| Item | Item Name | Process Capability |
Overall Process Capability | Number of Layers | 1-30 Layers |
| High-Frequency Hybrid Press HDI | For ceramic materials and PTFE materials, only mechanical drilling for blind/buried vias, depth-controlled drilling, back drilling, etc. are applicable (laser drilling is not allowed, and direct lamination of copper foil is not allowed) | |
| High-Speed HDI | Manufactured according to conventional HDI processes | |
| Laser Stages | 1-5 Stages (Review required for ≥6 stages) | |
| Board Thickness Range | 0.1-5.0mm (Review required for thickness ＜0.2mm or ＞6.5mm) | |
| Minimum Finished Size | Single board: 5*5mm (Review required for ＜3mm) | |
| Maximum Finished Size | 2-20 Layers: 21*33inch; Note: Review required if the short side of the board exceeds 21inch. | |
| Maximum Finished Copper Thickness | Outer layer: 8OZ (Review required for ＞8OZ); Inner layer: 6OZ (Review required for ＞6OZ) | |
| Minimum Finished Copper Thickness | 1/2oz | |
| Interlayer Alignment Accuracy | ≤3mil | |
| Through-Hole Filling Range | Board thickness ≤0.6mm, Hole diameter ≤0.2mm | |
| Resin Plugging Board Thickness Range | 0.254-6.0mm; Review required for resin plugging of PTFE boards | |
| Board Thickness Tolerance | Board thickness ≤1.0mm: ±0.1mm | |
| Board thickness ＞1.0mm: ±10% | ||
| Impedance Tolerance | ±5Ω (＜50Ω), ±10% (≥50Ω); ±8% (≥50Ω, Review required) | |
| Warpage | Conventional: 0.75%, Limit: 0.5% (Review required), Maximum: 2.0% | |
| Lamination Times | Maximum 5 laminations for the same core board (Review required for ＞3 laminations) | |
Material Types | Standard Tg FR4 | Shengyi S1141, Kingboard KB6160A, Guoji GF212 |
| Medium Tg FR4 | Shengyi S1150G (Medium Tg board), Kingboard KB6165F, Kingboard KB6165G (Halogen-Free) | |
| High Tg FR4 | Shengyi S1600 (Halogen-Free), Kingboard KB6167G (Halogen-Free), Kingboard KB6167F | |
| Aluminum Substrate | Guoji GL12, Boyu Series 3, 1-8 Layers Hybrid Press FR-4 | |
| Material Types for HDI Boards | LDPP (IT-180A 1037 and 1086), Conventional 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 | Isola: FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; Lenton: IT-180A, | |
| IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP | ||
| SI; Panasonic: R-5775K (Megtron6), R-5725 (Megtron4); Kingboard: KB6167F; | ||
| Taiguang: EM-827; Hongren: GA-170; Nanya: NP-180; Taiyao: TU-752, TU-662; | ||
| Hitachi: MCL-BE-67G (H), MCL-E-679 (W), MCL-E-679F (J); Tenghui: VT-47; | ||
| Ceramic Powder Filled High-Frequency Materials | Rogers: Rogers4350, Rogers4003; Arlon: 25FR, 25N; | |
| PTFE High-Frequency Materials | Rogers Series, Taconic Series, Arlon Series, Nelco Series, TP Series | |
| PTFE Prepreg | Taconic: TP Series, TPN Series, HT1.5 (1.5mil), Fastrise Series | |
| Hybrid Material Lamination | Rogers, Taconic, Arlon, Nelco with FR-4 | |
