00e4ytt\u00f6olosuhteissa.<\/div>\n

L\u00e4mp\u00f6ominaisuudet<\/h3>\n
a. Niiden l\u00e4mm\u00f6njohtavuus on korkea. T\u00e4m\u00e4 auttaa siirt\u00e4m\u00e4\u00e4n l\u00e4mp\u00f6\u00e4 pois kuumista osista.
b. Niiden l\u00e4mp\u00f6laajenemiskerroin voi vastata niihin liittyvi\u00e4 materiaaleja, erityisesti piit\u00e4. T\u00e4m\u00e4 vastaavuus v\u00e4hent\u00e4\u00e4 j\u00e4nnityst\u00e4 osien l\u00e4mmetess\u00e4 ja j\u00e4\u00e4htyess\u00e4.
c. Niiden l\u00e4mm\u00f6nkest\u00e4vyys on hyv\u00e4. Ne pysyv\u00e4t vakaina korkeassa l\u00e4mp\u00f6tilassa.<\/div>\n

Muut ominaisuudet<\/h3>\n
a. Ne ovat kemiallisesti vakaita. Ne on helppo metalloida. Piirikuviot tarttuvat niihin hyvin.
b. Ne eiv\u00e4t ime kosteutta. Ne kest\u00e4v\u00e4t \u00f6ljyn ja kemikaalien vaikutusta. Ne vapauttavat vain v\u00e4h\u00e4n s\u00e4teily\u00e4.
c. K\u00e4ytetyt materiaalit ovat vaarattomia eiv\u00e4tk\u00e4 myrkyllisi\u00e4. Niiden kiderakenne ei muutu k\u00e4ytt\u00f6l\u00e4mp\u00f6tila-alueella.
d. Raaka-aineita on runsaasti. Teknologia on kyps\u00e4\u00e4. Niit\u00e4 on helppo valmistaa ja niiden hinta on alhainen.<\/div>\n

Menetelm\u00e4t keraamisten substraattien valmistamiseksi<\/h2>\n
Ennen keramiikan polttamista on nelj\u00e4 yleist\u00e4 muokkausmenetelm\u00e4\u00e4. N\u00e4m\u00e4 ovat jauhepuristus (joka voi olla muottiinpuristus tai isostaattinen puristus), puristaminen, teippivalu ja ruiskupuristus. N\u00e4ist\u00e4 menetelmist\u00e4 nauhavalua on k\u00e4ytetty viime vuosina useammin LSI-paketeissa ja hybridipiirien substraateissa, koska sill\u00e4 on helpompi valmistaa monia kerroksia ja sen tuotantotehokkuus on suurempi.<\/div>\n
Yleisi\u00e4 prosessireittej\u00e4 ovat n\u00e4m\u00e4 kolme:<\/div>\n
    \n
  1. Kerrosten pinoaminen - kuumapuristus - sideaineen poistaminen - peruslevyn polttaminen - piirikuvioiden muodostaminen - piirin polttaminen.<\/li>\n
  2. Kerrosten pinoaminen - piirikuvion tulostaminen pinnalle - kuumapuristus - sideaineen poistaminen - yhteispalaminen.<\/li>\n
  3. Tulosta piirikuvio - pino - kuumapuristus - poista sideaine - rinnakkaispoltto.<\/li>\n<\/ol>\n

    Keraamisen PCB:n metallisointi<\/h2>\n

    a. Paksukalvomenetelm\u00e4:<\/h3>\n
    Paksukalvomenetelm\u00e4ss\u00e4 johtimet (piirij\u00e4ljet) ja vastukset muodostetaan keraamiselle materiaalille silkkipainamalla. Tulostuksen j\u00e4lkeen osat sintrataan piirin ja kontaktityynyjen muodostamiseksi. Painetun metallin kiinnitt\u00e4miseen k\u00e4ytett\u00e4v\u00e4t sideaineet ovat lasityyppisi\u00e4, oksidityyppisi\u00e4 ja lasi-oksidityyppisi\u00e4.<\/div>\n

    b. Ohutkalvomenetelm\u00e4:<\/h3>\n
    Ohutkalvoissa k\u00e4ytet\u00e4\u00e4n tyhji\u00f6menetelmi\u00e4, kuten haihduttamista, ionipinnoitusta tai sputterointia, metallin levitt\u00e4miseen. Koska ohutkalvop\u00e4\u00e4llystysmenetelm\u00e4ss\u00e4 metalli kerrostuu kaasufaasista, periaatteessa mit\u00e4 tahansa metallia voidaan kerrostua. My\u00f6s mik\u00e4 tahansa substraatti voidaan periaatteessa metalloida t\u00e4ll\u00e4 tavoin. Metallikalvon ja keraamisen alustan l\u00e4mp\u00f6laajenemisen on kuitenkin vastattava mahdollisimman hyvin toisiaan. On my\u00f6s t\u00e4rke\u00e4\u00e4 lis\u00e4t\u00e4 metallikerroksen tarttuvuutta keraamiseen.<\/div>\n

    c. Rinnakkaispolttomenetelm\u00e4:<\/h3>\n
    Ennen polttoa tulenkest\u00e4v\u00e4t metallipastat, jotka sis\u00e4lt\u00e4v\u00e4t Mo:ta, W:t\u00e4 ja vastaavia metalleja, painetaan seulapainatuksella polttamattomille keraamisille levyille. T\u00e4m\u00e4n j\u00e4lkeen pino poistetaan hionta ja poltetaan niin, ett\u00e4 keramiikka ja metalli muodostavat yhden yhten\u00e4isen rakenteen. Menetelm\u00e4ll\u00e4 on seuraavat ominaisuudet:
    \u25a0 Sill\u00e4 voidaan muodostaa eritt\u00e4in hienoja piirilinjoja, ja sill\u00e4 on helppo tehd\u00e4 useita kerroksia, joten tihe\u00e4 johdotus on mahdollista.
    \u25a0 Koska eriste ja johdin on muodostettu yhdess\u00e4, pakkausten hermeettinen tiivist\u00e4minen on mahdollista.
    \u25a0 Valitsemalla oikea koostumus, muodostuspaine ja sintrausl\u00e4mp\u00f6tila voidaan hallita sintrauskutistumaa. Erityisesti kun valmistetaan substraatti, jonka kutistuma tasossa on nolla, t\u00e4m\u00e4 mahdollistaa k\u00e4yt\u00f6n BGA-, CSP- ja paljaiden sirujen tiheiss\u00e4 pakkauksissa.<\/div>\n

    Keraamiset alustatyypit<\/h2>\n

    Alumiinialusta (Al\u2082O\u2083)<\/h3>\n
    a. Raaka-aine: Al\u2082O\u2083 valmistetaan usein k\u00e4ytt\u00e4m\u00e4ll\u00e4 Bayerin prosessi<\/a>. T\u00e4ss\u00e4 menetelm\u00e4ss\u00e4 raaka-aineena k\u00e4ytet\u00e4\u00e4n bauksiittia, joka sis\u00e4lt\u00e4\u00e4 hydratoituneita alumiinioksideja ja niihin liittyvi\u00e4 yhdisteit\u00e4.
    b. Tekeminen: Al\u2082O\u2083-keramiikka muodostetaan yleens\u00e4 pinoamalla polttamattomia levyj\u00e4. Usein k\u00e4ytet\u00e4\u00e4n sideainetta, kuten polyvinyylibutyraalia (PVB). Polttol\u00e4mp\u00f6tila vaihtelee lis\u00e4tt\u00e4vien sintrausaineiden mukaan ja on yleens\u00e4 1550-1600 \u00b0C. Al\u2082O\u2083:n metallointimenetelmi\u00e4 ovat p\u00e4\u00e4asiassa paksukalvo- ja rinnakkaispolttomenetelm\u00e4t. Pastat ja prosessitekniikka ovat kehittyneit\u00e4. Ne t\u00e4ytt\u00e4v\u00e4t nyky\u00e4\u00e4n monia sovellustarpeita.
    c. Sovellukset: Integroitujen hybridipiirien substraatit, LSI-pakettien substraatit ja monikerroksisten piirien substraatit.<\/div>\n
     <\/div>\n
    \"Alumina<\/div>\n
     <\/div>\n

