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PCB design

Blood Pressure Monitor PCB Design

A four-layer PCB design profile for a blood pressure monitor.

  • Blood-pressure-monitor application
  • 4-layer design
Product information
Copper layers4
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Four-layer electronic blood-pressure monitor parameters

Measurement and user-interface parameters
Parameter Design value or function
Measurement method Oscillometric measurement
Measurement cycle Measurement during cuff inflation
Pressure measurement range 0–299 mmHg (0–39.9 kPa)
Pressure accuracy Within ±3 mmHg (±0.4 kPa)
Pressure units mmHg / kPa
Pulse range 40–200 beats per minute
Pulse accuracy ±5%
Display Digital LCD
Power supply Built-in lithium battery; a dry-cell version can be developed for a custom model
History storage 100 measurement groups

Processor and memory architecture

Blood-pressure-monitor solution processor
Item Architecture
Processor High-performance 32-bit RISC processor
Development CPU support for a dedicated C-code compiler
Operating frequency 120 MHz
Cache 16 kB high-performance cache
SPI flash controller Serial flash controller (SFC), supporting 1-, 2- and 4-data-line operation
Interrupts 64 vectored interrupts
Interrupt priority 4 levels

Measurement and operating features

The electronic blood-pressure-monitor solution combines measurement, voice announcement of results and a large display for clearer reading. The measurement algorithm is described around extensive clinical testing and stable operation.

  • One-button measurement and straightforward operation
  • Stable operation and environmentally conscious material selection
  • Built-in background music for a more relaxed measurement experience
  • Switchable pressure units
  • Automatic power-off after one minute without an operation
  • Low-voltage warning
  • Fault detection

Design and manufacturing capabilities

Design and manufacturing service capability reference
Capability Service range or option
Design layer range 1–32 layers
Minimum conductor width / spacing 3 mil
Minimum laser-drilled hole 4 mil
Minimum mechanically drilled hole 8 mil
Copper foil thickness 18–175 µm; standard values: 18, 35 and 70 µm
Peel strength 1.25 N/mm
Minimum punched hole, single-sided board 0.9 mm / 35 mil
Minimum hole diameter 0.25 mm / 10 mil
Hole-diameter tolerance for holes ≤0.8 mm ±0.05 mm
Hole-diameter tolerance ±0.05 mm
Hole-wall copper, double-sided / multilayer ≥0.8 mil
Via resistance, double-sided / multilayer ≤300 µΩ
Minimum line width 0.127 mm / 5 mil
Minimum line spacing 0.127 mm / 5 mil
Silkscreen colors Black, white, red, green and other colors
Surface finish options Leaded / lead-free HASL, ENIG, silver and OSP
Service OEM service
Standards and compliance references ISO 9001, RoHS and UL
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