Advantages of HDI PCB design
- Versatility: HDI boards are suited to designs where weight, space, reliability and performance are principal considerations.
- Compact construction: Combining blind vias, buried vias and microvias reduces the space needed for routing and interconnection.
- Signal integrity: Via-in-pad and blind-via techniques allow components to sit closer together, shortening signal paths. Reducing through-hole stubs also reduces reflections and improves signal quality. Shorter paths therefore support better signal integrity.
- Reliable interconnection: Stacked vias support robust interconnection for designs intended to operate under demanding environmental conditions.
- Layer-count efficiency: A conventional eight-layer through-hole design can, where the circuit and routing allow, be reorganized as a six-layer HDI design while maintaining its functionality and quality requirements.
Design and manufacturing capabilities
| Capability | Service range or option |
|---|---|
| Material options | IT180, F4BM, FR4, FR1–4 and related materials |
| Design layer range | 1–32 layers |
| Minimum conductor width / spacing | 3 mil |
| Minimum laser-drilled hole | 4 mil |
| Minimum mechanically drilled hole | 8 mil |
| Copper foil thickness | 18–175 µm; standard values: 18, 35 and 70 µm |
| Peel strength | 1.25 N/mm |
| Minimum punched hole, single-sided board | 0.9 mm / 35 mil |
| Minimum hole diameter | 0.25 mm / 10 mil |
| Hole-diameter tolerance for holes ≤0.8 mm | ±0.05 mm |
| Hole-diameter tolerance | ±0.05 mm |
| Hole-wall copper, double-sided / multilayer | ≥0.8 mil |
| Via resistance, double-sided / multilayer | ≤300 µΩ |
| Minimum line width | 0.127 mm / 5 mil |
| Minimum line spacing | 0.127 mm / 5 mil |
| Surface finish options | Rosin flux, HASL, electroplated gold, anti-oxidation treatment, immersion gold and carbon ink |
| Service | OEM service |