Metal Substrate | Number of Layers | Aluminum substrate, Copper substrate: 1-8 Layers; Cold plate, Sintered plate, Metal-embedded plate: 2-24 Layers; Ceramic plate: 1-2 Layers; |
| Finished Size (Aluminum Substrate, Copper Substrate, Cold Plate, Sintered Plate, Metal-Embedded Plate) | MAX: 610*610mm, MIN: 5*5mm | |
| Maximum Production Size (Ceramic Plate) | 100*100mm | |
| Finished Board Thickness | 0.5-5.0mm | |
| Copper Thickness | 0.5-10 OZ | |
| Metal Base Thickness | 0.5-4.5mm | |
| Metal Base Material | AL: 1100/1050/2124/5052/6061; Copper: Pure Copper, Pure Iron | |
| Minimum Finished Hole Diameter and Tolerance | NPTH: 0.5±0.05mm; PTH (Aluminum substrate, Copper substrate): 0.3±0.1mm; PTH (Cold plate, Sintered plate, Metal-embedded plate): 0.2±0.10mm; | |
| Profile Machining Accuracy | ±0.2mm | |
| PCB Partial Surface Treatment Processes | Lead-containing/Lead-free Hot Air Solder Leveling (HASL); OSP; Electroless Nickel (Palladium) Gold (EN(Au)G); Electroplated (Nickel) Soft/Hard Gold; Electroplated Tin; Nickel-Free Electroplated Soft/Hard Gold; Thick Gold Fabrication | |
| Metal Surface Treatment | Copper: Nickel-Gold Plating; Aluminum: Anodizing, Hard Anodizing, Chemical Passivation; Mechanical Treatment: Dry Sandblasting, Brushing | |
| Metal Base Materials | Quanbao Aluminum Substrate (T-110, T-111); Tenghui Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Bergquist Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F); | |
| Thermal Conductive Adhesive Thickness (Dielectric Layer) | 75-150um | |
| Embedded Copper Block Size | 3*3mm—70*80mm | |
| Embedded Copper Block Flatness (Height Difference Accuracy) | ±40um | |
| Distance from Embedded Copper Block to Hole Wall | ≥12mil | |
| Thermal Conductivity | 0.3-3W/m.k (Aluminum substrate, Copper substrate, Cold plate); 8.33W/m.k (Sintered plate); 0.35-30W/m.k (Metal-embedded plate); 24-180W/m.k (Ceramic plate); | |
| Product Type | Rigid Board | Backplane, HDI, Multilayer Blind/Buried Via Board, Thick Copper Board, Power Supply Thick Copper Board, Semiconductor Test Board |
| Lamination Method | Multi-Lamination Blind/Buried Via Board | Maximum 3 laminations on the same side |
| HDI Board Type | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n: buried via ≤0.3mm); Laser blind vias can be electroplated and filled | |
| Partial Hybrid Lamination | Minimum Distance from Mechanical Drilling to Conductor in Partial Hybrid Lamination Area | ≤10 Layers: 14mil; 12 Layers: 15mil; ＞12 Layers: 18mil |
| Minimum Distance from Partial Hybrid Lamination Junction to Drilling | ≤12 Layers: 12mil; ＞12 Layers: 15mil | |
| Surface Treatment | Lead-Free | Electroplated Copper-Nickel-Gold, Immersion Gold, Hard Gold Plating (With/Without Nickel), Gold Finger Plating, Lead-Free HASL, OSP, Electroless Nickel Palladium Gold (ENPG), Soft Gold Plating (With/Without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+G/F, Full-Board Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