    Muliittisubstraatti (3Al\u2082O\u2083-2SiO\u2082)<\/h3>\n
    Muliitti on yksi Al\u2082O\u2083-SiO\u2082-j\u00e4rjestelm\u00e4n vakaimmista kiteisist\u00e4 faaseista. Al\u2082O\u2083:een verrattuna mullitilla on hieman alhaisempi mekaaninen lujuus ja alhaisempi l\u00e4mm\u00f6njohtavuus, mutta sen dielektrisyysvakio on alhaisempi. T\u00e4m\u00e4 pienempi dielektrisyysvakio voi auttaa parantamaan signaalin nopeutta. Sen l\u00e4mp\u00f6laajenemiskerroin on my\u00f6s alhainen, mik\u00e4 v\u00e4hent\u00e4\u00e4 asennettuun LSI:hen kohdistuvaa l\u00e4mp\u00f6rasitusta. My\u00f6s paisuntaero johtaviin metalleihin, kuten Mo ja W, on pienempi, joten rinnakkaispoltto aiheuttaa v\u00e4hemm\u00e4n j\u00e4nnityst\u00e4 metallin ja keraamisen aineen v\u00e4lill\u00e4.<\/div>\n

    Alumiininitridialusta (AlN)<\/h3>\n
    a. Raaka-aine: AlN ei ole luonnollinen mineraali. Se on ihmisen valmistama materiaali, joka syntetisoitiin ensimm\u00e4isen kerran 1800-luvulla. Tyypilliset AlN-jauheet valmistetaan pelkistysnitridoimalla tai suoralla nitridoimalla. Pelkistysnitridointimenetelm\u00e4ss\u00e4 Al\u2082O\u2083:sta l\u00e4hdet\u00e4\u00e4n liikkeelle ja k\u00e4ytet\u00e4\u00e4n eritt\u00e4in puhdasta hiilt\u00e4 sen pelkist\u00e4miseen, mink\u00e4 j\u00e4lkeen se reagoi typen kanssa muodostaen AlN:\u00e4\u00e4. Suorassa nitridointimenetelm\u00e4ss\u00e4 Al-jauhe reagoi N\u2082:n kanssa muodostaen suoraan AlN:\u00e4\u00e4.
    b. Tekeminen: Al\u2082O\u2083-substraateille k\u00e4ytettyj\u00e4 samoja muokkausmenetelmi\u00e4 voidaan k\u00e4ytt\u00e4\u00e4 AlN:lle. Eniten k\u00e4ytetty menetelm\u00e4 on polttamattomien levyjen pinoaminen. T\u00e4t\u00e4 varten AlN-jauhe, orgaaniset sideaineet, liuotin ja pinta-aktiivinen aine sekoitetaan keraamisen lietteen valmistamiseksi. Liete valetaan teippivaluna, pinotaan, kuumapuristetaan, poistetaan karsta ja poltetaan sitten AlN-alustan valmistamiseksi.
    c. AlN-alustan ominaisuudet: AlN:n l\u00e4mm\u00f6njohtavuus on yli kymmenen kertaa suurempi kuin Al\u2082O\u2083:n. Sen l\u00e4mp\u00f6laajenemiskerroin (CTE) vastaa piit\u00e4. Al\u2082O\u2083:een verrattuna AlN:ll\u00e4 on suurempi eristysresistanssi ja suurempi l\u00e4pily\u00f6ntij\u00e4nnite. Sen dielektrisyysvakio on pienempi. N\u00e4m\u00e4 ominaisuudet tekev\u00e4t AlN:st\u00e4 eritt\u00e4in arvokkaan pakkaussubstraatin.
    d. Sovellukset: K\u00e4ytet\u00e4\u00e4n VHF-kaistan tehovahvistinmoduuleissa, suuritehoisissa laitteissa ja laserdiodien substraateissa.<\/div>\n
     <\/div>\n
    \"Aluminum<\/div>\n
     <\/div>\n

    Piikarbidialusta (SiC)<\/h3>\n
    a. Raaka-aine: SiC ei ole luonnollinen mineraali. Sit\u00e4 valmistetaan sekoittamalla piidioksidia, koksia ja hieman suolaa jauheiksi. Seos kuumennetaan grafiittiuunissa yli 2000 \u00b0C:n l\u00e4mp\u00f6tilassa, jolloin se reagoi ja muodostaa \u03b1-SiC:t\u00e4. T\u00e4m\u00e4n j\u00e4lkeen SiC voidaan puhdistaa sublimoimalla, jolloin saadaan tummanvihre\u00e4 monikiteinen lohko.
    b. Tekeminen: SiC:ll\u00e4 on eritt\u00e4in korkea kemiallinen ja terminen stabiilisuus, joten tavanomaisilla polttomenetelmill\u00e4 sit\u00e4 on vaikea tiivist\u00e4\u00e4. Tarvitaan sintrausapuv\u00e4lineit\u00e4 ja erityisi\u00e4 polttomenetelmi\u00e4. Yleisesti k\u00e4ytet\u00e4\u00e4n tyhji\u00f6kuumapuristusta.
    c. SiC-ominaisuudet: SiC:n keskeinen ominaisuus on sen eritt\u00e4in suuri l\u00e4mp\u00f6diffuusiokerroin. Se voi olla jopa suurempi kuin kuparin. Sen l\u00e4mp\u00f6laajeneminen on l\u00e4hemp\u00e4n\u00e4 piit\u00e4. SiC:ll\u00e4 on kuitenkin joitakin haittapuolia. Sen dielektrisyysvakio on suhteellisen korkea, eik\u00e4 sen l\u00e4pily\u00f6ntij\u00e4nnite ole yht\u00e4 hyv\u00e4 kuin joidenkin muiden keraamisten materiaalien.
    d. Sovellukset: SiC-alustoja k\u00e4ytet\u00e4\u00e4n silloin, kun tarvitaan suurta l\u00e4mm\u00f6n levi\u00e4mist\u00e4 ja kun j\u00e4nnite ei ole korkea. Niit\u00e4 k\u00e4ytet\u00e4\u00e4n VLSI-l\u00e4mm\u00f6nsiirtopaketeissa, suurnopeus- ja integrointilogiikan LSI-piireiss\u00e4, joissa on j\u00e4\u00e4hdytyslevyj\u00e4, suurissa tietokoneissa ja optisen viestinn\u00e4n laserdiodialustoissa.<\/div>\n

    Beryllia-alusta (BeO)<\/h3>\n
    BeO:n l\u00e4mm\u00f6njohtavuus on moninkertainen Al\u2082O\u2083:n l\u00e4mm\u00f6njohtavuuteen verrattuna. Se toimii hyvin suuritehoisissa piireiss\u00e4. Sen dielektrisyysvakio on alhainen, joten se soveltuu korkeataajuuspiireihin. BeO-alustat valmistetaan yleens\u00e4 kuivapuristamalla. Niit\u00e4 voidaan valmistaa my\u00f6s polttamattomalla levyrakenteella, johon on lis\u00e4tty pieni\u00e4 m\u00e4\u00e4ri\u00e4 MgO:ta tai Al\u2082O\u2083:ta. Koska BeO-jauhe on myrkyllist\u00e4, BeO-tuotteet aiheuttavat ymp\u00e4rist\u00f6- ja terveysongelmia. Japanissa BeO-alustan tuotanto ei ole sallittua, ja BeO:ta on tuotava esimerkiksi Yhdysvalloista.<\/div>\n

