Six-layer rigid-flex HDI construction
This design is described as a six-layer rigid-flex HDI PCB using blind and buried vias. Its rigid and flexible areas combine FR4 with DuPont polyimide, providing flexibility where the assembly needs to bend.
The rigid area is 0.6 mm thick, providing mechanical strength around the rigid circuit sections. Laminates are sourced through authorized distributors and undergo incoming-material inspection.
ENIG surface finish
The rigid-flex circuit uses an ENIG finish. The finish offers a flat surface, resistance to oxidation and suitability for contact surfaces.
Design and manufacturing capabilities
| Capability | Service range or option |
|---|---|
| Material options | TG170 / TG180, F4BM, FR4, FR1–4 and related materials |
| Design layer range | 1–32 layers |
| Minimum conductor width / spacing | 3 mil |
| Minimum laser-drilled hole | 4 mil |
| Minimum mechanically drilled hole | 8 mil |
| Copper foil thickness | 18–175 µm; standard values: 18, 35 and 70 µm |
| Peel strength | 1.25 N/mm |
| Minimum punched hole, single-sided board | 0.9 mm / 35 mil |
| Minimum hole diameter | 0.25 mm / 10 mil |
| Hole-diameter tolerance for holes ≤0.8 mm | ±0.05 mm |
| Hole-diameter tolerance | ±0.05 mm |
| Hole-wall copper, double-sided / multilayer | ≥0.8 mil |
| Via resistance, double-sided / multilayer | ≤300 µΩ |
| Minimum line width | 0.127 mm / 5 mil |
| Minimum line spacing | 0.127 mm / 5 mil |
| Silkscreen colors | Black, white, red, green and other colors |
| Surface finish options | Leaded / lead-free HASL, ENIG, silver and OSP |
| Service | OEM service |
| Standards and compliance references | ISO 9001, RoHS and UL |