| Lead-Containing | Lead-Containing HASL | |
| Aspect Ratio | 10:1 (Lead-Containing/Lead-Free HASL, Electroless Nickel-Immersion Gold (ENIG), Immersion Silver, Immersion Tin, ENPG); 8:1 (OSP) | |
| Maximum Machining Size | Immersion Gold: 520*800mm; Vertical Immersion Tin: 500*600mm; Horizontal Immersion Tin: Single side ＜500mm; Horizontal Immersion Silver: Single side ＜500mm; Lead-Containing/Lead-Free HASL: 520*650mm; OSP: Single side ＜500mm; Electroplated Hard Gold: 450*500mm; Single side shall not exceed 520mm | |
| Minimum Machining Size | Immersion Tin: 60*80mm; Immersion Silver: 60*80mm; Lead-Containing/Lead-Free HASL: 150*230mm; OSP: 60*80mm; Sizes smaller than the above shall undergo surface treatment with large boards | |
| Machining Board Thickness | Immersion Gold: 0.2-7.0mm; Immersion Tin: 0.3-7.0mm (Vertical Immersion Tin Line), 0.3-3.0mm (Horizontal Line); Immersion Silver: 0.3-3.0mm; Lead-Containing/Lead-Free HASL: 0.6-3.5mm; Review required for HASL boards with thickness ＜0.4mm; OSP: 0.3-3.0mm; Electroplated Hard Gold: 0.3-5.0mm (Board Aspect Ratio 10:1) | |
| Minimum IC Pitch or Minimum PAD-to-Line Distance for Immersion Gold Boards | 3mil | |
| Maximum Gold Finger Height | 1.5inch | |
| Minimum Pitch Between Gold Fingers | 6mil | |
| Minimum Segmentation Pitch for Segmented Gold Fingers | 7.5mil | |
| Drilling | Maximum Board Thickness for 0.1/0.15/0.2mm Mechanical Drilling | 0.8mm/1.5mm/2.5mm |
| Minimum Laser Drilling Hole Diameter | 0.1mm | |
| Maximum Laser Drilling Hole Diameter | 0.15mm | |
| Mechanical Hole Diameter (Finished Product) | 0.10-6.2mm (Corresponding drill bit: 0.15-6.3mm) | |
| Minimum finished hole diameter for PTFE material (including hybrid lamination) boards: 0.25mm (Corresponding drill bit: 0.35mm) | ||
| Mechanical blind/buried via diameter ≤0.3mm (Corresponding drill bit: 0.4mm) | ||
| Drilling diameter for solder mask plugging of via-in-pad ≤0.45mm (Corresponding drill bit: 0.55mm) | ||
| Minimum linked hole diameter: 0.35mm (Corresponding drill bit: 0.45mm) | ||
| Minimum diameter of metalized half-hole: 0.30mm (Corresponding drill bit: 0.4mm) | ||
| Maximum Aspect Ratio of Through-Holes | 20:1 (Excluding drill diameter ≤0.2mm; Review required for ＞12:1) | |
| Maximum Depth-to-Diameter Ratio of Laser Drilling | 1:01 | |
| Maximum Depth-to-Diameter Ratio of Mechanical Depth-Controlled Drilling for Blind Vias | 1.3:1 (Hole diameter ≤0.20mm), 1.15:1 (Hole diameter ≥0.25mm) | |
| Minimum Depth of Mechanical Depth-Controlled Drilling (Back Drilling) | 0.2mm | |
| Minimum Distance from Mechanical Drilling to Conductor (Non-Blind/Buried Via Boards and 1st-Stage Laser Blind Vias) | 5.5mil (≤8 Layers); 6.5mil (10-14 Layers); 7mil (＞14 Layers) | |
| Minimum Distance from Mechanical Drilling to Conductor (Mechanical Blind/Buried Via Boards and 2nd-Stage Laser Blind/Buried Vias) | 7mil (1st Lamination); 8mil (2nd Lamination); 9mil (3rd Lamination) | |