    Er\u00e4iden keraamisten materiaalien ja alustatyyppien vertailu<\/h2>\n
    Rakenteen ja valmistusmenetelmien perusteella keraamiset substraatit voidaan ryhmitell\u00e4 HTCC-, LTCC-, TFC-, DBC-, DPC- ja niin edelleen. Keraamisia substraatteja k\u00e4ytet\u00e4\u00e4n yh\u00e4 enemm\u00e4n elektroniikkapakkauksissa ja tehoelektroniikassa, kuten IGBT:ss\u00e4 (eristetty portti-bipolaaritransistori), LD:ss\u00e4 (laserdiodi), suuritehoisissa LED:iss\u00e4 ja CPV:ss\u00e4 (konsentraattorivalos\u00e4hk\u00f6), koska niiden l\u00e4mm\u00f6njohtavuus, l\u00e4mm\u00f6nkest\u00e4vyys, erist\u00e4vyys, alhainen l\u00e4mp\u00f6laajeneminen ja laskevat kustannukset ovat hyvi\u00e4.<\/div>\n
    Yleisi\u00e4 keraamisia perusmateriaaleja ovat BeO, Al\u2082O\u2083, AlN ja Si\u2083N\u2084. N\u00e4ist\u00e4 Si\u2083N\u2084:ll\u00e4 on eritt\u00e4in hyv\u00e4 s\u00e4hk\u00f6inen eristys ja kemiallinen stabiilisuus. Sill\u00e4 on my\u00f6s hyv\u00e4 l\u00e4mm\u00f6nkest\u00e4vyys ja korkea mekaaninen lujuus. Sit\u00e4 voidaan k\u00e4ytt\u00e4\u00e4 suuren tiheyden ja korkean integraation piirilevyiss\u00e4.<\/div>\n

    Korkean l\u00e4mp\u00f6tilan yhteispoltettu keraaminen monikerros (HTCC)<\/h3>\n
    HTCC on korkeassa l\u00e4mp\u00f6tilassa poltettu keraaminen substraatti. HTCC:n valmistamiseksi ensin keraaminen jauhe, kuten Al\u2082O\u2083 tai AlN, sekoitetaan orgaanisen sideaineen kanssa. Seoksesta tehd\u00e4\u00e4n tahna, joka muotoillaan sitten levyiksi talttauster\u00e4ll\u00e4 tai vastaavilla menetelmill\u00e4. Kuivatut levyt muuttuvat vihreiksi kappaleiksi. L\u00e4pivientej\u00e4 varten porataan reiki\u00e4 ja johdinpastat painetaan silkkipainolla johdotusta ja l\u00e4pivientien t\u00e4ytt\u00e4mist\u00e4 varten. T\u00e4m\u00e4n j\u00e4lkeen vihre\u00e4t levyt pinotaan ja asetetaan noin 1600 \u00b0C:n korkeassa l\u00e4mp\u00f6tilassa olevaan uuniin sintrausta varten. Koska sintrausl\u00e4mp\u00f6tila on korkea, johtavien metallien valikoima on rajallinen. K\u00e4ytet\u00e4\u00e4n metalleja, joilla on korkea sulamispiste mutta heikompi johtavuus, kuten volframia, molybdeenia ja mangaania. Kustannukset ovat korkeat, ja l\u00e4mm\u00f6njohtavuus on noin 20-200 W\/(m-\u00b0C).<\/div>\n

    Matalassa l\u00e4mp\u00f6tilassa poltettu keraaminen PCB (LTCC)<\/h3>\n
    LTCC on matalassa l\u00e4mp\u00f6tilassa poltettu keraaminen. Sen valmistusvaiheet ovat samanlaiset kuin HTCC:n. Erona on, ett\u00e4 Al\u2082O\u2083-jauhe sis\u00e4lt\u00e4\u00e4 30-50% massaltaan matalan sulamispisteen lasia. T\u00e4m\u00e4 laskee polttol\u00e4mp\u00f6tilan noin 850-900 \u00b0C:een. Koska polttol\u00e4mp\u00f6tila on matala, elektrodeissa ja j\u00e4lkijohdoissa voidaan k\u00e4ytt\u00e4\u00e4 johtavia metalleja, joilla on hyv\u00e4 johtavuus, kuten kultaa ja hopeaa. LTCC:ss\u00e4 k\u00e4ytet\u00e4\u00e4n metalliviivojen painamista silkkipainolla. T\u00e4ss\u00e4 menetelm\u00e4ss\u00e4 voi esiinty\u00e4 kohdistusvirheit\u00e4, koska verkko venyy. Kun monikerroksisia kerroksia pinotaan ja poltetaan yhdess\u00e4, voi esiinty\u00e4 erilaista kutistumista, mik\u00e4 heikent\u00e4\u00e4 saantoa. LTCC:n l\u00e4mm\u00f6njohtavuuden lis\u00e4\u00e4miseksi komponenttien alueille voidaan lis\u00e4t\u00e4 l\u00e4mp\u00f6l\u00e4pivientej\u00e4 tai johtavia l\u00e4pivientej\u00e4, mutta t\u00e4m\u00e4 nostaa kustannuksia.<\/div>\n

    Paksu keraaminen kalvosubstraatti (TFC)<\/h3>\n
    LTCC:hen ja HTCC:hen verrattuna TFC on j\u00e4lkik\u00e4teen poltettu keraaminen substraatti. Siin\u00e4 k\u00e4ytet\u00e4\u00e4n silkkipainatusta metallipastojen levitt\u00e4miseen keraamisen pohjan pinnalle. Kuivauksen j\u00e4lkeen osa poltetaan korkeassa l\u00e4mp\u00f6tilassa (700-800 \u00b0C). Metallipastat on valmistettu metallijauheesta, orgaanisesta hartsista ja lasista. Polttamisen j\u00e4lkeen hartsi palaa pois, ja j\u00e4ljelle j\u00e4\u00e4 kerros, joka on enimm\u00e4kseen metallia, joka on sidottu lasimaisella liimalla keraamiseen pintaan. Poltetun metallikerroksen paksuus on tyypillisesti 10-20 \u03bcm ja viivan v\u00e4himm\u00e4isleveys on noin 0,3 mm. Koska tekniikka on kehittynyt, prosessi on yksinkertainen ja kustannukset ovat alhaiset, TFC:t\u00e4 k\u00e4ytet\u00e4\u00e4n silloin, kun kuvion tarkkuus ei ole suuri.<\/div>\n

    Suoraan sidottu kuparikeraaminen PCB (DBC)<\/h3>\n
    DBC valmistetaan yhteissintraamalla tai eutektisesti liimaamalla kuparifolio keraamiseen levyyn korkeassa l\u00e4mp\u00f6tilassa (noin 1065 \u00b0C). Liimauksen j\u00e4lkeen piirikuviot muodostetaan sy\u00f6vytt\u00e4m\u00e4ll\u00e4. Koska kuparifoliolla on hyv\u00e4 s\u00e4hk\u00f6- ja l\u00e4mm\u00f6njohtavuus ja Al\u2082O\u2083 voi hallita Cu-Al\u2082O\u2083-Cu-komposiitin laajenemista, DBC:n l\u00e4mp\u00f6laajeneminen on l\u00e4hell\u00e4 alumiinioksidia. DBC:ll\u00e4 on hyv\u00e4 l\u00e4mm\u00f6njohtavuus, vahva eristys ja korkea luotettavuus. Sit\u00e4 k\u00e4ytet\u00e4\u00e4n laajalti IGBT-, laserdiodi- ja CPV-pakkauksissa. DBC:ll\u00e4 on haittoja. Korkean l\u00e4mp\u00f6tilan eutektinen reaktio Cu:n ja Al\u2082O\u2083:n v\u00e4lill\u00e4 edellytt\u00e4\u00e4 laitteiden ja prosessin tiukkaa valvontaa, joten kustannukset ovat korkeammat. Al\u2082O\u2083:n ja Cu:n v\u00e4liin voi muodostua mikrohuokosia, mik\u00e4 heikent\u00e4\u00e4 l\u00e4mp\u00f6shokkien kest\u00e4vyytt\u00e4. Kuparifolio voi v\u00e4\u00e4nty\u00e4 korkeassa l\u00e4mp\u00f6tilassa, joten kuparin paksuus DBC:ss\u00e4 on yleens\u00e4 yli 100 \u03bcm. My\u00f6s etsausta k\u00e4ytet\u00e4\u00e4n kuvioiden muodostamiseen, joten viivan v\u00e4himm\u00e4isleveys on yleens\u00e4 yli 100 \u03bcm.<\/div>\n
     <\/div>\n
    \"DBC\"<\/div>\n
     <\/div>\n

