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PCB design

RF Equipment PCB and PCBA Design

A PCB and PCBA design profile for RF equipment.

  • RF-equipment application
  • PCB and PCBA design scope
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RF PCB design and the radio-frequency front end

In a wireless communication system, only a relatively small front-end section operates at radio frequency. The rest of the circuit performs low-frequency baseband analog and digital signal processing. An RF front end commonly includes a low-noise amplifier, a mixer and a power amplifier.

Although the RF front end contains fewer components than the baseband circuitry, it remains central to overall system performance.

The six RF design tradeoffs

RF PCB design processes analog signals across a wide dynamic range at high frequency. Like the multi-parameter tradeoffs often illustrated by an octagonal rule in analog IC design, RF design has its own six-sided balance:

  • Noise
  • Linearity
  • Supply voltage
  • Gain
  • Operating frequency
  • Power

Two or more of these parameters often constrain one another, creating a multidimensional optimization problem. The resulting compromises make the RF designer’s judgment and practical experience important when selecting an appropriate balance.

RF PCB applications

  1. Base-station RF circuit boards
  2. Mobile-phone RF circuit boards
  3. Wireless local-area-network (WLAN) RF PCBs
  4. Global positioning system (GPS) RF PCBs
  5. Radio-frequency identification (RFID) boards
  6. Internet of Things (IoT) RF PCBs

Design and manufacturing capabilities

Design and manufacturing service capability reference
Capability Service range or option
Design layer range 1–32 layers
Minimum conductor width / spacing 3 mil
Minimum laser-drilled hole 4 mil
Minimum mechanically drilled hole 8 mil
Copper foil thickness 18–175 µm; standard values: 18, 35 and 70 µm
Peel strength 1.25 N/mm
Minimum punched hole, single-sided board 0.9 mm / 35 mil
Minimum hole diameter 0.25 mm / 10 mil
Hole-diameter tolerance for holes ≤0.8 mm ±0.05 mm
Hole-diameter tolerance ±0.05 mm
Hole-wall copper, double-sided / multilayer ≥0.8 mil
Via resistance, double-sided / multilayer ≤300 µΩ
Minimum line width 0.127 mm / 5 mil
Minimum line spacing 0.127 mm / 5 mil
Silkscreen colors Black, white, red, green and other colors
Surface finish options Leaded / lead-free HASL, ENIG, silver and OSP
Service OEM service
Standards and compliance references ISO 9001, RoHS and UL
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