PCB manufacturing & turnkey assembly · Shenzhen, China

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PCB manufacturing & turnkey assemblyISO 9001 · ISO 13485 · IATF 16949
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FLJ PCB · Shenzhen, China

PCB Manufacturing Services for Prototype and Production

Custom bare-board fabrication for your next product. FLJ PCB / Philifast in Shenzhen connects board construction, materials, engineering review and inspection—from a first prototype to repeat production.

Bare printed circuit board panel for fabrication

PCB manufacturing capabilities at a glance

Use these selected references to start the discussion. Our engineers match each feature with the material, copper and process route; specialist-board figures describe their own construction.

PCB manufacturing capabilities at a glance
Manufacturing choiceFLJ scope / referenceWhat it means for your build
General rigid PCB layers1–30 layersLayer count and construction reviewed with your circuit and board drawing
Finished copper, general scopeOuter up to 8 oz; inner up to 6 ozTrace geometry and copper distribution reviewed with copper weight
Minimum line / space at 0.5 oz3 / 3 milCopper-specific reference; heavier copper uses different clearances
Mechanical finished-hole range0.10–6.2 mmFinished opening differs from drill diameter; board depth and material matter
Maximum finished size, 2–20 layers21 × 33 in (533.4 × 838.2 mm)This layer range; process panels and specialist board sizes are assessed separately
Controlled impedance±5 Ω below 50 Ω; ±10% at or above 50 ΩDefined stackup, target and agreed verification
Specialist HDI laser-hole reference0.075 mmHDI process scope; dielectric, land and fill reviewed together
Surface finish optionsENIG, lead-free HASL, OSP, immersion tin/silver and plated goldSelect around soldering, contacts and the drawing

Materials and stackup matched to your circuit

A PCB material choice connects electrical behavior, assembly temperature, insulation, mechanical fit and sourcing. Send a nominated grade or explain the operating needs; we can review options with you.

FLJ’s published material range includes standard and high-Tg FR4, polyimide flex materials, RF laminates and metal-based systems. Examples include Shengyi and Kingboard FR4 grades, Isola FR408/FR408HR, Panasonic Megtron families and Rogers RF laminates. Exact grades and availability are checked for the build.

For controlled impedance PCB fabrication, review the reference planes, dielectric spacing, finished copper and trace geometry together. A nominal prepreg thickness is not necessarily its final pressed thickness. The proposed stackup gives routing and manufacturing a shared reference before production.

For RF and high-speed designs, compare the selected material’s dielectric data at the relevant frequency and test method. For power or thermal designs, connect copper and dielectric choices with the cooling path. A substitute material is discussed with your team before approval.

Close-up of bare PCB copper pads, traces and solder mask

Prototype, low-volume and repeat production

Choose a manufacturing route around the stage of your product. Quantity is one part of the decision; design maturity, construction, material availability and acceptance also shape the build.

Prototype PCB fabrication

First hardware or a design revision

Check board fit, circuitry, construction and the details needed for the next revision

Low-volume PCB manufacturing

Small runs or multiple product variants

Coordinate quantities, revisions and material choices without losing build identity

Repeat / volume production

A released design with ongoing demand

Keep material, manufacturing revision, test scope and changes connected between orders

Quick-turn PCB fabrication

A date-sensitive board requirement

Share the target date; engineering, materials and process route are reviewed before scheduling

DFM review before fabrication

Design for manufacturing connects your released data with a practical fabrication route. Our engineers review the board files and discuss useful changes or open questions with your team.

A CAD design-rule check tests the rules in your layout environment. A fabrication review also considers the selected manufacturing process. If a detail is still open, send the current files or explain the requirement—we will follow up with the relevant engineering questions.

Changes to materials, holes, copper or the outline are agreed with your team before the manufacturing package is released. Repeat orders use an identified revision, with changes reviewed against the previous build.

Gerber fabrication layer export settings in PCB design software

Copper and spacing

Finished copper, trace width and clearances

Holes and vias

Finished-hole needs, plated/non-plated features and via spans

Mask and markings

Pad openings, bridges and reference markings

Outline and panel

Slots, edge contacts, V-scoring and breakaway features

Stackup and signal needs

Layer order, material and impedance targets

From fabrication data to finished boards

The sequence follows the construction. Multilayer and HDI boards include additional layer-building stages; a straightforward rigid board uses a different route.

Copper circuit patterns on PCB fabrication panels
Copper pattern fabrication
Flying-probe electrical test equipment
Bare-board electrical verification
  1. 01

    Engineering release

    Review artwork, drill information, outline and construction

  2. 02

    Inner layers and inspection

    Image and etch inner copper for multilayer boards; inspect the pattern

  3. 03

    Lamination and drilling

    Align layers and dielectric, press the stack, then create the specified holes

  4. 04

    Interconnections and outer copper

    Apply the selected metallization and copper-pattern processes

  5. 05

    Mask, finish and profiling

    Apply mask/legend, finish exposed copper and complete the outline

  6. 06

    Verification and packing

    Perform the agreed inspection/electrical checks and protective packing

Advanced features and surface finishes

Dense routing, high current and mechanical interfaces call for different fabrication details. Tell us the function a feature needs to perform, and we will review its construction.