    Suora p\u00e4\u00e4llystetty kupari keraaminen PCB (DPC)<\/h3>\n
    DPC alkaa keraamisen levyn puhdistuksella ja esik\u00e4sittelyll\u00e4. Sen j\u00e4lkeen substraatin pinnalle kerrostetaan Ti\/Cu-siemenkerros tyhji\u00f6p\u00f6lytt\u00e4m\u00e4ll\u00e4. Piirikuvion muodostamiseen k\u00e4ytet\u00e4\u00e4n fotolitografiaa, kehitt\u00e4mist\u00e4 ja etsausta. Sitten piirin paksuuden kasvattamiseen k\u00e4ytet\u00e4\u00e4n galvanointia tai kemiallista pinnoitusta. Kun fotoresisti on poistettu, substraatti on valmis. DPC:ll\u00e4 on seuraavat edut: matalal\u00e4mp\u00f6tilaprosessi (alle 300 \u00b0C), joten siin\u00e4 v\u00e4ltet\u00e4\u00e4n korkean l\u00e4mp\u00f6tilan haitat materiaaleille ja piireille ja alennetaan valmistuskustannuksia. Ohutkalvon ja fotolitografian k\u00e4ytt\u00f6 tekee metalliviivoista substraatilla hienompia. DPC soveltuu siis hyvin pakkauksiin, joissa tarvitaan suurta kohdistustarkkuutta. DPC:ll\u00e4 on kuitenkin my\u00f6s huonoja puolia. Elektropinnoitetun kuparin paksuus on rajallinen, ja elektropinnoitusj\u00e4teneste voi aiheuttaa saasteita. Metallikerroksen ja keraamisen kerroksen v\u00e4linen tartunta on heikompi, joten tuotteen luotettavuus voi olla heikompi.<\/div>\n

    K\u00e4ytt\u00f6\u00e4 ja valintaa koskevat huomautukset<\/h2>\n
    Kun valitset keraamista alustaa, sovita materiaali sovelluksen tarpeisiin. Jos tarvitset korkean l\u00e4mm\u00f6njohtavuuden ja l\u00e4mp\u00f6laajenemisen l\u00e4hell\u00e4 piit\u00e4, AlN tai SiC voi olla paras vaihtoehto. Jos kustannuksilla ja kyps\u00e4ll\u00e4 k\u00e4sittelyll\u00e4 on merkityst\u00e4, Al\u2082O\u2083 on hyv\u00e4 valinta. Jos tarvitset hienoja viivoja ja matalan l\u00e4mp\u00f6tilan k\u00e4sittely\u00e4, DPC ja LTCC voivat toimia. Jos tarvitset tiheit\u00e4 monikerrosjohtoja ja hermeettist\u00e4 tiivistyst\u00e4, rinnakkaispoltetut reitit, kuten LTCC tai HTCC, jossa on rinnakkaissintrattua metallia, voivat olla oikeita.<\/div>\n
    Yleisi\u00e4 sovellusalueita ovat tehomoduulit, RF-tehovahvistimet, laserdiodimoduulit, suuritehoiset LEDit ja suuritiheyksiset LSI-pakkaukset. Tehoelektroniikka hy\u00f6tyy keraamisista substraateista, koska ne siirt\u00e4v\u00e4t hyvin l\u00e4mp\u00f6\u00e4 ja s\u00e4ilytt\u00e4v\u00e4t eristyksen ja mekaanisen lujuuden l\u00e4mp\u00f6rasituksessa. RF-laitteet hy\u00f6tyv\u00e4t alhaisista dielektrisist\u00e4 h\u00e4vi\u00f6ist\u00e4 ja vakaista dielektrisist\u00e4 ominaisuuksista. Suuritiheyksiset pakkaukset hy\u00f6tyv\u00e4t kyvyst\u00e4 tehd\u00e4 hienoja viivoja ja pinota useita kerroksia hyv\u00e4ll\u00e4 kohdistuksen hallinnalla, jos prosessi on sopiva.<\/div>\n

    Valmistuksen kompromissit ja k\u00e4yt\u00e4nn\u00f6n seikat<\/h2>\n
    Jokaisessa keramiikkatyypiss\u00e4 ja prosessissa on kompromisseja. HTCC:ss\u00e4 k\u00e4ytet\u00e4\u00e4n korkeaa polttol\u00e4mp\u00f6tilaa, joten johtimina k\u00e4ytet\u00e4\u00e4n tulenkest\u00e4vi\u00e4 metalleja. T\u00e4m\u00e4 rajoittaa johtavuutta ja nostaa kustannuksia, mutta HTCC voi olla eritt\u00e4in kest\u00e4v\u00e4 korkeissa l\u00e4mp\u00f6tiloissa. LTCC laskee polttol\u00e4mp\u00f6tilaa lis\u00e4\u00e4m\u00e4ll\u00e4 lasia, jolloin voidaan k\u00e4ytt\u00e4\u00e4 parempia johtimia, mutta LTCC:ll\u00e4 voi olla kutistumisongelmia ja kohdistamisongelmia monikerroksisissa kerroksissa. TFC on halpaa ja yksinkertaista, mutta sill\u00e4 ei voida saada aikaan hyvin hienoja kuvioita. DBC antaa erinomaisen l\u00e4mm\u00f6njakautumisen paksulla kuparilla, mutta sen kuviointimahdollisuudet ja valmistuskustannukset voivat olla ongelma. DPC mahdollistaa hienon kuvioinnin ja matalissa l\u00e4mp\u00f6tiloissa tapahtuvan k\u00e4sittelyn, mutta adheesio ja j\u00e4tteiden hallinta vaativat huolellisuutta.<\/div>\n

    Yhteispoltto vs. j\u00e4lkipoltto metallointi<\/h3>\n
    Yhteispoltto tarkoittaa metallipastojen painamista vihre\u00e4\u00e4n keramiikkaan ja kaiken polttamista yhdess\u00e4. N\u00e4in voidaan tehd\u00e4 hyvin pieni\u00e4 piirteit\u00e4 ja todellisia monikerroksisia johdotuksia. Keraaminen ja metallinen materiaali muuttuvat my\u00f6s yhdeksi yhten\u00e4iseksi kappaleeksi, mik\u00e4 helpottaa ilmatiivist\u00e4 tiivist\u00e4mist\u00e4. Yhteispoltto edellytt\u00e4\u00e4 kuitenkin materiaalien huolellista hallintaa, jotta kutistuminen ja sintraantuminen saadaan sovitettua yhteen. Polttamisen j\u00e4lkeisell\u00e4 metalloinnilla, kuten paksulla kalvolla tai ohuella kalvolla poltetun keraamisen p\u00e4\u00e4lle, v\u00e4ltet\u00e4\u00e4n yhteissintrauksen kutistumisongelmat. Se voi olla helpompaa yksikerroksisissa tai yksinkertaisissa kaksikerroksisissa tarpeissa. J\u00e4lkipoltetuilla menetelmill\u00e4 ei kuitenkaan v\u00e4ltt\u00e4m\u00e4tt\u00e4 saavuteta samaa johdotustiheytt\u00e4, ja niiden tarttuvuus tai l\u00e4mp\u00f6ominaisuudet voivat olla erilaiset.<\/div>\n

    Tyypillisi\u00e4 esimerkkej\u00e4 prosessivirroista (lyhyt yhteenveto)<\/h2>\n
      \n
    1. Yhteispoltetun monikerroksisen substraatin osalta: tee keraaminen liete, teippivalu, poraa l\u00e4piviennit vihre\u00e4\u00e4n teippiin, tulosta johtimen pastat n\u00e4yt\u00f6ll\u00e4, pinoa nauhat, paina ja irrota sidokset ja ammu sitten. Polttamisen j\u00e4lkeen tehd\u00e4\u00e4n tarvittaessa loppuk\u00e4sittely, kuten tyynymetallinnus ja piirin etsaus.<\/li>\n
    2. Paksua kalvoa keraamiselle: k\u00e4yt\u00e4 poltettua keraamista alustaa, silkkipainatusta johtimesta ja vastuksen tahnoista, polta 700-800 \u00b0C:ssa, leikkaa vastukset ja lis\u00e4\u00e4 lopulliset metallityynyt.<\/li>\n
    3. DPC:t\u00e4 varten: puhdas keraaminen, Ti\/Cu-siemenen tallettaminen sputteroimalla, kuviointiresisti, siemenen sy\u00f6vytt\u00e4minen kuvion aikaansaamiseksi, kuparin kasvattaminen elektrolyyttisell\u00e4 levyll\u00e4, vastuksen poistaminen ja lopullinen puhdistus.<\/li>\n<\/ol>\n