| Minimum Distance from Laser Drilling to Conductor (Laser Blind/Buried Vias) | 7mil (1+N+1); 8mil (1+1+N+1+1 or 2+N+2) | |
| Minimum Distance from Laser Drilling to Conductor (1st, 2nd-Stage HDI Boards) | 5mil | |
| Minimum Distance Between Hole Walls of Different Networks (After Compensation) | 10mil | |
| Minimum Distance Between Hole Walls of the Same Network (After Compensation) | 6mil (Through-holes; Laser blind vias); 10mil (Mechanical blind/buried vias) | |
| Minimum Distance Between Non-Metal Hole Walls (After Compensation) | 8mil | |
| Hole Position Tolerance (Compared with CAD Data) | ±2mil | |
| Minimum Hole Diameter Tolerance of NPTH Holes | ±2mil | |
| Hole Diameter Accuracy of Solderless Component Holes | ±2mil | |
| Tapered Hole Depth Tolerance | ±0.15mm | |
| Tapered Hole Orifice Diameter Tolerance | ±0.15mm | |
Pad(Ring) | Minimum Size of Inner/Outer Layer Pads for Laser Holes | 10mil (4mil laser hole), 11mil (5mil laser hole) |
| Minimum Size of Inner/Outer Layer Pads for Mechanical Through-Holes | 16mil (8mil hole diameter) | |
| Minimum BGA Pad Diameter | 10mil for lead-containing HASL process, 12mil for lead-free HASL process, 7mil for other processes | |
| BGA Pad Tolerance | +/-1.2mil (Pad ＜12mil); +/-10% (Pad ≥12mil) | |
Line Width/ Spacing | Minimum Line Width Corresponding to Copper Thickness | 1/2OZ: 3/3mil |
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Line Width Tolerance | ≤10mil: +/-1.0mil | |
| ＞10mil: +/-1.5mil | ||
Solder Mask& Legends | Maximum Drilling Diameter for Solder Mask Plugging (Solder Mask on Both Sides) | 0.5mm |
| Solder Mask Ink Color | Green, Yellow, Black, Blue, Red, White, Purple, Matte Green, Matte Black, High Refractive White Ink | |
| Legend Ink Color | White, Yellow, Black | |
| Maximum Diameter for Blue Tape Aluminum Sheet Plugging | 5mm | |
| Drilling Diameter Range for Resin Plugging | 0.1-1.0mm | |
| Maximum Aspect Ratio for Resin Plugging | 12:01 | |
| Minimum Solder Mask Bridge Width | 4mil for green ink, 6mil for other colors; Special requirements required for solder mask bridge control | |
| Minimum Legend Line Width | 3mil width, 24mil height for white legends; 5mil width, 32mil height for black legends | |
| Minimum Spacing for Hollowed-Out Legends | 8mil width, 40mil height for hollowed-out parts | |
| Hollowed-Out Legends on Solder Mask Layer | 8mil width, 40mil height for hollowed-out parts | |
| Profile | Distance from V-CUT Center Line (Without Copper Exposure) to Pattern | H≤1.0mm: 0.3mm (V-CUT angle 20°), 0.33mm (30°), 0.37mm (45°); |
| 1.0＜H≤1.6mm: 0.36mm (20°), 0.4mm (30°), 0.5mm (45°); | ||
| 1.6＜H≤2.4mm: 0.42mm (20°), 0.51mm (30°), 0.64mm (45°); | ||
| 2.4＜H≤3.2mm: 0.47mm (20°), 0.59mm (30°), 0.77mm (45°); | ||
| V-CUT Symmetry Tolerance | ±4mil | |
| Maximum Number of V-CUT Lines | 100 Lines | |
| V-CUT Angle Tolerance | ±5 Degrees | |
| V-CUT Angle Specifications | 20°, 30°, 45° | |
