PCB manufacturing & turnkey assembly · Shenzhen, China

Philifast FLJ PCB logoFLJ PCBManufacturing your next idea
PCB manufacturing & turnkey assemblyISO 9001 · ISO 13485 · IATF 16949
Talk to our manufacturing team[email protected]
PCB design

4-Layer Medical Equipment PCB and PCBA Design

A four-layer PCB and PCBA design profile for medical equipment.

  • 4-layer construction
  • Medical-equipment application
  • PCB and PCBA design
Product information
Copper layers4
Discuss this product

Send your requirements, design files or sample details for project review.

PCBs in medical electronics

Printed circuit boards have expanded across many areas of electronics, including IoT equipment, smartphones, computers and artificial intelligence. Their role in medical equipment connects electronic development with the needs of patients and healthcare professionals.

PCBs make compact medical devices possible. Improvements in healthcare technology help address tasks such as accurate diagnosis and monitoring a patient’s health condition.

A forecast for 2022 projected the global medical-electronics market at US$4.4 billion. The growth discussed in that forecast reflects the increasing role of PCBs as medical equipment becomes digital and depends on electronic functions for efficient operation.

Examples include defibrillators, electrical muscle-stimulation equipment, MRI systems, medical imaging systems, CT scanners and ultrasound equipment.

Reliability, cleanliness and compact construction

Medical PCB production requires particular care because the reliability of the equipment can affect a person’s life. Cleanliness requirements are especially demanding for circuitry intended for implantable equipment.

These designs must be clean and compact. High-density interconnect (HDI) technology supports the small dimensions and dense component placement needed by many medical devices.

HDI and via-in-pad technology

Via-in-pad places a via inside a copper pad to conserve PCB area. The design discussion describes making as much as 50% of the available area accessible for component placement, helping engineers achieve suitable pitches in smaller equipment.

Blind and buried vias also reduce routing space and increase component density. Via-in-pad is an important option where high-speed interconnection and high dissipation must be addressed in a dense board layout.

Surface-mount technology

Surface-mount technology (SMT) is widely used in commercially manufactured electronic equipment. Smaller SMT components allow more electronics to fit into a compact space.

SMT also supports automated soldering and PCB assembly, improving manufacturing repeatability and reliability while helping control assembly cost.

Fine conductors and spacing

The next generation of portable electronics relies on HDI constructions with very fine lines and spaces. Compared with conventional routing technology, fine-feature HDI can reduce board dimensions, improve routing density and help control manufacturing cost.

Medical industry applications

PCBs and electronics support medical appliances as well as monitoring, diagnostic and treatment equipment. As the technology develops, their use across healthcare continues to expand.

  • Scanning equipment: CT scanners, X-ray displays and ultrasound scanners depend on electronic components.
  • Patient monitoring: Heart-rate, blood-glucose and blood-pressure monitors all incorporate electronic circuitry.
  • Medical and research instruments: Data collection and testing equipment includes electron microscopes, control systems, compressors and other instruments using PCBs.

Design priorities for medical equipment

Healthcare applications place high demands on reliability and quality. At the same time, the dimensions of the host equipment restrict the PCB outline. Medical PCB development therefore combines dependable construction with continuing miniaturization.

Design and manufacturing capabilities

Design and manufacturing service capability reference
Capability Service range or option
Material options IT180, F4BM, FR4, FR1–4 and related materials
Design layer range 1–32 layers
Minimum conductor width / spacing 3 mil
Minimum laser-drilled hole 4 mil
Minimum mechanically drilled hole 8 mil
Copper foil thickness 18–175 µm; standard values: 18, 35 and 70 µm
Peel strength 1.25 N/mm
Minimum punched hole, single-sided board 0.9 mm / 35 mil
Minimum hole diameter 0.25 mm / 10 mil
Hole-diameter tolerance for holes ≤0.8 mm ±0.05 mm
Hole-diameter tolerance ±0.05 mm
Hole-wall copper, double-sided / multilayer ≥0.8 mil
Via resistance, double-sided / multilayer ≤300 µΩ
Minimum line width 0.127 mm / 5 mil
Minimum line spacing 0.127 mm / 5 mil
Surface finish options Rosin flux, HASL, electroplated gold, anti-oxidation treatment, immersion gold and carbon ink
Service OEM service
From design to delivery

Bring your next product to production.

Share your board, design files or project requirements with our engineering team.

Request a project quote
PCB & PCBA manufacturing
Let's discuss your project.
Get a Quote ↗
Scroll to Top