      Yhteenveto<\/strong><\/h2>\n
      Keraamiset piirilevyt ovat substraattimateriaalien luokka, joka antaa ainutlaatuisia vahvuuksia elektronisille pakkauksille. Ne tarjoavat hyv\u00e4t l\u00e4mp\u00f6reitit, vakaan s\u00e4hk\u00f6isen k\u00e4ytt\u00e4ytymisen l\u00e4mp\u00f6tilassa ja hyv\u00e4n mekaanisen lujuuden. Erilaiset keraamiset valinnat ja erilaiset metallointireitit antavat suunnittelijoille mahdollisuuden tasapainottaa kustannuksia, l\u00e4mp\u00f6suorituskyky\u00e4, s\u00e4hk\u00f6ist\u00e4 suorituskyky\u00e4 ja hienojakoisen kuvion tarpeita. T\u00e4m\u00e4n vuoksi keraamisia substraatteja k\u00e4ytet\u00e4\u00e4n laajalti tehoelektroniikassa, RF-moduuleissa, laser- ja diodipaketeissa, suuritehoisissa LEDeiss\u00e4 ja monilla korkean pakkaustiheyden aloilla.<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t\t\t\t
      <\/div>\n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t
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      Usein kysytyt kysymykset<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
      \n\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t\t\t
      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tMillaisia keraamisia materiaaleja k\u00e4ytet\u00e4\u00e4n yleisesti?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Yleisimpi\u00e4 ovat alumiinioksidi (Al\u2082O\u2083) yleiseen k\u00e4ytt\u00f6\u00f6n ja alumiininitridi (AlN) korkeamman l\u00e4mm\u00f6njohtavuuden saavuttamiseksi; muita erikoiskeraamisia (esim. piikarbidia) k\u00e4ytet\u00e4\u00e4n kapeisiin suuritehoisiin tai korkean l\u00e4mp\u00f6tilan tarpeisiin.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tMit\u00e4 valmistusprosesseja k\u00e4ytet\u00e4\u00e4n keraamisissa piirilevyiss\u00e4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Keraamiset piirilevyt valmistetaan prosesseilla, kuten paksukalvopainatuksella, ohutkalvopinnoituksella, laserty\u00f6st\u00f6ll\u00e4 ja metalloinnilla (kupari tai hopea), jota seuraa poltto ja viimeistely.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tMitk\u00e4 ovat keraamisten piirilevyjen t\u00e4rkeimm\u00e4t edut FR-4:\u00e4\u00e4n verrattuna?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      T\u00e4rkeimm\u00e4t edut: paljon parempi l\u00e4mm\u00f6njohtavuus (l\u00e4mm\u00f6nhukka), alhaisempi l\u00e4mp\u00f6laajenemiskerroin (CTE), korkean l\u00e4mp\u00f6tilan sietokyky ja erinomainen s\u00e4hk\u00f6inen eristys, mik\u00e4 tekee niist\u00e4 ihanteellisia LEDeille, tehoelektroniikalle ja RF- \/ korkeataajuussovelluksille.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tOvatko keraamiset piirilevyt kalliimpia?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Kyll\u00e4 - materiaalikustannukset ja erikoistuneet prosessit (polttaminen, laserty\u00f6st\u00f6, metallointi) tekev\u00e4t keraamisista piirilevyist\u00e4 tavallista FR-4:\u00e4\u00e4 kalliimpia; suuritehoisissa tai eritt\u00e4in luotettavissa malleissa ne voivat kuitenkin v\u00e4hent\u00e4\u00e4 j\u00e4rjestelm\u00e4kustannuksia parantamalla suorituskyky\u00e4 ja k\u00e4ytt\u00f6ik\u00e4\u00e4.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tVoidaanko keraamisia piirilevyj\u00e4 k\u00e4ytt\u00e4\u00e4 suurtaajuus-\/RF-sovelluksissa?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Kyll\u00e4. Keraamiset substraatit tarjoavat vakaat dielektriset ominaisuudet ja alhaiset h\u00e4vi\u00f6t korkeilla taajuuksilla, mik\u00e4 tekee niist\u00e4 hyv\u00e4n valinnan RF- ja mikroaaltopiirien komponentteihin.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t

      \n\t\t\t\t\t
      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t<\/path><\/svg><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\tMiten minun pit\u00e4isi valita alumiinioksidin (Al\u2082O\u2083) ja alumiininitridin (AlN) v\u00e4lill\u00e4?<\/a>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t

      Valitse alumiinioksidi kustannustehokkuuden ja yleisk\u00e4yt\u00f6n vuoksi; valitse AlN, kun tarvitset korkeampaa l\u00e4mm\u00f6njohtavuutta ja parempaa l\u00e4mm\u00f6nhallintaa suuritehoisissa sovelluksissa. Valintasi tulisi heijastaa l\u00e4mp\u00f6-, mekaanisia ja budjettivaatimuksia.<\/p><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an 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      A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\\\/div>\\n
       <\\\/div>\\n
      \\\"ceramic<\\\/div>\\n
       <\\\/div>\\n

      Properties of ceramic PCB<\\\/h2>\\n

      Mechanical properties (how circuit traces are formed)<\\\/h3>\\n
      a. They have high mechanical strength. They can hold parts and also act as support structures.
      b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.
      c. Their surface is smooth. They do not warp, bend, or show small cracks.<\\\/div>\\n

      Electrical properties<\\\/h3>\\n
      a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.
      b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.
      c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\\\/div>\\n

      Thermal properties<\\\/h3>\\n
      a. They have high thermal conductivity. This helps move heat away from hot parts.
      b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.
      c. They have good heat resistance. They stay stable at high temperature.<\\\/div>\\n

      Other properties<\\\/h3>\\n
      a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.
      b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.
      c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.
      d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\\\/div>\\n

      Methods to make ceramic substrates<\\\/h2>\\n
      Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\\\/div>\\n
      Common process routes are these three:<\\\/div>\\n
        \\n
      1. Stack layers \\u2013 hot press \\u2013 remove binder \\u2013 fire the base sheet \\u2013 form circuit patterns \\u2013 fire the circuit.<\\\/li>\\n
      2. Stack layers \\u2013 print the circuit pattern on the surface \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n
      3. Print circuit pattern \\u2013 stack \\u2013 hot press \\u2013 remove binder \\u2013 co-fire.<\\\/li>\\n<\\\/ol>\\n

        Metallization of ceramic PCB<\\\/h2>\\n

        a. Thick film method:<\\\/h3>\\n
        In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\\u2013oxide types.<\\\/div>\\n

        b. Thin film method:<\\\/h3>\\n
        Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\\\/div>\\n

        c. Co-firing method:<\\\/h3>\\n
        Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:
        \\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.
        \\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.
        \\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\\\/div>\\n

        Types of ceramic substrates<\\\/h2>\\n

        Alumina substrate (Al\\u2082O\\u2083)<\\\/h3>\\n
        a. Raw material: Al\\u2082O\\u2083 is often made by the Bayer process<\\\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.
        b. Making: Al\\u2082O\\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\\u20131600\\u00b0C. Metalization methods for Al\\u2082O\\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.
        c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Alumina<\\\/div>\\n
         <\\\/div>\\n

        Mullite substrate (3Al\\u2082O\\u2083\\u00b72SiO\\u2082)<\\\/h3>\\n
        Mullite is one of the most stable crystalline phases in the Al\\u2082O\\u2083\\u2013SiO\\u2082 system. Compared to Al\\u2082O\\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\\\/div>\\n