| Gold Finger Chamfer Angle | 20°, 30°, 45° | |
| Gold Finger Chamfer Angle Tolerance | ±5 Degrees | |
| Minimum Distance for Undamaged TAB Beside Gold Fingers | 6mm | |
| Minimum Distance Between Gold Finger Side and Profile Edge Line | 8mil | |
| Depth Accuracy of Depth-Controlled Milled Slots (Edges) (NPTH) | ±0.10mm | |
| Profile Dimension Accuracy (Edge-to-Edge) | ±8mil | |
| Minimum Tolerance of Milled Slots (PTH) | ±0.15mm in both slot width and slot length directions | |
| Minimum Tolerance of Milled Slots (NPTH) | ±0.10mm in both slot width and slot length directions | |
| Minimum Tolerance of Drilled Slots (PTH) | ±0.075mm in slot width direction; Slot length/slot width ＜2: +/-0.1mm in slot length direction; Slot length/slot width ≥2: +/-0.075mm in slot length direction | |
| Minimum Tolerance of Drilled Slots (NPTH) | ±0.05mm in slot width direction; Slot length/slot width ＜2: +/-0.075mm in slot length direction; Slot length/slot width ≥2: +/-0.05mm in slot length direction |
| Item | Unit | Ceramic PCB Process Capabilities | ||
|---|---|---|---|---|
| Minimum Hole Diameter | mm | 0.05 | ||
| Hole Taper Tolerance | % | ±30 | ||
| Drilling Position Accuracy | mm | 0.025 | ||
| Slot Tolerance: Length ≥ 2×Width | mm | Length: ±0.05; Width: ±0.025 | ||
| Slot Tolerance: Length < 2×Width | mm | Length: ±0.025; Width: ±0.010 | ||
| Trace Alignment Accuracy | mm | ±0.025; Interlayer Alignment: 0.025 | ||
| Minimum Line Width/Spacing | mm | 0.075/0.040 | ||
| Overall Line Width Compensation (DPC Process) | mm | 0.02 (No copper thickness restriction, DPC process only) | ||
| Negative Film Direct Etching Process | mm | 10Z copper thickness: 0.025 line width compensation; 20Z copper thickness: 0.05 line width compensation; 30Z copper thickness: 0.075 line width compensation; 80Z copper thickness: 0.15 line width compensation | ||
| Surface Copper Thickness | um | 18, 35, 70, 140, 300, 400 | ||
| Hole Aspect Ratio | / | 8:1 | ||
| Etch Factor | / | ＞4 | ||
| Metal Dam | um | 50 – 800 | ||
| Ink Thickness (Per customer’s requirement if specified) | um | Trace Surface: ≥10; Trace Corner: ≥8 | ||
| Weir Ink Thickness | um | 80 – 120 | ||
| Solder Mask Alignment Tolerance | mm | ±0.075 | ||
| Minimum Single-Side Width of Solder Mask Covering Trace | mm | 10Z surface copper: 0.075; 20Z surface copper: 0.10; 30Z surface copper: 0.15; 40Z surface copper: 0.175 | ||
| Minimum Opening of Solder Mask Film Character (Minimum Line Width) | mm | 0.15 | ||
| Minimum Character Line Width | mm | ≥0.12 | ||
| Character Alignment Tolerance | mm | ±0.15 | ||
| Minimum Character Height | mm | ≥0.75 | ||
| Minimum Character Spacing | mm | ≥0.10 | ||
| Immersion Gold | um | Gold Thickness: 0.025 – 0.10; Nickel Thickness: 2 – 8 | ||
| Immersion Silver | um | Silver Thickness: 0.2 – 0.5 | ||
| Immersion Tin | um | Tin Thickness: 0.2 – 1 (Hot Air Solder Leveling is not applicable for ceramic boards) | ||
