RF LAMINATES. MANUFACTURED CIRCUITS.
Taconic PCB
Fabricación
Low-loss materials, shaped into working RF boards.
FLJ manufactures Taconic PCBs for antenna networks, microwave circuits and RF modules. Double-sided boards, multilayer builds and compatible hybrid constructions bring the selected laminate, copper geometry and plated connections into one finished circuit board.
Double-sided RF boards
Etched RF circuits, reference copper and plated connections on the selected laminate core.
Multilayer Taconic boards
RF layers joined with compatible bonding materials for integrated circuits and interconnects.
RF / FR-4 hybrid boards
Specialty laminate on RF-critical layers, combined with supporting control or power circuitry.
MATERIAL FAMILIES & GRADE OPTIONS
Choose the construction
behind the circuit
The Taconic material line is part of AGC Multi Material. Its woven-glass PTFE and filled, reinforced laminates offer different dielectric and mechanical constructions. The grade, thickness and copper cladding define the starting material for fabrication.
| Material direction | Examples | What it brings to the board |
|---|---|---|
| Light woven-glass PTFE | TLY-5 | A low-Dk construction with light glass reinforcement for antenna and microwave circuits. |
| Woven-glass PTFE | TLX family / TLX-8 | Another reinforced PTFE option for RF circuits, with its own dielectric and thickness choices. |
| Filled, reinforced RF laminate | TSM-DS3b | Dimensional and thermal characteristics suited to complex multilayer RF constructions. |
| Thermally conductive RF material | RF-35HTC | A material option when heat transfer through the dielectric is part of the RF board requirement. |
Links lead to current AGC product information. Available dielectric thickness, foil and bonding combinations are confirmed for the quoted construction.
Low dielectric constant,
with a reinforced structure
Light glass reinforcement supports the PTFE dielectric during fabrication. For the circuit, the selected construction provides the electrical properties; for production, its handling and dimensional response remain part of the manufacturing route.
A core for integrated
multilayer RF circuits
A ceramic-filled construction with low glass content provides another balance of dielectric behavior and dimensional stability. Compatible bonding materials join these cores into a multilayer board, including constructions that use fastRise prepregs.
Published typical material properties, not finished-board insertion loss. TLY-5 lists IPC-650 2.5.5.5; TSM-DS3b lists modified 2.5.5.5.1. The measurements share a frequency, but not an identical test method.
TACONIC PCB FABRICATION
Preserve the material.
Build the circuit.
PTFE-based laminates combine useful electrical properties with a different mechanical and surface response from conventional epoxy/glass. FLJ carries those differences through patterning, drilling, bonding and board completion.
Keep the geometry through processing
Panels are supported and handled to limit bending, stretching and surface damage. Copper preparation uses a route suited to the laminate rather than aggressive brushing of a soft dielectric. Imaging and etching form the traces, pads and reference copper.
The laminate can move as copper is removed. Manufacturing artwork is scaled to allow for that dimensional response. The adjustment is established for the core construction and copper pattern so that pads and clearances reach their intended positions after processing, ready to align with later layers and drilled holes. Inner-layer optical inspection checks the circuits before they are enclosed. On an etched PTFE surface, the remaining copper-foil imprint also contributes to bonding; preserving that texture avoids turning a cleaning step into an adhesion problem.
The hole wall becomes
an electrical interface
Tool condition, entry and backing support, cutting heat and chip removal affect the bore. Reinforcing fibers must be cut cleanly while the PTFE resin is kept from smearing across the copper surfaces that later form internal connections.
Hole preparation acts on the materials exposed in the bore. In an applicable TSM-DS3-family / fastRise build, thermoset-resin desmear comes before the PTFE activation step. Removing bonding-resin residue and preparing PTFE for adhesion are different jobs; one treatment is not assumed to accomplish both. A conductive starting layer then supports electroplating of the wall and its contacts with internal copper.
Join the RF layers
with the right bonding system
Patterned Taconic cores, selected bonding plies and outer copper are registered in the lay-up. Bonding material fills around the copper pattern and joins the stack through its specified thermal cycle.
Pressure, resin flow and cure work together. Copper distribution and the space around conductors affect the amount of resin needed; simply adding pressure does not resolve every filling or adhesion problem.
A hybrid board combines the RF laminate with a compatible supporting material. Its bonding layer and finished dielectric spacing are part of the complete construction, alongside the RF core and the plated connections through it.
Complete the surfaces,
profile and connections
The outer circuits receive the specified solder mask and exposed-pad finish. Routing and machining create the board outline, slots and assembly features. Surface preparation preserves the adhesion needed by the selected finish and mask.
Bare-board electrical testing checks the required connections and isolation. A relevant microsection can show the plated barrel, its junction with an inner pad and the nearby laminate at the cut. Dimensional checks and the specified impedance coupons address the manufactured geometry. When FLJ also assembles the module, its assembly and functional tests follow the defined module test scope.
PCB testing and inspectionRF HARDWARE & PRODUCTION SUPPLY
For the circuits
behind the connection
Antenna feed networks, filters, couplers and microwave modules use the board itself as part of the RF structure. Material selection and fabrication therefore meet in the etched conductor, dielectric spacing and interconnections.
FLJ supplies prototype and production boards, with PCB assembly available for the finished module. Repeat builds retain the released laminate grade, foil, bonding material and stackup; the material identity stays connected to the board revision.
Send the fabrication files, required grade, quantity and available stackup for a Taconic PCB quotation. Include assembly data when component sourcing and assembly are part of the order.
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