        Aluminum nitride substrate (AlN)<\\\/h3>\\n
        a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\\u2082O\\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\\u2082 to form AlN directly.
        b. Making: The same forming methods used for Al\\u2082O\\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.
        c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\\u2082O\\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\\u2082O\\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.
        d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\\\/div>\\n
         <\\\/div>\\n
        \\\"Aluminum<\\\/div>\\n
         <\\\/div>\\n

        Silicon carbide substrate (SiC)<\\\/h3>\\n
        a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\\u00b0C to react and form \\u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.
        b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.
        c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.
        d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\\\/div>\\n

        Beryllia substrate (BeO)<\\\/h3>\\n
        BeO has thermal conductivity many times that of Al\\u2082O\\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\\u2082O\\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\\\/div>\\n

        Comparison of some ceramic materials and substrate types<\\\/h2>\\n
        From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\\\/div>\\n
        Common ceramic base materials are BeO, Al\\u2082O\\u2083, AlN, and Si\\u2083N\\u2084. Among these, Si\\u2083N\\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\\\/div>\\n

        High temperature co-fired ceramic multilayer (HTCC)<\\\/h3>\\n
        HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\\u2082O\\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\\u2013200 W\\\/(m\\u00b7\\u00b0C).<\\\/div>\\n

        Low temperature co-fired ceramic PCB(LTCC)<\\\/h3>\\n
        LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\\u2082O\\u2083 powder includes 30\\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\\u2013900\\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\\\/div>\\n

        Thick film ceramic substrate (TFC)<\\\/h3>\\n
        Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\\u2013800\\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\\u201320 \\u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\\\/div>\\n

        Direct bonded copper ceramic PCB(DBC)<\\\/h3>\\n
        DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\\u2082O\\u2083 can control the expansion of the Cu\\u2013Al\\u2082O\\u2083\\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\\u2082O\\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\\u2082O\\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \\u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \\u03bcm.<\\\/div>\\n
         <\\\/div>\\n
        \\\"DBC\\\"<\\\/div>\\n
         <\\\/div>\\n

        Direct plated copper ceramic PCB(DPC)<\\\/h3>\\n
        DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\\\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\\\/div>\\n

        Notes on use and selection<\\\/h2>\\n
        When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\\u2082O\\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\\\/div>\\n
        Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\\\/div>\\n

        Manufacturing tradeoffs and practical points<\\\/h2>\\n
        Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\\\/div>\\n

        Co-firing vs post-firing metallization<\\\/h3>\\n
        Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\\\/div>\\n

        Typical process flow examples (short summary)<\\\/h2>\\n
          \\n
        1. For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\\\/li>\\n
        2. For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\\u2013800\\u00b0C, then trim resistors and add final metal pads.<\\\/li>\\n
        3. For DPC: clean ceramic, deposit Ti\\\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\\\/li>\\n<\\\/ol>\\n

          Summary<\\\/strong><\\\/h2>\\n
          Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\\\/div>\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"c857395\"}]},\"elements\":[],\"widgetType\":\"text-editor\"}],\"isInner\":false},{\"id\":\"jcauneg\",\"elType\":\"section\",\"settings\":{\"gap\":\"no\",\"content_position\":\"top\",\"background_background\":\"classic\",\"background_color\":\"#FFFFFF00\",\"background_position\":\"bottom center\",\"background_attachment\":\"scroll\",\"background_repeat\":\"no-repeat\",\"background_size\":\"cover\",\"background_size_mobile\":\"cover\",\"background_overlay_background\":\"classic\",\"background_overlay_color_b\":\"rgba(255,255,255,0)\",\"background_overlay_opacity\":{\"unit\":\"px\",\"size\":\"\",\"sizes\":[]},\"padding\":{\"unit\":\"px\",\"top\":\"120\",\"right\":\"0\",\"bottom\":\"120\",\"left\":\"0\",\"isLinked\":false},\"padding_tablet\":{\"unit\":\"px\",\"top\":\"80\",\"right\":\"40\",\"bottom\":\"80\",\"left\":\"40\",\"isLinked\":false},\"padding_mobile\":{\"unit\":\"px\",\"top\":\"50\",\"right\":\"25\",\"bottom\":\"50\",\"left\":\"25\",\"isLinked\":false},\"content_width\":{\"unit\":\"px\",\"size\":800,\"sizes\":[]},\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"4cb1949\"}]},\"elements\":[{\"id\":\"7882748\",\"elType\":\"column\",\"settings\":{\"_column_size\":100,\"_inline_size\":null,\"padding\":{\"unit\":\"px\",\"top\":\"0\",\"right\":\"0\",\"bottom\":\"0\",\"left\":\"0\",\"isLinked\":true},\"space_between_widgets\":40,\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"bcc1c8f\"}]},\"elements\":[{\"id\":\"9fc6712\",\"elType\":\"widget\",\"settings\":{\"title\":\"Frequently Asked Questions\",\"align\":\"center\",\"display_condition_list\":[{\"display_condition_login_status\":\"subscriber\",\"_id\":\"79a2a25\"}]},\"elements\":[],\"widgetType\":\"heading\"},{\"id\":\"631b990\",\"elType\":\"widget\",\"settings\":{\"tabs\":[{\"tab_title\":\"What types of ceramic materials are commonly used?\",\"tab_content\":\"

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p>\",\"_id\":\"9c164e4\"},{\"_id\":\"70a3236\",\"tab_title\":\"What manufacturing processes are used for ceramic PCBs?\",\"tab_content\":\"

          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p>\"},{\"_id\":\"eded620\",\"tab_title\":\"What are the main advantages of ceramic PCBs over FR-4?\",\"tab_content\":\"

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p>\"},{\"_id\":\"4798292\",\"tab_title\":\"Are ceramic PCBs more expensive?\",\"tab_content\":\"

          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p>\"},{\"_id\":\"379846e\",\"tab_title\":\"Can ceramic PCBs be used for high-frequency\\\/RF applications?\",\"tab_content\":\"

          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p>\"},{\"_id\":\"662a19b\",\"tab_title\":\"How should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?\",\"tab_content\":\"