| OSP (Oxidation Resistance) | / | OSP Film Thickness: 2 – 5 u” | ||
| Electroless Nickel Palladium Gold (ENEPIG) | um | Gold Thickness: 0.025 – 0.050; Palladium Thickness: 0.025 – 0.075; Nickel Thickness: 2 – 8 | ||
| Minimum Distance from Cutting Line to Trace | mm | 0.2 | ||
| Alignment of Upper & Lower Cutting Lines (Controlled for Double-Sided Scribed Boards) | mm | ±0.025 | ||
| Residual Thickness Control Accuracy | mm | ±0.075; Scribing Depth for Panelized Boards: 1/2 of total board thickness; Scribing Depth for Peripheral Depaneling Lines: 2/3 of total board thickness | ||
| Offset Accuracy Tolerance | mm | ±0.025 | ||
| Laser Cutting Line Width | mm | 0.1 | ||
| Laser Profile Tolerance | mm | ±0.10 | ||
| LTCC Process Sintered Silver Paste – Thickness | um | 10 – 20 | ||
| LTCC Process Sintered Silver Paste – Line Width | mm | ＞0.1 | ||
| LTCC Process Sintered Silver Paste – Line Spacing | mm | ＞0.15 | ||
| Material | – | Alumina | Alumina | Aluminum Nitride |
| Purity | % | 96 | 99.60 | / |
| Appearance | / | White | White | Cyan |
| Density | g/cm³ | 3.72 | 3.85 | 3.3 |
| Average Particle Size | um | 3 – 4 | ＜1.5 | ＜1 |
| Thermal Conductivity | w/m·k | 22.3 | 29.5 | 170 |
| Coefficient of Thermal Expansion (CTE) | x10⁻⁶/℃ (RT~800℃) | 8 | 8.2 | 4.4 |
| Dielectric Breakdown Strength | v/m | 14×10⁶ | 18×10⁶ | 14×10⁶ |
| Resistivity | / | ＞10¹⁴ | ＞10¹⁴ | ＞10¹⁴ |
| Dielectric Constant | (1MHz) | 9.5 | 9.8 | 9 |
| Dielectric Loss Tangent | (1MHz, x10⁻⁴) | 3 | 2 | 4 |
| Flexural Strength | Mpa | 350 | 500 | 300 |
| Dimension | mm | 114×114/120×120/127×127/130×140/140×190 | – | – |
| Thickness | mm | 0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5 | – | – |
| Warpage | % | ≤0.3 | ≤0.3 | ≤0.3 |
| Item | Unit | Aluminum PCB Manufacturing Capability |
|---|---|---|
| Base Material Brand | / | Guoji GL11 / Guangzhou Aluminum / Ventec / Isola / Rogers |
| Solder Mask Ink | / | Libang Series |
| Finished Copper Thickness | μm | 18 / 25 / 35 / 70 (0.5oz / 0.75oz / 1oz / 2oz) |
| Board Thickness Range | mm | 0.2 – 5.0 |
| Thickness Tolerance (t ≥ 1.0mm) | % | ±10 |
| Thickness Tolerance (t < 1.0mm) | mm | ±0.1 |
| Thermal Conductivity | W/m·K | 1 – 12 |
| Minimum Line Width | % | ±10 |
| Minimum Spacing | mil | 8 (0.2mm) |
| Drill Hole Diameter | mm | ≥ board thickness & ≥ 1.0 |
| Hole Tolerance | mm | ±0.1 |
| Solder Mask Type | / | Photoimageable Ink |
| Solder Mask Bridge | mm | 0.15 |
| Min. Character Width | mm | ≥0.15 |
| Min. Character Height | mm | ≥1.0 |
| Maximum Board Size | mm | Standard: 480 × 580 / Large: 580 × 1180 (Custom available) |
| Outline Accuracy | mm | ±0.15 |
| Trace to Board Edge Clearance | mm | ≥0.3 (12mil) |
| Panelization (Zero-gap) | / | Zero-gap panelization (no spacing between boards in panel shipment) |
| Panelization (With Gap) | mm | 2.0 (Panel gap should not be less than 2.0mm, otherwise routing is difficult) |
| Surface Finish | / | ENIG, Immersion Silver, Immersion Tin, OSP |
