Rigid PCB Circuit Board
| Order Qty. | Mass production | Sample production | |
| Layer count | 2~ 32L | 48L | |
| Max. PCB Thickness | 12mm (472mil） | 12mm (472mil) | |
| Min. Width/Space | Inner layer | 2.5mil/ 2.5mil | 2.2mil/ 2.2mil |
| Outer layer | 3mil/ 3mil | 2.8mil/ 2.8mil | |
| Max. Copper Thickness | 6Oz | 30Oz | |
| Min. Drill Hole Diameter | Mechanical hole | 0.15mm (6mil) | 0.1mm (4mil) |
| Laser hole | 0.1mm (4mil) | 0.075mm (3mil) | |
| Max. Size (Finish Size) | Single&Double sided layers | 1150mmX500mm | 1250mmX550mm |
| Multilayer | / | 1250mmX570mm | |
| Aspect Ratio (Finish Hole) | 10:01:00 | 16:01:00 | |
| Material | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| Others | Alu.-based, Cu-based etc. | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silver,Electroplating Hard Gold/Soft Gold, Gold Finger,
Selective OSP, ENEPIG. |
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| HeavyCopperPCB | Max. Copper Thickness | 6Oz | 30Oz |
| HDI PCB | Structure | Any Layer(10L) | Any Layer(10L) |
| Width/Space (Outer Layer) | 2.5mil/2.5mil | 2mil/2mil | |
| Aspect Ratio(Blind Hole) | 1:01:00AM | 1:01:00 | |