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. 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          \\n\\t\\t\\t\\t\\t
          \\n\\t\\t[elementor-element k=\\\"0e46bd9387093ca73b9000e38f18cce4\\\" data=\\\"{"id":"612671e","elType":"widget","settings":{"editor":"<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an oxide or a ceramic sheet at high temperature. The copper is joined to the ceramic by a high temperature process so the metal and the ceramic form a stable base for circuits.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"alignnone size-full wp-image-2693\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/ceramic-pcb.webp\" alt=\"ceramic pcb\" width=\"356\" height=\"289\"><\/div>\n<div>&nbsp;<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Properties of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mechanical properties (how circuit traces are formed)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high mechanical strength. They can hold parts and also act as support structures.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They are easy to machine. They keep accurate dimensions. They can be made into many layers.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their surface is smooth. They do not warp, bend, or show small cracks.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Electrical properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high insulation resistance and high breakdown voltage. This keeps the circuits safe from shorting and from high voltage damage.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They have low dielectric constant and low dielectric loss. This helps signals pass with less loss.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Their performance stays stable at high temperature and high humidity. This helps ensure reliability in hard use conditions.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thermal properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They have high thermal conductivity. This helps move heat away from hot parts.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Their thermal expansion coefficient can match related materials, especially silicon. This match reduces stress when parts heat and cool.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. They have good heat resistance. They stay stable at high temperature.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Other properties<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. They are chemically stable. They are easy to metallize. Circuit patterns stick well to them.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. They do not absorb moisture. They resist oil and chemical attack. They release little radiation.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. The materials used are harmless and not toxic. Their crystal structure does not change in the working temperature range.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Raw materials are abundant. The technology is mature. They are easy to make and the price is low.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Methods to make ceramic substrates<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing the ceramic, there are four common forming methods. These are powder pressing (which can be mold pressing or isostatic pressing), extrusion, tape casting, and injection molding. Among these, tape casting is more often used in recent years for LSI packages and hybrid circuit substrates because it is easier to make many layers and it has higher production efficiency.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common process routes are these three:<\/div>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>Stack layers \u2013 hot press \u2013 remove binder \u2013 fire the base sheet \u2013 form circuit patterns \u2013 fire the circuit.<\/li>\n<li>Stack layers \u2013 print the circuit pattern on the surface \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<li>Print circuit pattern \u2013 stack \u2013 hot press \u2013 remove binder \u2013 co-fire.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Metallization of ceramic PCB<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">a. Thick film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the thick film method, conductors (the circuit traces) and resistors are formed on the ceramic by screen printing. After printing, the parts are sintered to form the circuit and the contact pads. The binders used to fix the printed metal include glass type, oxide type, and mixed glass\u2013oxide types.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">b. Thin film method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Thin film uses vacuum methods like evaporation, ion plating, or sputtering to apply metal. Because thin film deposits metal from the gas phase, any metal can in principle be deposited. Also any substrate can in principle be metallized this way. But the thermal expansion of the metal film and the ceramic substrate should match as much as possible. It is also important to increase the adhesion of the metal layer to the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">c. Co-firing method:<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Before firing, refractory metal pastes of Mo, W and similar metals are screen printed on the unfired ceramic sheets. The stack is then debindered and fired so the ceramic and the metal form one integral structure. This method has these features:<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 It can form very fine circuit lines and it is easy to make many layers, so high density wiring is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 Because the insulator and the conductor are formed together, hermetic sealing in packages is possible.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">\u25a0 By choosing the right composition, forming pressure, and sintering temperature, the sintering shrinkage can be controlled. Especially when a substrate with zero in-plane shrinkage is made, this opens up use in BGA, CSP, and bare chip high-density packaging.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Types of ceramic substrates<\/h2>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Alumina substrate (Al\u2082O\u2083)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: Al\u2082O\u2083 is often made by the <a href=\"https:\/\/en.wikipedia.org\/wiki\/Bayer_process\">Bayer process<\/a>. In this method the raw material is bauxite, which includes hydrated aluminum oxides and related compounds.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: Al\u2082O\u2083 ceramics are usually formed by stacking unfired sheets. A binder like polyvinyl butyral (PVB) is often used. The firing temperature varies with added sintering aids, and is usually 1550\u20131600\u00b0C. Metalization methods for Al\u2082O\u2083 are mainly the thick film and co-firing methods. The pastes and the process technology are mature. They meet many application needs today.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. Applications: Substrates for hybrid integrated circuits, LSI package substrates, and multilayer circuit substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2691 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Alumina-substrate.webp\" alt=\"Alumina substrate\" width=\"600\" height=\"476\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Mullite substrate (3Al\u2082O\u2083\u00b72SiO\u2082)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Mullite is one of the most stable crystalline phases in the Al\u2082O\u2083\u2013SiO\u2082 system. Compared to Al\u2082O\u2083, mullite has a bit lower mechanical strength and lower thermal conductivity, but its dielectric constant is lower. This lower dielectric constant can help improve signal speed. Its thermal expansion coefficient is also low, which reduces thermal stress on mounted LSI. Also the expansion difference with conductor metals like Mo and W is smaller, so co-firing causes less stress between the metal and the ceramic.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Aluminum nitride substrate (AlN)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: AlN is not a natural mineral. It is a man-made material first synthesized in the 1800s. Typical AlN powders are made by reduction nitridation or direct nitridation. The reduction nitridation method starts from Al\u2082O\u2083 and uses high-purity carbon to reduce it, then react with nitrogen to form AlN. The direct nitridation method reacts Al powder with N\u2082 to form AlN directly.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: The same forming methods used for Al\u2082O\u2083 substrates can be used for AlN. The most used route is stacking unfired sheets. For this, AlN powder, organic binders, solvent, and a surfactant are mixed to make a ceramic slurry. The slurry is tape cast, stacked, hot pressed, debindered, and then fired to make the AlN substrate.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. AlN substrate features: AlN has thermal conductivity more than ten times that of Al\u2082O\u2083. Its coefficient of thermal expansion (CTE) matches silicon. Compared with Al\u2082O\u2083, AlN has higher insulation resistance and higher breakdown voltage. Its dielectric constant is lower. These features make AlN very valuable for package substrates.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: Used for VHF band power amplifier modules, high power devices, and laser diode substrates.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2692 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/Aluminum-nitride-substrate.webp\" alt=\"Aluminum nitride substrate\" width=\"600\" height=\"383\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Silicon carbide substrate (SiC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">a. Raw material: SiC is not a natural mineral. It is made by mixing silica, coke, and a little salt as powders. The mix is heated in a graphite furnace above 2000\u00b0C to react and form \u03b1-SiC. Then SiC can be purified by sublimation to get a dark green block of polycrystalline material.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">b. Making: SiC has very high chemical and thermal stability, so normal firing methods make it hard to densify. Sintering aids and special firing methods are needed. Vacuum hot pressing is commonly used.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">c. SiC features: A key feature is its very large thermal diffusion coefficient. It can even be larger than copper. Its thermal expansion is closer to silicon. But SiC has some downsides. Its dielectric constant is relatively high and its breakdown voltage is not as good as some other ceramics.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\">d. Applications: SiC substrates are used where high heat spreading is needed and voltage is not high. They are used for VLSI heat-sinking packages, high speed and high integration logic LSI with heat sinks, large computers, and laser diode substrates for optical communications.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Beryllia substrate (BeO)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">BeO has thermal conductivity many times that of Al\u2082O\u2083. It works well for high power circuits. Its dielectric constant is low, so it is suitable for high frequency circuits. BeO substrates are usually made by dry pressing. They can also be made by the unfired sheet route with small additions of MgO or Al\u2082O\u2083. Because BeO powder is toxic, BeO products raise environmental and health concerns. In Japan BeO substrate production is not allowed and BeO must be imported from places like the United States.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Comparison of some ceramic materials and substrate types<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">From structure and making methods, ceramic substrates can be grouped into HTCC, LTCC, TFC, DBC, DPC, and so on. Ceramic substrates are used more and more in electronic packaging and in power electronics like IGBT (insulated gate bipolar transistor), LD (laser diode), high power LED, and CPV (concentrator photovoltaic) because of their good thermal conductivity, heat resistance, insulation, low thermal expansion, and falling cost.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common ceramic base materials are BeO, Al\u2082O\u2083, AlN, and Si\u2083N\u2084. Among these, Si\u2083N\u2084 has very high electrical insulation and chemical stability. It also has good thermal stability and high mechanical strength. It can be used for high density and high integration circuit boards.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">High temperature co-fired ceramic multilayer (HTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">HTCC is high temperature co-fired ceramic substrate. To make HTCC, first ceramic powder such as Al\u2082O\u2083 or AlN is mixed with an organic binder. The mix is made into a paste and then formed into sheets by doctor blade or similar methods. The dried sheets become green bodies. Holes for vias are drilled and conductor pastes are screen printed for wiring and via filling. Then the green sheets are stacked and placed into a high temperature furnace around 1600\u00b0C for sintering. Because the sintering temperature is high, the choice of conductor metals is limited. Metals with high melting points but lower conductivity are used, such as tungsten, molybdenum, and manganese. The cost is high and thermal conductivity ranges roughly 20\u2013200 W\/(m\u00b7\u00b0C).<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Low temperature co-fired ceramic PCB(LTCC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">LTCC is low temperature co-fired ceramic. Its making steps are similar to HTCC. The difference is that the Al\u2082O\u2083 powder includes 30\u201350% by mass of low melting point glass. This lowers the firing temperature to about 850\u2013900\u00b0C. Because the firing temperature is low, conductive metals with good conductivity like gold and silver can be used for electrodes and traces. LTCC uses screen printing for metal lines. This method can have alignment errors because of mesh stretch. Also when multilayers are stacked and co-fired, different shrinkage can occur and that hurts yield. To raise LTCC thermal conductivity, thermal vias or conductive vias can be added in the component areas, but that raises cost.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Thick film ceramic substrate (TFC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Compared to LTCC and HTCC, TFC is a post-fired ceramic substrate. It uses screen printing to apply metal pastes on the ceramic base surface. After drying, the part is fired at high temperature (700\u2013800\u00b0C). Metal pastes are made of metal powder, organic resin, and glass. After firing, the resin burns off and the layer left is mostly metal bound by a glassy adhesive on the ceramic surface. The fired metal layer thickness is typically 10\u201320 \u03bcm and the minimum line width is about 0.3 mm. Because the technology is mature, the process is simple and cost is low, TFC is used where pattern precision needs are not high.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct bonded copper ceramic PCB(DBC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DBC is made by co-sintering or eutectic bonding copper foil to a ceramic sheet at high temperature (about 1065\u00b0C). After bonding, circuit patterns are formed by etching. Because copper foil has good electrical and thermal conduction and Al\u2082O\u2083 can control the expansion of the Cu\u2013Al\u2082O\u2083\u2013Cu composite, the DBC has a thermal expansion close to that of alumina. DBC has good thermal conduction, strong insulation, and high reliability. It is widely used in IGBT, laser diode, and CPV packaging. DBC has drawbacks. The high temperature eutectic reaction between Cu and Al\u2082O\u2083 needs strict control of equipment and process, so cost is higher. Micro-pores can form between Al\u2082O\u2083 and Cu, lowering thermal shock resistance. Copper foil can warp at high temperature, so the copper thickness on DBC is usually more than 100 \u03bcm. Also etching is used to form patterns, so minimum line width is generally more than 100 \u03bcm.<\/div>\n<div>&nbsp;<\/div>\n<div><img class=\"size-full wp-image-2694 aligncenter\" src=\"https:\/\/flj-pcb.com\/wp-content\/uploads\/2025\/09\/DBC.webp\" alt=\"DBC\" width=\"600\" height=\"450\"><\/div>\n<div>&nbsp;<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Direct plated copper ceramic PCB(DPC)<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">DPC starts with cleaning and pretreating the ceramic sheet. Then a Ti\/Cu seed layer is deposited by vacuum sputtering on the substrate surface. Photolithography, development, and etching are used to form the circuit pattern. Then electroplating or chemical plating is used to grow the circuit thickness. After removing the photoresist the substrate is complete. DPC has these advantages: low temperature process (below 300\u00b0C), so it avoids the drawbacks of high temperature to materials and circuits and lowers manufacturing cost. Using thin film and photolithography makes the metal lines on the substrate finer. So DPC is well suited for packages that need high alignment accuracy. But DPC has downsides too. The electroplated copper thickness is limited, and electroplating waste liquid can cause pollution. The adhesion between metal layer and ceramic is lower, so the product reliability may be less.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Notes on use and selection<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing a ceramic substrate, match the material to the application needs. If you need high thermal conductivity and a thermal expansion close to silicon, AlN or SiC may be best. If cost and mature processing matter, Al\u2082O\u2083 is a solid choice. If you need fine lines and low temperature processing, DPC and LTCC can work. If you need high density multilayer wiring and hermetic sealing, co-fired routes like LTCC or HTCC with co-sintered metal may be right.<\/div>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Common application areas include power modules, RF power amplifiers, laser diode modules, high power LEDs, and high density LSI packaging. Power electronics gain from ceramic substrates because they move heat well and keep insulation and mechanical strength under thermal stress. RF devices gain from low dielectric loss and stable dielectric properties. High density packaging gains from the ability to make fine lines and to stack many layers with good alignment control if the process is suitable.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Manufacturing tradeoffs and practical points<\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Every ceramic type and every process has tradeoffs. HTCC uses high firing temperature and so uses refractory metals for conductors. This limits conductivity and raises cost, but HTCC can be very robust at high temperature. LTCC lowers firing temperature by adding glass so better conductors can be used, but LTCC can have shrinkage issues and alignment trouble in multilayers. TFC is cheap and simple, but it cannot give very fine patterns. DBC gives excellent heat spread with thick copper, but its patterning limit and manufacturing cost can be issues. DPC allows fine patterning and low temperature processing, but adhesion and waste control need care.<\/div>\n<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">Co-firing vs post-firing metallization<\/h3>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Co-firing means printing metal pastes on the green ceramic and firing everything together. This can make very small features and true multilayer wiring. It also lets the ceramic and metal become one integrated body, which helps hermetic sealing. But co-firing needs careful control of materials to match shrinkage and sintering. Post-firing metallization, like thick film or thin film on fired ceramic, avoids co-sintering shrinkage issues. It can be easier for single layer or simple double layer needs. But post-fired methods may not reach the same wiring density and may have different adhesion or thermal properties.<\/div>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\">Typical process flow examples (short summary)<\/h2>\n<ol class=\"auto-hide-last-sibling-br\">\n<li>For co-fired multilayer substrate: make ceramic slurry, tape cast, drill vias in green tape, print conductor pastes by screen, stack tapes, press and debind, and then fire. After firing, do final processing like pad metallization and circuit etching if needed.<\/li>\n<li>For thick film on ceramic: use fired ceramic substrate, screen print conductor and resistor pastes, fire at 700\u2013800\u00b0C, then trim resistors and add final metal pads.<\/li>\n<li>For DPC: clean ceramic, deposit Ti\/Cu seed by sputter, pattern photoresist, etch seed to make pattern, electroplate to grow copper, strip resist, and final clean.<\/li>\n<\/ol>\n<h2 class=\"header-vfC6AV auto-hide-last-sibling-br\"><strong data-start=\"32\" data-end=\"43\">Summary<\/strong><\/h2>\n<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Ceramic PCB are a class of substrate materials that give unique strengths for electronic packaging. They offer good thermal paths, stable electrical behavior at temperature, and good mechanical strength. Different ceramic choices and different metallization routes let designers balance cost, thermal performance, electrical performance, and fine line pattern needs. Because of this, ceramic substrates are widely used in power electronics, RF modules, laser and diode packages, high power LEDs, and many high density packaging fields.<\/div>","display_condition_list":[{"display_condition_login_status":"subscriber","_id":"c857395"}]},"elements":[],"widgetType":"text-editor"}\\\"]\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          Frequently Asked Questions<\\\/h2>\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t
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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat types of ceramic materials are commonly used?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          The most common are alumina (Al\\u2082O\\u2083) for general use and aluminum nitride (AlN) for higher thermal conductivity; other specialized ceramics (e.g., silicon carbide) are used for niche high-power or high-temperature needs.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Ceramic PCBs are made by processes such as thick-film printing, thin-film deposition, laser machining, and metalization (copper or silver), followed by firing and finishing.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tWhat are the main advantages of ceramic PCBs over FR-4?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Key advantages: much better thermal conductivity (heat dissipation), lower coefficient of thermal expansion (CTE), high-temperature tolerance, and excellent electrical insulation\\u2014making them ideal for LEDs, power electronics, and RF\\\/high-frequency applications.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes\\u2014material costs and specialized processes (firing, laser machining, metallization) typically make ceramic PCBs pricier than standard FR-4; however, for high-power or high-reliability designs they can reduce system costs by improving performance and lifetime.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          Yes. Ceramic substrates offer stable dielectric properties and low loss at high frequencies, making them a strong choice for RF and microwave circuit components.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t