| Item | Unit | Copper-based PCB Manufacturing Capability |
|---|---|---|
| Number of Layers | L | 1 – 8 |
| Product Types | / | Single-sided, Double-sided with core, Single-sided 2-layer, Single-sided 4-layer, Thermal separation (Pedestal board) |
| PCB Quality Standard | / | IPC-A-600/610 Class 3/2 |
| Thermal Conductivity | W/m·K | 1 – 12 (Thermal separation: 398W for pedestal board) |
| Max. PCB Size | mm | 1200 × 480 |
| Min. PCB Size | mm | 5 × 5 |
| PCB Thickness | mm | 0.5 – 5.0 |
| Finished Copper Thickness | oz | 1 – 3 |
| Plated Through Hole Copper Thickness | μm | 20 – 35 |
| Line Width / Spacing | mil | 1oz: 4/5, 2oz: 6/8, 3oz: 10/11 |
| PCB Warpage | % | ≤ 0.5 |
| Min. Punching Hole Diameter | mm | 1.0 |
| Min. Drilling Hole Diameter | mm | 0.6 |
| Min. Solder Mask Clearance | mm | 0.35 |
| Outline Tolerance | mm | CNC: ±0.15 / Punching: ±0.1 |
| Copper Thickness of Circuit Layer | μm | 35, 70, 105, 140, 175, 210, 245, 280, 315, 350 |
| Routing Tolerance | mm | CNC: ±0.1 / Punching: ±0.1 |
| Surface Finish & Thickness | / | ENIG: Au 0.0254–0.127 μm, Ni 5–6 μm OSP / HASL (Lead-free): 40–100 μm Immersion Silver: Ag 3–8 μm Hard Gold Plating: Au 0.1–0.5 μm, Ni 4–6 μm |
| Item | Unit | HDI PCB Manufacturing Capability |
|---|---|---|
| Product Type | / | HDI ELIC (5+2+5) |
| PCB Layers | L | 1 – 32 |
| Board Thickness | mm | Core thickness: 0.05 – 1.5 Finished thickness: 0.3 – 3.5 |
| Minimum Hole Diameter | mm / mil | Laser drill: 0.075mm / 3mil Mechanical drill: 0.15mm / 6mil |
| Minimum Line Width / Spacing | mm | 0.030 / 0.030 (1.2mil / 1.2mil) |
| Copper Foil Thickness | oz | 0.5 – 5 |
| Max. Processing Size | mm | 700 × 610 |
| Layer-to-Layer Registration | mm | ±0.05 (2mil) |
| Outline Tolerance | mm | ±0.075 (3mil) |
| Min. BGA Pad | mm | 0.15 (8mil) |
| Aspect Ratio | / | 10:1 |
| Board Warpage | % | ≤ 0.5 |
| Impedance Tolerance | % | ±8 |
| Daily Production Capacity | m² | 3000 |
| Common Materials | / | FR4 / Normal Tg / High Tg / Low Dk / HF FR4 / PTFE / PI |
| Surface Finish | / | Electroplated Ni/Au, OSP, HASL, Electroplated Gold, Immersion Tin |
| Item | Unit | FPC Manufacturing Capability |
|---|---|---|
| Max. Layers | L | 16 |
| Min. Finished Board Thickness | mm | 0.04 |
| Max. Size | mm | 500 × 2200 |
| Min. Laser Drill Hole | mm | 0.025 |
| Min. Mechanical Drill Hole | mm | 0.1 |
| Min. Line Width / Spacing | mm | 0.035 / 0.035 |
| Min. Annular Ring (Single / Double Side) | mm | 0.075 |
| Min. Annular Ring (Multilayer Inner Layer) | mm | 0.1 |
| Min. Annular Ring (Multilayer Outer Layer) | mm | 0.1 |
| Min. Coverlay Bridge | mm | 0.1 |
| Min. Solder Mask Opening | mm | 0.15 |
| Min. Coverlay Opening | mm | 0.30 × 0.30 |
| Min. BGA Pitch | mm | 0.45 |
| Single-ended Impedance Tolerance | % | ±7 |
| Base Material Type | / | Polyimide, LCP, PET |
| Base Material Brands | / | Shengyi, ITEQ, Taiflex, Newflex, Nikko, Panasonic, DuPont, Jiujiang |