For specialized circuit constructions, explore IC substrate PCBs and embedded PCBs.

HDI and via filling

Microvias, build-up layers and specified via-in-pad arrangements

Heavy copper PCB

Copper-specific line/space and distribution

Controlled impedance / RF

Specified stackup, laminate and geometry

Gold fingers and castellations

Contact finish, bevel or plated edge geometry

Backdrilling and mechanical details

Via stub target, depth-controlled work, slots and profiling

Finish selection

ENIG, HASL, OSP, immersion finishes or plated gold

Inspection and acceptance connected to your board

Bare-board electrical testing checks intended connectivity and isolation. It complements dimensional and visual inspection; it does not establish assembled-product function.

Agree the relevant checks with the board specification: copper-pattern inspection, finished dimensions, holes, mask, surface finish and electrical test. Controlled impedance or other specialized verification is defined with its targets, sampling and reporting arrangement.

IPC-A-600 concerns printed-board acceptability, while IPC-6012 addresses qualification and performance for rigid printed boards. Use the applicable document, revision and acceptance class for the actual construction. These technical requirements serve a different purpose from an ISO management-system certificate.

For supplier qualification, our team can discuss current certificates and the relevant entity, site and scope. Material declarations, applicable PCB recognition and any finished-product market approvals are addressed separately.

Microscope inspection of circuit board features

What affects a PCB fabrication quote?

An accurate PCB quote connects your board configuration with the quantities and delivery you need. Send the present data; we will help resolve the details that affect the manufacturing route.

Board size and panel use

Outline, arrays and usable material

Layer stack and material

Layer count, exact grade and dielectric construction

Copper, holes and feature density

Copper weight, small features, via types and filling

Finish and mechanical work

Finish selection, contacts, slots, bevels and edge features

Quality and records

Acceptance requirements, test scope and reports

Quantity and delivery

Prototype/repeat quantities, desired date and destination

Manufacturing support from Shenzhen to your next build

FLJ PCB is the manufacturing brand used by Shenzhen Philifast Electron Co., Ltd. Our team connects engineering review, manufacturing and delivery around your product.

A useful supplier conversation goes beyond the headline layer count. Ask about the material, fabrication route, acceptance plan and records relevant to your board. Our company and factory pages provide a starting point for that discussion, and you can arrange a focused supplier review with the team.

If the project continues into PCB assembly, we can coordinate board fabrication with component sourcing, SMT/through-hole assembly, programming and testing. Bare-board requirements remain identified within the wider build so board quality, component configuration and product function are reviewed at the appropriate stage.

Factory visit group in a PCB assembly workshop

Send the files you have

Send your available board files, drawing or project description. We’ll review them and follow up on any useful additions.

Add quantity and preferred delivery if you know them.

Send your PCB project ↗
Helpful answers

Frequently asked questions

What is the difference between PCB manufacturing and PCB assembly?

PCB manufacturing, or fabrication, creates the bare circuit board: its copper patterns, insulating construction, holes, mask and finished surfaces. PCB assembly installs and solders components, then adds programming and agreed circuit tests where required. FLJ can coordinate both scopes.

Can FLJ manufacture prototypes and repeat production boards?

Yes. FLJ supports prototype and production discussions for rigid, multilayer and specialist constructions. The manufacturing route is reviewed with the released design, quantities, material and acceptance needs. Repeat orders retain an identified revision and review any changes.

How many PCB layers can FLJ manufacture?

FLJ’s published general rigid-board scope is 1–30 layers. Its separate specialist HDI table lists a 1–32-layer range. Each refers to its own construction and process scope; our engineers review the required layer stack and features together.

Can you help if the material or stackup is not final?

Yes. Send the current layout, proposed construction or product requirements. Our team can discuss material, copper, dielectric spacing and impedance goals before the manufacturing package is finalized.

Does the smallest drill size mean every plated hole can use that size?

No. A drill diameter and a finished plated-hole diameter describe different stages. Board depth, material, plating and the via construction affect the usable combination. FLJ reviews the intended finished opening and connection with your drawing.

What determines PCB manufacturing lead time?

The schedule follows engineering readiness, material availability, layer and via construction, finish, inspection scope and quantity. Shipping is reviewed separately. Share your target date so the team can assess a practical manufacturing and delivery plan.

What is included in a custom PCB fabrication quotation?

The quotation identifies the agreed board configuration, quantity and production scope. Discuss tooling or special processes, electrical/other tests, requested documents, packing and freight so your purchasing team can compare the delivered scope.

Can I request a PCB quote without a complete file package?

Yes. Start with the files or explanation you have. FLJ will review the information and ask about useful additions, such as drill data, construction choices or quantities. You do not need to resolve every technical detail before contacting the team.

Start with what you have

Let’s review your next build

Send your available board files, drawings or project questions. Our team will review the information and follow up with you about the next step.

Send your project to FLJ ↗
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