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          \\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/path><\\\/svg><\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t<\\\/span>\\n\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\t\\tHow should I choose between alumina (Al\\u2082O\\u2083) and aluminum nitride (AlN)?<\\\/a>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t

          Choose alumina for cost-effectiveness and general use; choose AlN when you need higher thermal conductivity and better thermal management for high-power applications. Your choice should reflect thermal, mechanical, and budget requirements.<\\\/p><\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/div>\\n\\t\\t\\t\\t\\t<\\\/div>\\n\\t\\t<\\\/section>\\n\\t\\t\",\"scripts\":[],\"styles\":[]}}"],"_uag_css_file_name":["uag-css-2364.css"],"_uag_js_file_name":["uag-js-2364.js"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"Philifast","author_link":"https:\/\/flj-pcb.com\/fi\/author\/2475017442jygmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"A ceramic substrate is a special type of board made by directly bonding copper foil to the surface of an […]","_links":{"self":[{"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/pages\/2364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/comments?post=2364"}],"version-history":[{"count":26,"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/pages\/2364\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/pages\/2364\/revisions\/3323"}],"up":[{"embeddable":true,"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/pages\/1898"}],"wp:attachment":[{"href":"https:\/\/flj-pcb.com\/fi\/wp-json\/wp\/v2\/media?parent=2364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}