| Stiffener Types | / | FR4, PI, PET, Steel, Aluminum, PSA, Nylon |
| Surface Finish | / | ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin |
| Flex + HDI | / | 2+N+2 (Mass production) |
| Item | Unit | Rigid-Flex PCB Manufacturing Capability |
|---|---|---|
| Max. Layers | L | 30 |
| Max. Finished Board Thickness | mm | 4.0 |
| Max. Production Size | mm | 500 × 1000 |
| Min. Laser Drill Hole | mm | 0.075 |
| Max. Aspect Ratio | / | 13:1 |
| Min. Inner Layer Line Width / Spacing | mm | 0.04 / 0.04 |
| Min. Outer Layer Line Width / Spacing | mm | 0.05 / 0.05 |
| Solder Mask Registration Tolerance | mm | 0.035 |
| Min. Solder Mask Bridge | mm | 0.08 |
| Min. BGA Pitch | mm | 0.08 |
| Single-ended Impedance (Size) | mm | 0.45 |
| Single-ended Impedance Tolerance | % | ±7 |
| Base Materials | / | Mid-Tg, High-Tg, Low Dk, Low Loss FR4, High-frequency materials |
| Base Material Brands | / | Shengyi, TUC, ITEQ, Rogers, Panasonic, DuPont, Taiflex |
| Surface Finish | / | ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin |
| Rigid-Flex + HDI | / | 3+N+3 (Prototype) |
| Item | Unit | High-Frequency & High-Speed PCB Manufacturing Capability |
|---|---|---|
| Layers | L | 2 – 30 |
| Max. Board Thickness | mm | 8.0 |
| Finished Copper Thickness | oz | 0.5 – 5 |
| Thickness Tolerance | % | ±10 |
| Max. Finished Size | mm | 570 × 670 |
| Min. Finished Size | mm | 1 × 1 |
| Outline Accuracy | mm | ±0.075 |
| Slot Accuracy | mm | ±0.075 |
| Min. Hole-to-Copper Distance | mil | 5 |
| Min. Hole Diameter | mm | 0.05 |
| Min. BGA Pitch | mm | 0.4 |
| Min. Hole-to-Hole Wall Spacing (Different Nets) | mm | 0.2 |
| Hole Tolerance | mil | ±2.0 (PTH) / ±1.0 (NPTH) |
| Hole Position Tolerance | mil | ±2 |
| Backdrill Stub | mil | 4 |
| Aspect Ratio | / | 20:1 |
| Line Width Accuracy | μm | ±20 |
| Board Warpage | % | ≤0.75 |
| Trace Width Control | mm | ±0.02 |
| Impedance Tolerance (≥50Ω) | % | ±8 |
| Max. Impedance Control Deviation | % | 2 |
| Plated Through Hole Copper Thickness | μm | Min ≥18, Avg ≥20 |
| Solder Mask Thickness | μm | 20 – 30 |
| High-frequency PCB Types | / | 6GHz–24GHz PCB, 70GHz PCB, Embedded Antenna PCB, Ceramic Hybrid Substrate PCB, PTFE-based High-frequency PCB |
| Base Copper Thickness | oz | 0.5 – 1.0 |
| Thermal Conductivity | W/m·K | 0.15 – 0.95 |
| PCB Via Types | / | Blind Via, Stacked Via, Staggered Via, Skip Via, Buried Via |
| Thermal Stress | / | 10s at 288°C |
| Dielectric Constant (Dk) | / | ε2.1 – ε10.0 |
| Punching or Routing Accuracy | mm | ±0.10 – 0.13 |
| Hole Wall Copper | μm | ≥20 |
| Solder Mask Ink | / | Taiyo PSR-4000, Tamura DSR-2200 |
| Substrate Materials | / | Hydrocarbon Resin, PTFE Resin, HC Resin, PPO/PPE Resin |
| Surface Finish | / | ENIG, Immersion Silver, Electroplated Gold, Immersion Tin, Electroplated Tin |
| Special Surface Finish | / | Base Copper + Thick Gold, Base Copper + Palladium-Gold, Nickel Base + Hard Gold, etc. |