
Why Via Impedance Is Hard to Control
A trace impedance target does not automatically define the impedance of a via transition. A via is a three-dimensional discontinuity involving a plated barrel, pads, antipads, reference planes,…
PCB manufacturing & turnkey assembly · Shenzhen, China
FLJ PCBManufacturing your next ideaFLJ resources
PCB design and layout guides covering stackups, vias, material choices, fabrication checks and assembly handoff. Select a topic to review the design constraints and release information relevant to your board.
Showing 25–36 of 37 articles

A trace impedance target does not automatically define the impedance of a via transition. A via is a three-dimensional discontinuity involving a plated barrel, pads, antipads, reference planes,…

Abstract This paper explains the classification, material choice, technology trends, design rules, and processing standards for printed circuit boards (PCBs) used in communication products. It is for PCB…

HDI boards meet the needs of high density ICs and high density interconnect assembly. They push PCB manufacturing to a new level. HDI is one of the hottest…

Basic Process for Making HDI Boards with Blind and Buried Vias 1. Overview HDI stands for High Density Interconnect. It is a PCB technology that rose in the…

1. Core Principles of Stackup Design Overall, stackup design must follow two rules: Below are example stackups from two-layer boards up to eight-layer boards. 2. Stackup Schemes by…

In PCBs, many things can cause EMI. For example: radio frequency currents, common-mode voltages, ground loops, impedance mismatch, and magnetic flux. To control EMI, we need to learn…

Designing a High-Density Interconnect (HDI) PCB requires a deep understanding of both electrical needs and manufacturing limits. HDI technology allows for more components in a smaller space. This…

fr4 — definition and meaning fr4 is the code for the flame-retardant rating of a glass-fiber reinforced epoxy copper clad laminate. It means the resin must stop burning…

What is an Aluminum Substrate? An aluminum substrate is a metal-core copper-clad board with good heat dissipation. A typical single-sided board has three layers: a circuit layer (copper…

Introduction FPC stiffening does more than hold parts. It can also help with heat dissipation. But if you need to rework or repair the board, removing the stiffener…

Overview The consumer electronics industry depends a lot on device reliability. Simulation and testing are two tools that let designers make sure a product works well. Good design…

SMT has emerged as a cornerstone, enabling the production of compact, efficient, and high-performance electronic devices. For companies like Philifast electronics manufacturing, their SMT production line represents the…